Report of Foreign Issuer Pursuant to Rule 13a-16 or 15d-16 (6-k)
June 10 2021 - 4:16PM
Edgar (US Regulatory)
UNITED STATES SECURITIES
AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 6-K
REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
Report on Form 6-K dated June 10, 2021
Commission File Number: 1-13546
STMicroelectronics
N.V.
(Name of Registrant)
WTC Schiphol Airport
Schiphol Boulevard 265
1118 BH Schiphol Airport
The Netherlands
(Address of Principal Executive Offices)
Indicate by check mark whether the registrant
files or will file annual reports under cover of Form 20-F or Form 40-F:
Form 20-F x Form 40-F
o
Indicate by check mark if the registrant is
submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(1):
Yes o No x
Indicate by check mark if the registrant is
submitting the Form 6-K in paper as permitted by Regulation S-T Rule 101(b)(7):
Yes o No x
Indicate by check mark whether the registrant
by furnishing the information contained in this form is also thereby furnishing the information to the Commission pursuant to Rule 12g3-2(b) under
the Securities Exchange Act of 1934:
Yes o No x
If “Yes” is marked, indicate below
the file number assigned to the registrant in connection with Rule 12g3-2(b): 82- __________
Enclosure: A
press release dated June 9, 2021 announcing a change in the leadership team of STMicroelectronics N.V.
PR N°C3008C
STMicroelectronics Announces Change in Leadership
Team
Geneva, June 9, 2021 - STMicroelectronics (NYSE:STM), a global
semiconductor leader serving customers across the spectrum of electronics applications, announced today that Benedetto Vigna, President
of the Analog, MEMS and Sensors Group, has informed the company that he will step down from his position on August 31, 2021 to become
CEO of another company.
Jean-Marc Chery, ST’s President & CEO, commented: “Benedetto
started his career in ST 26 years ago. He established ST’s leadership in MEMS sensors and then in a wider range of sensors and actuators,
as well as leading the company’s efforts in Analog and, more recently, Optical Sensing Solutions. On behalf of ST’s Executive
Committee, and all of our management and employees, I thank Benedetto for his contribution to the company’s success and wish him
all the best for his future endeavors. We will work together during the next weeks to ensure a smooth transition”.
Benedetto Vigna, President, Analog, MEMS and Sensors Group, said: “I
spent half of my life working with a formidable multicultural team to whom I am, and I will always be, grateful. Without such a great
team, it would have been impossible to grow the AMS business at the levels of today. I want to thank all the ST family for what they taught
me, and for the time we devoted together to transform our dreams into real business”.
About STMicroelectronics
At ST, we are 46,000 creators and makers of semiconductor technologies
mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An independent device manufacturer, we work
with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their
challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient
power and energy management, and the wide-scale deployment of the Internet of Things and 5G technology. Further information can be found
at www.st.com.
For further information, please contact:
INVESTOR RELATIONS:
Céline Berthier
Group VP, Investor Relations
Tel : +41.22.929.58.12
celine.berthier@st.com
MEDIA RELATIONS:
Alexis Breton
Corporate External Communications
Tel: + 33.6.59.16.79.08
alexis.breton@st.com
SIGNATURES
Pursuant to the requirements
of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto
duly authorized.
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STMicroelectronics N.V.
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Date:
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June 10, 2021
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By:
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/s/ Lorenzo
Grandi
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Name:
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Lorenzo Grandi
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Title:
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Chief Financial Officer
President, Finance, Infrastructure and Services
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