Enflame Technology Selects Rambus HBM2 Memory Subsystem Solution For Next-Generation AI Training Chip
December 11 2019 - 5:00PM
Business Wire
Highlights:
- Comprehensive HBM Gen 2 (HBM2) memory subsystem solution
consisting of PHY and digital controller delivers high bandwidth
and low latency with minimal form factor and power envelope
- HBM2 IP provides 2Tb/s of memory bandwidth, making it the
perfect fit for Enflame Technology’s cloud AI training
products
- Broad suite of supporting services simplifies 2.5D integration
and design with subsystem interoperability, silicon interposer and
package reference designs, and signal and power integrity (SI/PI)
analysis
Rambus Inc. (NASDAQ: RMBS) a premier silicon IP and chip
provider making data faster and safer, today announced that Enflame
(Suiyuan) Technology has selected Rambus HBM2 PHY and Memory
Controller IP for its next-generation AI training chip. Rambus
memory interface IP enables the development of high-performance,
next-generation hardware for leading-edge AI applications.
“Artificial intelligence training requires far greater memory
bandwidth than standard compute applications. Rambus’ proven HBM2
memory subsystem IP delivers the ultra-high bandwidth performance
our AI chips need,” said Arthur Zhang, COO of Enflame Technology.
“Using Rambus interface IP cores, we are revolutionizing what’s
possible in AI technology.”
Optimized for low-latency and high-bandwidth memory
applications, the Rambus HBM2 interface solution delivers maximum
performance and flexibility in minimal form factor and power
envelope. The comprehensive HBM2 subsystem solution of PHY and
memory controller provides 2Tb/s of bandwidth, making it the
perfect fit for Enflame Technology’s cloud AI training needs.
Complementing this interface IP, Rambus provides silicon interposer
and package reference designs, and supports signal and power
integrity (SI/PI) analysis.
“Enflame Technology’s repeat choice of Rambus showcases our HBM2
PHY and memory controller IP as the ideal solution for complex
neural network-based AI and machine learning chips,” said Hemant
Dhulla, vice president and general manager of IP Cores at Rambus.
“Our HBM portfolio of solutions already in volume production
deliver the memory performance needed at the frontier of AI
computing.”
For more information on Rambus HBM2 PHY offerings, please visit
https://www.rambus.com/interface-ip/ddrn-phys/hbm/. Find out more
details on Rambus Memory Controllers at
https://www.rambus.com/interface-ip/controllers/memory-controllers/.
Follow Rambus:
Company website: rambus.com Rambus blog: rambus.com/blog
Twitter: @rambusinc LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Inc.
Rambus is a premier silicon IP and chip provider that makes data
faster and safer. With 30 years of innovation, we continue to
develop the foundational technology for all modern computing
systems. Leveraging our semiconductor expertise, Rambus solutions
speed performance, expand capacity and improve security for today’s
most demanding applications. From data center and edge to
artificial intelligence and automotive, our interface and security
IP, and memory interface chips enable SoC and system designers to
deliver their vision of the future. For more information, visit
rambus.com.
Source: Rambus Inc.
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version on businesswire.com: https://www.businesswire.com/news/home/20191211005750/en/
Cori Pasinetti Rambus Corporate Communications t: (408) 462-8306
cpasinetti@rambus.com
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