At SC19, the premier annual event for supercomputing, AMD
(NASDAQ: AMD) is extending its performance lead in high-performance
computing (HPC) with a range of new customer wins in top research
systems worldwide, new platforms supporting AMD EPYC™ processors
and Radeon Instinct™ accelerators and the newly announced ROCm 3.0,
bringing support for new compilers and HPC applications.
“AMD enters SC19 as the processor provider for the upcoming
Frontier supercomputer, expected to be the highest performance
supercomputer in the world when it is delivered in 2021,” said Mark
Papermaster, executive vice president and chief technology officer,
AMD. “Show attendees can spend time with the same foundational AMD
technologies that will go into that exascale-class system this
week. From high performance AMD EPYC CPUs and Radeon Instinct GPUs
working together across high-speed interconnects, to our open
software ecosystem, all delivered by the biggest names in
supercomputing, it’s all here at SC19.”
At SC19, Papermaster will be on a panel along with CTOs from
Cray, CERN and Xilinx to discuss the unique innovations in exascale
systems and beyond, including new technical breakthroughs across
hardware, software and programming tools.
New Amazon EC2 Compute-Optimized Instances to Use 2nd
Gen AMD EPYC Amazon Web Services (AWS) is expanding its
use of AMD EPYC processors, announcing the upcoming launch of two
new Amazon Elastic Compute Cloud (Amazon EC2) compute-optimized
instances. These instances, C5a and C5ad, will be powered by custom
2nd Gen AMD EPYC processors, running at frequencies up to 3.3Ghz.
C5a and C5ad will come in 8 virtualized sizes with up to 96 vCPUs
which will provide additional choices to help customers optimize
both cost and performance for a variety of compute intensive
workloads, including batch processing, distributed analytics, and
web applications. Both instances will be available in bare metal
variants which will enable customers to run applications that
benefit from direct access to the processor and memory resources of
the underlying server. These instances will have 192 logical
processors on 96 physical cores, which will be twice the largest
instance size offered in the EC2 compute-optimized instance family.
The C5a and C5ad bare metal instance will be able to utilize 100
Gbps network bandwidth and will be compatible with Elastic Fabric
Adapter, enabling customers to scale up High Performance Computing
and other large compute intensive workloads. The new instances will
be available soon across multiple AWS regions.
AMD Powers Supercomputers to New Levels and EPYC Joins
TOP500HPC organizations are continuing to adopt the 2nd
Gen AMD EPYC processor and Radeon Instinct accelerators for more
powerful and efficient supercomputing systems. The 2nd Gen EPYC
processors provide twice the manufacturing application performancei
and up to 60% faster Life Sciences simulations than competing
solutionsiiiii, while the Radeon Instinct GPU accelerator provides
up to 6.6 peak theoretical TFLOPS Double Precision performance for
HPC workloads. Both products support PCIe® 4.0 enabling
high-bandwidth interconnect for faster compute across heterogenous
systems.
The latest customers deploying AMD processors and accelerators
include:
- Atos, a global leader in digital transformation, is supplying
two BullSequana XH2000 supercomputers based on 2nd Gen EPYC to
Météo-France for operational weather forecasting and research in
atmospheric, ocean and climate science.
- Atos and the French national high-performance computing
organization, GENCI, announced that the latest extension of its
Joliot-Curie supercomputer, located and administered by the CEA
teams at its TGCC (Very Large Computing Centre), and based on Atos’
BullSequana XH2000 solution and 2nd Gen EPYC is now
operational.
- The extension of the Joliot-Curie supercomputer joined the 54th
edition of the TOP500, making it the first AMD EPYC 7H12 64-core
280Wiv equipped supercomputer in the global ranking.
- Cray, a Hewlett Packard Enterprise company, recently announced
two new supercomputers equipped with the 2nd Gen AMD EPYC
processors and based on the Shasta™ supercomputer architecture,
ARCHER2 and Vulcan.
- Dell Technologies is supplying the San Diego Supercomputer
Center and its Expanse supercomputer with Dell EMC PowerEdge
servers and 2nd Gen EPYC Processors.
- ETH Zurich is using AMD EPYC 7742 processors in its Euler VI
system.
- NEC is supplying the German weather forecasting service,
Deutscher Wetterdienst, a system using 2nd Gen EPYC processors in
conjunction with NEC SX-Aurora TSUBASA vector engines.
“We chose the AMD EPYC 7742 because the processor not only
provided broad support for most common software applications our
researchers use, but it provides the raw performance, impressive
memory and I/O bandwidth and most importantly the price/performance
that is critical to meeting the demands of these researchers,” said
Christian Bolliger, scientific IT services, ETH Zurich. “With the
Euler VI system using 2nd Gen AMD EPYC processors, our users now
have access to a system that will provide them the capabilities
needed to advance their research.”
Bringing Supercomputing to the Cloud with AMD
EPYCThe HPC industry is evolving to support new workloads,
greater demands for performance and most importantly, easier access
for long term or temporary use. This is being done through the
Cloud, which for the first time can provide users with the same
levels of performance, at lower use costs, compared to what they
can deploy on-premise.
Microsoft Azure announced previously unobtainable levels of
performance for computational fluid dynamics (CFD) using an Azure
HB cloud instance running on an 1st Gen AMD EPYC-processor based
system.
Now, Azure is pushing the boundaries of HPC in the cloud even
further with the preview of Azure HBv2 virtual machines for
high-performance computing. Based on the AMD EPYC 7742 processor,
these virtual machines provide customers with access to
supercomputer performance, supporting 200Gbps HDR InfiniBand, and
up to 80,000 cores for a single job, in the ease and simplicity
through the Cloud.
AMD Introduces ROCm 3.0Community support for
the pre-exascale software ecosystem continues to grow. This
ecosystem is built on ROCm, the foundational open source components
for GPU compute provided by AMD. The ROCm development cycle
features monthly releases offering developers a regular cadence of
continuous improvements and updates to compilers, libraries,
profilers, debuggers and system management tools. Major development
milestones featured at SC19 include:
- Introduction of ROCm 3.0 with new innovations to support
HIP-clang – a compiler built upon LLVM, improved CUDA conversion
capability with hipify-clang, library optimizations for both HPC
and ML.
- ROCm upstream integration into leading TensorFlow and PyTorch
machine learning frameworks for applications like reinforcement
learning, autonomous driving, and image and video detection.
- Expanded acceleration support for HPC programing models and
applications like OpenMP programing, LAMMPS, and
NAMD.
- New support for system and workload deployment tools like
Kubernetes, Singularity, SLURM, TAU and others.
A Growing Hardware EcosystemAs HPC systems are
asked to support more demanding workloads, the need for
heterogenous compute powered by CPUs and accelerators is critical
for modern HPC systems. AMD partners are creating platforms that
support this demand, as well as traditional CPU only computing:
- GIGABYTE announced four new G-Series GPU servers that support
2nd Gen AMD EPYC processors, the G292-Z22, G292-Z42, G482-Z50 and
G482-Z51. The G482-Z51 can support up to eight PCIe 4.0 GPU cards,
giving customers great “AMD + AMD” options for a range of
accelerated computing workloads.
- The world-record shattering HPE ProLiant DL325 Gen10 and DL385
Gen10 servers are joined by new Gen10 Plus models significantly
enhancing performance and efficiency for vital workloads like
virtualization, HPC and Big Data with up to 64 processor cores,
3200 MT/s memory for 9 percent faster memory performance, 2X
greater I/O bandwidth with PCIe 4.0 support and 2.4X greater
storage capacity versus previous generations.
- With the new Penguin Altus® XE4218GT, supporting up to 8 GPUs,
Penguin customers have an “AMD + AMD” solution that uses the PCIe
4.0 support in the 2nd Gen EPYC and Radeon Instinct MI50 to power
machine learning, big data analytics, and similar workloads.
- Tyan also announced new platforms in its HPC-focused Transport
HX product line and database-focused Transport SX product line
powered by 2nd Gen AMD EPYC processors.
With the introduction of PCIe 4.0 support in the 2nd Gen AMD
EPYC processors and Radeon Instinct GPU accelerators, AMD has led
the enablement of the PCIe 4.0 ecosystem by working closely with
key industry partners. The 2nd Gen EPYC supports PCIe 4.0 enabled
devices such as high speed ethernet and InfiniBand® interconnects,
NICs and switches, compute accelerators (GPUs and FPGAs) and
storage (NVME SSD) devices. Some of the partners offering PCIe 4.0
products for 2nd Gen EPYC include:
- Broadcom Thor NIC for 200 GB ethernet.
- Mellanox ConnectX-6 NIC showing ~400 GB/s InfiniBand
performance.
- Samsung Gen4 PM1733 NVME SSD – Showcasing 2x of IOPS over the
Samsung Gen3 SSD.
- Xilinx Alveo U50, U280 FPGAs.
Additional Resources
- AMD EPYC on AMD.com
- Learn more about AMD Radeon Instinct™ MI50 accelerators
- Learn more about the ROCm 3.0 open software platform here
- Learn about how AMD EPYC performs with HPC software here
- Follow AMD datacenter developments on Twitter
@AMDServer
- Follow AMD Radeon Instinct™ on Twitter @RadeonInstinct
About AMD For 50 years, AMD has driven
innovation in high-performance computing, graphics and
visualization technologies ― the building blocks for gaming,
immersive platforms, and the data center. Hundreds of millions of
consumers, leading Fortune 500 businesses and cutting-edge
scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD
employees around the world are focused on building great products
that push the boundaries of what is possible. For more information
about how AMD is enabling today and inspiring tomorrow, visit the
AMD (NASDAQ: AMD) website, blog, and Facebook and Twitter
pages.
Cautionary Statement This press release
contains forward-looking statements concerning Advanced Micro
Devices, Inc. (AMD) including the features, functionality,
availability, timing, deployment and expectations of AMD future
products and technologies as well as future collaborations and the
expected benefits of those collaborations, which are made pursuant
to the Safe Harbor provisions of the Private Securities Litigation
Reform Act of 1995. Forward-looking statements are commonly
identified by words such as "would," "intends," "believes,"
"expects," "may," "will," "should," "seeks," "intends," "plans,"
"pro forma," "estimates," "anticipates," or the negative of these
words and phrases, other variations of these words and phrases or
comparable terminology. Investors are cautioned that the
forward-looking statements in this document are based on current
beliefs, assumptions and expectations, speak only as of the date of
this document and involve risks and uncertainties that could cause
actual results to differ materially from current expectations. Such
statements are subject to certain known and unknown risks and
uncertainties, many of which are difficult to predict and generally
beyond AMD's control, that could cause actual results and other
future events to differ materially from those expressed in, or
implied or projected by, the forward-looking information and
statements. Material factors that could cause actual results to
differ materially from current expectations include, without
limitation, the following: Intel Corporation’s dominance of the
microprocessor market and its aggressive business practices may
limit AMD’s ability to compete effectively; AMD relies on third
parties to manufacture its products, and if they are unable to do
so on a timely basis in sufficient quantities and using competitive
technologies, AMD’s business could be materially adversely
affected; failure to achieve expected manufacturing yields for
AMD’s products could negatively impact its financial results; AMD
has a wafer supply agreement with GF with obligations to purchase
all of its microprocessor and APU product requirements, and a
certain portion of its GPU product requirements, from
GLOBALFOUNDRIES Inc. (GF) with limited exceptions. If GF is not
able to satisfy AMD’s manufacturing requirements, its business
could be adversely impacted; the success of AMD’s business is
dependent upon its ability to introduce products on a timely basis
with features and performance levels that provide value to its
customers while supporting and coinciding with significant industry
transitions; if AMD cannot generate sufficient revenue and
operating cash flow or obtain external financing, it may face a
cash shortfall and be unable to make all of its planned investments
in research and development or other strategic investments; the
loss of a significant customer may have a material adverse effect
on AMD; AMD’s receipt of revenue from its semi-custom SoC products
is dependent upon its technology being designed into third-party
products and the success of those products; global economic
uncertainty may adversely impact AMD’s business and operating
results; AMD’s operations are subject to political, legal and
economic risks and natural disasters which could have a material
adverse effect on AMD; government actions and regulations such as
export administration regulations, tariffs and trade protection
measures, may limit AMD’s ability to export its products to certain
customers; AMD products may be subject to security vulnerabilities
that could have a material adverse effect on AMD; IT outages, data
loss, data breaches and cyber-attacks could compromise AMD’s
intellectual property or other sensitive information, be costly to
remediate and cause significant damage to its business and
reputation; AMD’s operating results are subject to quarterly and
seasonal sales patterns; AMD may not be able to generate sufficient
cash to service its debt obligations or meet its working capital
requirements; AMD has a large amount of indebtedness which could
adversely affect its financial position and prevent it from
implementing its strategy or fulfilling its contractual
obligations; the agreements governing AMD’s notes and the Secured
Revolving Line of Credit impose restrictions on AMD that may
adversely affect its ability to operate its business; the markets
in which AMD’s products are sold are highly competitive; the
conversion of the 2.125% Convertible Senior Notes due 2026 may
dilute the ownership interest of its existing stockholders, or may
otherwise depress the price of its common stock; uncertainties
involving the ordering and shipment of AMD’s products could
materially adversely affect it; the demand for AMD’s products
depends in part on the market conditions in the industries into
which they are sold. Fluctuations in demand for AMD’s products or a
market decline in any of these industries could have a material
adverse effect on its results of operations; AMD’s ability to
design and introduce new products in a timely manner is dependent
upon third-party intellectual property; AMD depends on third-party
companies for the design, manufacture and supply of motherboards,
software and other computer platform components to support its
business; if AMD loses Microsoft Corporation’s support for its
products or other software vendors do not design and develop
software to run on AMD’s products, its ability to sell its products
could be materially adversely affected; and AMD’s reliance on
third-party distributors and AIB partners subjects it to certain
risks. Investors are urged to review in detail the risks and
uncertainties in AMD's Securities and Exchange Commission filings,
including but not limited to AMD's Quarterly Report on Form 10-Q
for the quarter ended September 28, 2019.
Links to third party sites are provided for convenience and
unless explicitly stated, AMD is not responsible for the contents
of such linked sites and no endorsement is implied.
AMD, the AMD Arrow logo, EPYC, Radeon, Radeon Instinct,
and combinations thereof, are trademarks of Advanced Micro Devices,
Inc. Other names are for informational purposes only and may be
trademarks of their respective owners.
i Based on AMD internal testing of ANSYS FLUENT 19.1, lm6000_16m
benchmark, as of July 17, 2019 of a 2P EPYC 7742 powered reference
server versus a 2P Intel Xeon Platinum 8280 powered server. Results
may vary. ROM-42iiAMD Internal testing as of 30July2019 of a 2P AMD
EPYC 7742 powered reference platform versus a 2P Intel Platinum
8280 powered production server, on GROMACS version 2019.3
benchmark. Results may vary. ROM-113iii "Best-in-class based on
industry-standard pin-based (LGA) X86 processors. EPYC-08"iv EPYC
7H12 processor boost frequencies may be achieved only with a
cooling solution that meets group ‘Z’ requirements. Achievable
boost frequencies may vary depending on the effectiveness of the
actual cooling solution. ROM-282
PR Contact:
Gary Silcott
+1 (512) 602-0889
Gary.Silcott@amd.com
Investor Contact:
Laura Graves
laura.graves@amd.com
+1 (408) 749-5467
Advanced Micro Devices (NASDAQ:AMD)
Historical Stock Chart
From Aug 2024 to Sep 2024
Advanced Micro Devices (NASDAQ:AMD)
Historical Stock Chart
From Sep 2023 to Sep 2024