ROCKVILLE, Md., Aug. 14,
2023 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the
leading licensor of wireless connectivity and smart sensing
technologies and custom SoC solutions, today announced that it has
joined the Samsung Advanced Foundry Ecosystem (SAFE™) to streamline
chip design and accelerate time-to-market for CEVA licensees using
Samsung's advanced foundry processes.
Samsung Foundry is offering competitive processes, design
technologies, IP, and high-volume manufacturing capability for
customers. The full suite of advanced process technologies includes
28FD-SOI, 14/10/8/5/4nm FinFet, and 3nm GAA with EUV technology
from 5nm. CEVA's IPs are already in production at Samsung's
foundries in multiple process technologies for a wide range of end
markets, including 5G infrastructure, automotive, surveillance and
consumer electronics. The collaboration further aims to reduce
supply chain risks by expanding the advanced manufacturing process
options available to CEVA customers, certifying CEVA's
industry-leading wireless connectivity and sensing AI IPs for
Samsung's foundry offerings to enable seamless integration into
chip and chiplet designs.
"Our collaboration with Samsung Foundry through the SAFE™
program brings together a world-leading foundry service and one of
the most widely used silicon IP suppliers, to help ensure faster
silicon success for our customers in the AI era," said Moshe Sheier, Vice President of Marketing at
CEVA. "Our IPs for 5G, Wi-Fi, DSP and generative AI at the edge are
experiencing exceptional demand globally, and through this
partnership we can help drive the proliferation of intelligent
connected devices that leverage our industry-leading power
efficiency and performance capabilities and Samsung's
state-of-the-art foundry process technologies."
The Samsung SAFE™ IP Partner Program is the key part of Samsung
Advanced Foundry Ecosystem (SAFE™) aiming to create a strong
ecosystem between Samsung Foundry and IP partners, to provide
diverse IP portfolios in various application fields, based on
customer's requirements. The portfolio consists of dedicated as
well as foundation IPs designed for performance-intensive
applications. For more information, visit
https://semiconductor.samsung.com/us/foundry/safe/ip/
CEVA's industry-leading wireless connectivity and sensing AI IPs
power billions of devices around the world, spanning a diverse
range of end markets, including, mobile, consumer IoT, PCs,
infrastructure and industrial. For more information, visit
https://www.ceva-dsp.com/products-catalog/.
About CEVA, Inc.
CEVA is the leading licensor of
wireless connectivity and smart sensing technologies and custom SoC
solutions for a smarter, safer, connected world. We provide Digital
Signal Processors, AI engines, wireless platforms, cryptography
cores and complementary embedded software for sensor fusion, image
enhancement, computer vision, spatial audio, voice input and
artificial intelligence. These technologies are offered in
combination with our Intrinsix IP integration services, helping our
customers address their most complex and time-critical integrated
circuit design projects. Leveraging our technologies and chip
design skills, many of the world's leading semiconductors, system
companies and OEMs create power-efficient, intelligent, secure and
connected devices for a range of end markets, including mobile,
consumer, automotive, robotics, industrial, aerospace & defense
and IoT.
Our DSP-based solutions include platforms for 5G baseband
processing in mobile, IoT and infrastructure, advanced imaging and
computer vision for any camera-enabled device, audio/voice/speech
and ultra-low-power always-on/sensing applications for multiple IoT
markets. For motion sensing solutions, our Hillcrest Labs sensor processing technologies
provide a broad range of sensor fusion software and inertial
measurement unit ("IMU") solutions for markets including hearables,
wearables, AR/VR, PC, robotics, remote controls and IoT. For
wireless IoT, our platforms for Bluetooth connectivity (low energy
and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB),
NB-IoT and GNSS are the most broadly licensed connectivity
platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube,
Facebook,, LinkedIn and Instagram.
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SOURCE CEVA, Inc.