Rambus to Showcase New R+ DDR4 Server Memory Chipset at The 2015 Intel Developer Forum (IDF)
August 18 2015 - 8:00AM
Business Wire
Rambus, Inc. (NASDAQ:RMBS):
Who:
Rambus, Inc. (NASDAQ: RMBS)
Where: IDF 2015 Moscone Convention Center San Francisco, CA
Rambus Gold Sponsor booth #810 and DDR4
Memory Community booth #952
When: August 18 – 20, 2015
At the Intel Developer Form, Intel’s premier event for
developers and industry leaders, Rambus will demonstrate its R+
family of enhanced, JEDEC-compliant memory interface and serial
link PHYs and chips designed to deliver advanced features and
functionality. This will be the first public showcase of the newly
announced R+ DDR4 Server DIMM chipset, RB26, which delivers
superior performance and operating margin, along with advanced
debug and serviceability. For additional details, visit
www.rambus.com/dimmchipset.
Rambus Speaking Engagement:
Title: Future Challenges for DDR4 and Beyond in the Data
Center and Enterprise SystemsDate: Wednesday, August 19,
2015Time: 2:30PM – 3:30PMTopic: Big data and
escalating demands on IT are creating an explosion of data and
real-time processing requirements that are fueling the need for
increased memory speed and capacity across data centers and
enterprise systems. As the industry evolves to meet these needs,
there are key challenges in DDR4 memory design that must be
addressed. This session will discuss the future fundamental
challenges in DDR4 and post-DDR4 and critical design aspects,
including signal integrity, channel characteristics and subsystem
architecture that can enable systems to achieve maximum data rates
and capacity cost-effectively.Speaker: Ely Tsern, VP, Chief
Technologist, Memory and Interfaces Division, Rambus
Inc.Location: Level 2, Room 2007
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blog: rambusblog.comTwitter: @rambusincLinkedIn: www.linkedin.com/company/rambusFacebook: www.facebook.com/RambusInc
About Rambus Memory and Interfaces Division (MID)
The Rambus Memory and Interfaces Division develops products and
services that solve the power, performance, and capacity challenges
of the mobile, connected device, and cloud computing markets.
Rambus enhanced standards-compatible and custom memory and serial
link solutions include chips, architectures, memory and
chip-to-chip interfaces, DRAM, IP validation tools, and system and
IC design services. Developed through our system-aware design
methodology, Rambus products deliver improved time-to-market and
first-time-right quality.
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products,
spanning memory and interfaces to security, smart sensors and
lighting. Our chips, customizable IP cores, architecture licenses,
tools, services, training and innovations improve the competitive
advantage of our customers. We collaborate with the industry,
partnering with leading ASIC and SoC designers, foundries, IP
developers, EDA companies and validation labs. Our products are
integrated into tens of billions of devices and systems, powering
and securing diverse applications, including Big Data, Internet of
Things (IoT), mobile, consumer and media platforms. At Rambus, we
are makers of better. For more information, visit rambus.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20150818005431/en/
For RambusSimone Souza,
408-462-8859ssouza@rambus.comorFrom Racepoint GlobalHilary
Costa, 415-694-6705hcosta@racepointglobal.com
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