Mattson Technology Equips Trecenti Technologies' 300 mm Fab
December 15 2003 - 8:30AM
PR Newswire (US)
Mattson Technology Equips Trecenti Technologies' 300 mm Fab Aspen
III 300 mm Strip System Used for Advanced 130 nm Logic Devices
FREMONT, Calif., Dec. 15 /PRNewswire-FirstCall/ -- Mattson
Technology, Inc. , a leading supplier of advanced process equipment
used to manufacture semiconductors, today announced that it has
installed its 300 mm Aspen III ICP Strip at Trecenti Technologies'
300 mm chip manufacturing facility in Hitachinaka, Japan, where
several Aspen III systems are already installed. The Aspen III
Strip system is being used for the production of Trecenti's most
advanced 130 nm logic devices. "Our decision to continue selecting
Mattson Technology underscores our confidence in the advanced
technology and production worthiness of its systems," said Dr.
Atsuyoshi Koike, president and chief executive officer of Trecenti
Technologies. "The Aspen III ICP Strip 300 mm system continues to
meet our production requirements for resist strip and residue
removal in the back-end-of-line processing and provides the
performance and productivity we need to deliver leading-edge
devices to our customers." "Trecenti is one of the premier 300 mm
manufacturing fabs in the global semiconductor community," said
Mike Morita, Mattson Technology's vice president of U.S., Europe
and Japan operations. "Having Trecenti again choose our Aspen III
Strip system for its 130 nm device production demonstrates the
success of the system in high-volume, cost-critical manufacturing
and reinforces our 300 mm market leadership. We look forward to
continue supporting our customers in realizing the economic
benefits of 300 mm production." About the Aspen III Strip The Aspen
III Strip system features Mattson Technology's proprietary
inductively coupled plasma (ICP) source that effectively strips the
resist and residue, reducing the need for post-strip chemical
processing. The system achieves excellent results for high-dose
implant strip, residue removal and surface cleaning for advanced
applications, including low-k and oxygen and non-oxygen-based
processes. The Aspen III Strip system offers advanced technology on
a high-throughput platform, providing process performance and low
cost of ownership advantages to chipmakers for advanced device
manufacturing. About Mattson Technology, Inc. Mattson Technology,
Inc. is a leading supplier of semiconductor wafer processing
equipment used in "front-end" fabrication of integrated circuits.
The company is a market leader in dry strip and RTP equipment, and
its products combine advanced process technology on
high-productivity platforms backed by industry-leading support.
Since beginning operations in 1989, the company's core vision has
been to help bring technology leadership and productivity gains to
semiconductor manufacturers worldwide. Headquartered in Fremont,
Calif., the company maintains sales and support centers throughout
the United States, Europe and Asia. For more information, please
contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont,
Calif. 94538. Telephone: 800-MATTSON/510-657-5900. Fax:
510-492-5911. Internet: http://www.mattson.com/. Mattson Technology
Contact Lauren Vu PR Manager Mattson Technology, Inc. tel
510-492-6518 fax 510-492-2800 DATASOURCE: Mattson Technology, Inc.
CONTACT: Lauren Vu, PR Manager of Mattson Technology, Inc.,
+1-510-492-6518, or fax, +1-510-492-2800, or Web site:
http://www.mattson.com/
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