ADE Rolls Out its Next-Generation Wafer Inspection Tool; WaferXam System Delivers High Sensitivity and Superior Defect Classific
June 29 2005 - 12:46PM
Business Wire
ADE Corporation (Nasdaq: ADEX) today announced the WaferXam(TM),
ADE's latest-generation nano-particle inspection and defect
classification tool. This advanced darkfield laser scanning system
is used for inspection of prime silicon substrates at semiconductor
incoming quality control and silicon wafer suppliers, where
advanced design rules require more real-time measurement and
inspection for cost-effective process control. The WaferXam tool
features a new system design, utilizing enhancements to ADE's
patented Angle Resolved Scatter architecture, for highly improved
defect detection sensitivity and classification performance.
Positioned to serve the 45nm process development market and exceed
the requirements for 65nm wafer production, the flexible WaferXam
platform offers a high-sensitivity mode with 33nm defect detection
to meet tightening customer specifications, with production
throughputs in excess of fifty 300mm wafers per hour. New
classification algorithms, combined with increased defect
sensitivity, result in more yield-killing defects detected and
binned in real time for higher yields and faster process feedback.
"Device yield starts with the bare silicon wafer," stated Paul
Hofemann, ADE's vice president of marketing and business
development. "At the 65nm node and below, minute substrate flaws,
once considered trivial, have become defects that impact device
yield. These new defects must be captured with enough signal
discrimination to be sorted real-time into useful classification
bins that expedite root cause corrective action. ADE's proven,
superior defect inspection technology is providing the critical
data for fab managers and engineers to better manage their incoming
silicon to optimize their device yield performance." "Effective
process control requires high confidence, real-time defect
classification," added Hofemann. "ADE's WaferXam system uses a
unique darkfield angular resolved scatter technology that leverages
the advanced optics architecture for superior defect detection and
classification, without costly and time-consuming manual review.
The process engineer working on advanced 45nm R&D or 65nm
production now has the ability to detect and classify in real-time
the new nanoscale yield-limiting defects, while avoiding benign
defect distractions." ADE's WaferXam system, for 300mm and advanced
200mm wafer production, features non-contaminating edge grip
handling and full factory automation wafer production. WaferXam
tools integrate seamlessly with ADE's new FabVision(TM) fab-wide
data management and yield improvement system. ADE will be
highlighting the performance benefits of the new WaferXam and
FabVision systems, as well as its full line of semiconductor wafer
inspection, metrology tools and yield management systems, at
Semicon West, July 12-14, Moscone Center, South Hall, Booth 1302,
in San Francisco. About ADE Corporation ADE Corporation is a
leading supplier of production process control and quality
certification systems for the semiconductor device, silicon wafer,
magnetic data storage, and optics manufacturing industries. The
Company's systems measure and inspect a variety of bare silicon and
patterned wafers for dimensional parameters, surface defects,
particles, and process non-uniformities, analyzing and reporting
product quality at critical manufacturing process steps for yield
enhancement. To learn more about ADE, visit the Company's Website
at http://www.ade.com.
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