Sondrel (Holdings) plc Tapeout: ASIC controller for Smartphone camera (8949A)
May 30 2023 - 2:00AM
UK Regulatory
TIDMSND
RNS Number : 8949A
Sondrel (Holdings) plc
30 May 2023
The information contained within this announcement is deemed by
the Company to constitute inside information as stipulated under
the UK Market Abuse Regulation
30th May 2023
Sondrel (Holdings) plc
("Sondrel", the "Company" and together with its subsidiaries the
"Group")
Successful Key Milestone Completion - Tapeout of an ASIC
controller for Smartphone camera
Sondrel (Holdings) plc (AIM: SND), the fabless semiconductor
business providing turnkey services in the design and delivery of
'application specific integrated circuits' ("ASICs") and 'system on
chips' ("SoCs") for leading global technology brands, is pleased to
announce that it has successfully taped out an ASIC design (the
"Project") for a controller of a smartphone camera.
With the design phase of the Project now finished and its
tapeout completed, the Company will progress with the new product
introduction and prototyping phases of the turnkey supply services
being provided to the customer by Sondrel, ahead of the product
being released to production thereafter.
The Project design contract was awarded to the Company in late
2021 and was fully funded by the Customer. Project production and
supply are expected to begin at the start of 2024.
Based on production volumes and product lifetime currently
projected by the Customer, revenues associated with the production
and supply of the ASIC could be worth in excess of US$50 million
over five years.
Tapeout signals the completion of the design phase of an ASIC
and the handover of all data to the silicon foundry which is
contracted to manufacture the ASIC. This tapeout data is used to
initiate the generation of photomasks by the foundry, which are
then used to produce prototype silicon wafers. These wafers are
then packaged and tested before delivery to the customer for
prototype assessment. Upon approval of the prototypes, further
samples undergo qualification and reliability testing before the
product is released to production.
Graham Curren, Chief Executive Officer of Sondrel,
commented:
"I am pleased to announce this new tapeout, our third since our
IPO in Q4 last year. Passing this key milestone underpins Sondrel's
position as a leading ASIC supplier for advanced designs. The
successful tapeout of this ASIC is a clear validation of Sondrel's
focussed business strategy, and our track record of innovation
excellence again delivering excellent results for our
customers.
"This complex design was completed in close cooperation with our
customer's engineering and product marketing teams, and will open
up new markets for our customer. We look forward to progressing
with the new product introduction and prototyping phases ahead of
the product entering production in 2024.
"Our focus on end markets that are aligned with strong and
enduring global technology megatrends means that we have a good
pipeline of design opportunities for 2023 and I look forward to
updating the market on these as the year progresses."
Ends
For further information:
Sondrel (Holdings) plc Via Buchanan
Graham Curren, CEO Tel: +44 (0) 20 7466
5000
Joe Lopez, CFO
Cenkos Securities plc Tel: +44 (0)20 7397
8900
Ben Jeynes / Katy Birkin / George Lawson
- Corporate Finance
Alex Pollen / Michael Johnson - Sales
Buchanan Communications Tel: +44 (0) 20 7466
5000
Chris Lane sondrel@buchanan.uk.com
Stephanie Whitmore
Jack Devoy
Abby Gilchrist
About Sondrel
Sondrel is a UK-based fabless semiconductor company specialising
in high end, complex digital Application Specific Integrated
Circuits (ASICs) and System on Chips (SOCs). It provides a full
turnkey service in the design, prototyping, testing, packaging and
production of ASICs and SoCs.
The Company is one of only a few companies capable of designing
and supplying the higher-spec chips built on the most advanced
semiconductor technologies, selling into a range of hyper growth
end markets such as high-performance computing, automotive,
artificial intelligence, VR/AR, video analytics, image processing,
mobile networking and data centres. Sondrel designs have enabled
products by leading technology brands including Apple (iPhone),
Sony (PlayStation), Meta's (Oculus), Samsung, Google and Sony
smartphones, JVC (prosumer camcorders), Tesla and Mercedes-Benz
cars.
Sondrel is well-established, with a 20-year track record of
successful delivery, supported by long standing ecosystem
partnerships including Arm, TSMC and Samsung. Headquartered in the
UK, Sondrel has a global presence with offices in UK, USA, China,
India and Morocco.
For more information please visit: www.ir.sondrel.com .
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END
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