Amkor Delivers Industry’s First Package Assembly Design Kit to Support Mentor’s High-Density Advanced Packaging Tools
July 18 2018 - 10:00AM
Business Wire
Amkor SmartPackage™ Speeds Accurate Design
and Verification of Heterogeneous Integration Package
Solutions
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of
outsourced semiconductor packaging and test (OSAT) services, today
announced it has partnered with Mentor to release Amkor’s
SmartPackage™ Package Assembly Design Kit (PADK), the first in the
industry to support Mentor’s High-Density Advanced Packaging (HDAP)
design process and tools. Amkor’s award-winning High-Density Fan
Out (HDFO) process can now be used in conjunction with Mentor’s
software to deliver early, rapid and accurate verification results
of advanced packages required for Internet-of-Things, automotive,
high-speed communications, computing and artificial intelligence
applications.
“Amkor leads the way in HDFO technology for OSAT companies, and
with the rise of complex ICs with multi-die packages, we
prioritized the creation of Mentor-based PADKs to significantly
reduce cycle time,” said Ron Huemoeller, corporate vice president,
Research & Development, Amkor Technology. “Since the Mentor
flow includes Calibre, the golden sign-off tool for the fabless
ecosystem, our customers can easily close any physical verification
issued for their entire solution.”
The complex and compact design of devices for today’s smart
applications is driving the need for sophisticated packaging
techniques such as heterogeneous integration and Advanced
System-in-Package. These solutions combine one or more ICs of
different functionality with increased I/O and circuit density in
2.5D (side-by-side) and 3D constructions. With Amkor’s SmartPackage
PADK and Mentor’s proven HDAP tool flow, mutual customers of Amkor
and Mentor have the ability to create and review multiple
assemblies and LVS (layout vs. schematic), connectivity, geometry
and component spacing scenarios using Amkor’s HDFO process. The
graphic environment features robust data and is straightforward to
use before and during the implementation of physical design,
resulting in faster sign-off and fewer verification cycles.
“Amkor was the first OSAT company to join the Mentor OSAT
Alliance program, and now the first to build and make available a
PADK for its customers,” said AJ Incorvaia, vice president and
general manager of Mentor’s BSD division. “By providing a fully
validated PADK for Amkor’s HDFO process for Mentor’s proven HDAP
tool flow, customers can more easily transition from classic chip
design to 2.5 and 3D solutions.”
The OSAT Alliance program helps promote the adoption,
implementation and growth of HDAP throughout the semiconductor
ecosystem and design chain, enabling system and fabless
semiconductor companies to have a friction-free path for emerging
packaging technologies.
About Amkor Technology, Inc.
Amkor Technology, Inc. is one of the world’s largest providers
of outsourced semiconductor packaging and test services. Founded in
1968, Amkor pioneered the outsourcing of IC packaging and test, and
is now a strategic manufacturing partner for more than 250 of the
world’s leading semiconductor companies, foundries and electronics
OEMs. Amkor’s operating base includes 10 million square feet of
floor space with production facilities, product development
centers, and sales and support offices located in key electronics
manufacturing regions in Asia, Europe and the U.S. For more
information, visit www.amkor.com.
About Mentor Graphics
Mentor Graphics Corporation, a Siemens business, is a world
leader in electronic hardware and software design solutions,
providing products, consulting services, and award-winning support
for the world's most successful electronic, semiconductor, and
systems companies. For more information, visit www.mentor.com.
Keywords
WaferLogic
High Density Fan Out
HDFO
Package Assembly Design Kit
PADK
Design Tools
OSAT
Semiconductor packaging
Advanced IC packaging
Assembly and test
Mentor
Social Media: @amkortechnology
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Communications480-786-7653
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