Sapphire Rapids with built-in HBM raises
performance bar; Intel’s GPU, networking and storage capabilities
enhance HPC toolbox.
NEWS HIGHLIGHTS
- Latest 3rd Gen Intel® Xeon® Scalable processors will power the
next generation of supercomputers and high-performance computing
systems.
- The next generation of Intel Xeon Scalable processors
(code-named “Sapphire Rapids”) will integrate High Bandwidth Memory
(HBM).
- Intel’s Xe-HPC-based Ponte Vecchio GPU has powered-on, is in
system validation, and will include OAM form factor and
subsystems.
- Intel announces High Performance Networking (HPN) with
Ethernet, extending Intel Ethernet into HPC applications.
- Intel introduces commercial support for DAOS (distributed
application object storage).
At the 2021 International Supercomputing Conference (ISC) Intel
is showcasing how the company is extending its lead in high
performance computing (HPC) with a range of technology disclosures,
partnerships and customer adoptions. Intel® processors are the most
widely deployed compute architecture in the world’s supercomputers,
enabling global medical discoveries and scientific breakthroughs.
Intel is announcing advances in its Xeon processor for HPC and AI
as well as innovations in memory, software, exascale-class storage,
and networking technologies for a range of HPC use cases.
More: Intel Data Center News | Intel’s HPC GM Trish
Damkroger Keynotes 2021 ISC (Keynote Replay) | "Accelerating the
Possibilities with HPC" (Keynote Presentation)
“To maximize HPC performance we must leverage all the computer
resources and technology advancements available to us,” said Trish
Damkroger, vice president and general manager of High Performance
Computing at Intel. “Intel is the driving force behind the
industry’s move toward exascale computing, and the advancements
we’re delivering with our CPUs, XPUs, oneAPI Toolkits,
exascale-class DAOS storage, and high-speed networking are pushing
us closer toward that realization.”
Advancing HPC Performance Leadership
Earlier this year, Intel extended its leadership position in HPC
with the launch of 3rd Gen Intel Xeon Scalable processors. The
latest processor delivers up to 53% higher performance across a
range of HPC workloads, including life sciences, financial services
and manufacturing, as compared to the previous generation
processor.
Compared to its closest x86 competitor, the 3rd Gen Intel Xeon
Scalable processor delivers better performance across a range of
popular HPC workloads. For example, when comparing a Xeon Scalable
8358 processor to an AMD EPYC 7543 processor, NAMD performs 62%
better, LAMMPS performs 57% better, RELION performs 68% better, and
Binomial Options performs 37% better. In addition, Monte Carlo
simulations run more than two times faster, allowing financial
firms to achieve pricing results in half the time. Xeon Scalable
8380 processors also outperform AMD EPYC 7763 processors on key AI
workloads, with 50% better performance across 20 common benchmarks.
HPC labs, supercomputing centers, universities and original
equipment manufacturers who have adopted Intel’s latest compute
platform include Dell Technologies, HPE, Korea Meteorological
Administration, Lenovo, Max Planck Computing and Data Facility,
Oracle, Osaka University and the University of Tokyo.
Integration of High Bandwidth Memory within Next-Gen Intel
Xeon Scalable Processors
Workloads such as modeling and simulation (e.g., computational
fluid dynamics, climate and weather forecasting, quantum
chromodynamics), artificial intelligence (e.g., deep learning
training and inferencing), analytics (e.g., big data analytics),
in-memory databases, storage and others power humanity’s scientific
breakthroughs. The next-generation of Intel Xeon Scalable
processors (code-named “Sapphire Rapids) will offer integrated High
Bandwidth Memory (HBM), providing a dramatic boost in memory
bandwidth and a significant performance improvement for HPC
applications that operate memory bandwidth-sensitive workloads.
Users can power through workloads using just High Bandwidth Memory
or in combination with DDR5.
Customer momentum is strong for Sapphire Rapids processors with
integrated HBM, with early leading wins such as the U.S. Department
of Energy’s Aurora supercomputer at Argonne National Laboratory and
the Crossroads supercomputer at Los Alamos National Laboratory.
“Achieving results at exascale requires the rapid access and
processing of massive amounts of data,” said Rick Stevens,
associate laboratory director of Computing, Environment and Life
Sciences at Argonne National Laboratory. “Integrating
high-bandwidth memory into Intel Xeon Scalable processors will
significantly boost Aurora’s memory bandwidth and enable us to
leverage the power of artificial intelligence and data analytics to
perform advanced simulations and 3D modeling.”
Charlie Nakhleh, associate laboratory director for Weapons
Physics at Los Alamos National Laboratory, said: “The Crossroads
supercomputer at Los Alamos National Labs is designed to advance
the study of complex physical systems for science and national
security. Intel’s next-generation Xeon processor Sapphire Rapids,
coupled with High Bandwidth Memory, will significantly improve the
performance of memory-intensive workloads in our Crossroads system.
The [Sapphire Rapids with HBM] product accelerates the largest
complex physics and engineering calculations, enabling us to
complete major research and development responsibilities in global
security, energy technologies and economic competitiveness.”
The Sapphire Rapids-based platform will provide unique
capabilities to accelerate HPC, including increased I/O bandwidth
with PCI express 5.0 (compared to PCI express 4.0) and Compute
Express Link (CXL) 1.1 support, enabling advanced use cases across
compute, networking and storage.
In addition to memory and I/O advancements, Sapphire Rapids is
optimized for HPC and artificial intelligence (AI) workloads, with
a new built-in AI acceleration engine called Intel® Advanced Matrix
Extensions (AMX). Intel AMX is designed to deliver significant
performance increase for deep learning inference and training.
Customers already working with Sapphire Rapids include CINECA,
Leibniz Supercomputing Centre (LRZ) and Argonne National Lab, as
well as the Crossroads system teams at Los Alamos National Lab and
Sandia National Lab.
Intel Xe-HPC GPU (Ponte Vecchio) Powered On
Earlier this year, Intel powered on its Xe-HPC-based GPU
(code-named “Ponte Vecchio”) and is in the process of system
validation. Ponte Vecchio is an Xe architecture-based GPU optimized
for HPC and AI workloads. It will leverage Intel’s Foveros 3D
packaging technology to integrate multiple IPs in-package,
including HBM memory and other intellectual property. The GPU is
architected with compute, memory, and fabric to meet the evolving
needs of the world’s most advanced supercomputers, like Aurora.
Ponte Vecchio will be available in an OCP Accelerator Module (OAM)
form factor and subsystems, serving the scale-up and scale-out
capabilities required for HPC applications.
Extending Intel Ethernet For HPC
At ISC 2021, Intel is also announcing its new High Performance
Networking with Ethernet (HPN) solution, which extends Ethernet
technology capabilities for smaller clusters in the HPC segment by
using standard Intel Ethernet 800 Series Network Adapters and
Controllers, switches based on Intel® Tofino™ P4-programmable
Ethernet switch ASICs and the Intel® Ethernet Fabric suite
software. HPN enables application performance comparable to
InfiniBand at a lower cost while taking advantage of the ease of
use offered by Ethernet.
Commercial Support for DAOS
Intel is introducing commercial support for DAOS (distributed
application object storage), an open-source software-defined object
store built to optimize data exchange across Intel HPC
architectures. DAOS is at the foundation of the Intel® Exascale
storage stack, previously announced by Argonne National Laboratory,
and is being used by Intel customers such as LRZ and JINR (Joint
Institute for Nuclear Research).
DAOS support is now available to partners as an L3 support
offering, which enables partners to provide a complete turnkey
storage solution by combining it with their services. In addition
to Intel’s own data center building blocks, early partners for this
new commercial support includes HPE, Lenovo, Supermicro,
Brightskies, Croit, Nettrix, Quanta, and RSC Group.
More information about Intel’s participation at ISC 2021,
including a full list of talks and demos, can be found at
https://hpcevents.intel.com.
About Intel
Intel (Nasdaq: INTC) is an industry leader, creating
world-changing technology that enables global progress and enriches
lives. Inspired by Moore’s Law, we continuously work to advance the
design and manufacturing of semiconductors to help address our
customers’ greatest challenges. By embedding intelligence in the
cloud, network, edge and every kind of computing device, we unleash
the potential of data to transform business and society for the
better. To learn more about Intel’s innovations, go to
newsroom.intel.com and intel.com.
For performance claims, see [43, 47, 108] at
www.intel.com/3gen-xeon-config. Results may vary.
© Intel Corporation. Intel, the Intel logo and other Intel marks
are trademarks of Intel Corporation or its subsidiaries. Other
names and brands may be claimed as the property of others.
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Tim Schulte 1-408-609-6845 tim.schulte@intel.com
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