Baya Systems Introduces New Technology to Transform and Accelerate Intelligent Computing
June 20 2024 - 12:00PM
Business Wire
Software and IP addresses system design complexity,
performance, scalability and Time to Market of SoCs and chiplets
for emerging applications.
Baya Systems today emerged from stealth mode to announce its
software-driven IP technology portfolio designed to accelerate
complex single-die and multi-die SoC designs. These innovations
bolster the emerging chiplet economy and enable unprecedented scale
for large-scale compute and AI processing.
Baya Systems technology simplifies the development process and
reduces the risk, empowering designers to rapidly analyze, develop,
optimize and deploy these complex systems. This enables highly
energy-efficient data movement in single-die designs that can
support over 4 terabyte/second throughput in a complex CPU cluster,
culminating in multi-petabyte/second throughput in multi-chiplet
designs for high-end AI installations.
With the exponential growth of computing requirements for
artificial intelligence, best-in-class silicon vendors have
consistently tried to scale performance efficiently by integrating
various processors, including CPUs, GPUs, and neural network
accelerators, into intelligent compute systems. This has led to a
substantial challenge of efficient data movement across these
different processors, and increasingly complex system and
application software development. Baya Systems focuses on
delivering hyper-efficient data movement that can be customized
with efficient hardware-based coherency, correctness, and
robustness to accelerate these platforms for applications across
industries such as AI acceleration, data center, networking
infrastructure, automotive and IoT.
“The rapid scaling in compute needed to support AI is
bottlenecked by scaling silicon, memory, storage, and the
increasingly huge amounts of data; requiring increasingly complex
SoCs and chiplets,” said Kevin Krewell, Principal Analyst at TIRIAS
Research. “The industry desperately needs a holistic way to design,
analyze, and build intelligent fabrics to address this, and Baya
seems to have the right ingredients to really drive the market
forward.”
Baya Systems tackles the challenges of system design complexity,
performance guarantees, high costs, and shrinking market windows in
the SoC and chiplet industries. Its WeaverPro™ software platform
supports the SoC designer from initial specification all the way to
post-silicon tuning. Its WeaveIP™ provides components to build a
unified fabric that has an extremely efficient, scalable transport
architecture that maximizes performance and throughput, while
minimizing latency, silicon footprint and power. Combined with
advanced features for reliability and safety, this empowers
designers to analyze, architect, customize, optimize and deploy
complex SoCs and chiplets.
Baya’s solution is unique for the following reasons:
- Software-driven architecture exploration helps optimize design
to achieve performance guarantees based on built-simulator.
- Engine to generate representative workloads from traffic
specification.
- Best-in-class, flexible network that can achieve 3GHz in a
4-nanometer process technology.
- Algorithmic optimization that supports reuse and minimizes
silicon and power footprints without compromising performance.
- Industry’s first IP to offer multi-level cache coherency for
single/multi-die systems, radically reducing costs of coherency
across these large-scale systems.
- Customizable protocol and multicast capabilities for advanced
AI and CPU acceleration that support petabyte-level
throughput.
- Correct-by-construction design generation that radically
reduces risk of failure.
- WeaveIP supports standard protocols such as CHI, ACE5-Lite,
AXI5 and extendable to others including CXL.
- Physically aware flow with modularity and tiling support for
ease of implementation
“The semiconductor industry is at an inflection point in how to
overcome the widening gap between memory performance and the
processing needs of AI,” said Dr. Sailesh Kumar, CEO at Baya
Systems. “These challenges are overwhelming the industry with
design complexity, energy costs, and systems that are obsolete by
the time they hit the market. Baya Systems is resolute in
delivering foundational software, an industry-first, grounds-up
fabric solution for future-proof multi-cluster and multi-chiplet
designs, and a methodology that takes out the guesswork. I firmly
believe that Baya unlocks the merchant chiplet market that is
expected to grow to $107 billion by 2033.”
Baya Systems was founded by Kumar, an ex-Intel Fellow and former
founder of Netspeed Systems; Dr. Eric Norige, and Joji Philip, who
were also key contributors at Netspeed Systems. It is backed by
leading investors Matrix and Intel Capital, and is led by Silicon
Valley semiconductor veterans with extensive experience in
processing and systems, who have driven important initiatives at
AMD, ARM, Apple, Intel, Meta, and other leading processor
companies.
“When we invest, we look for key market gaps, disruptive
technologies that address them, and teams that have a compelling
vision and execution muscle and the hunger to achieve it,” said
Stan Reiss, general partner, Matrix Partners. “Baya tops all of
them for a market that is desperate for solving the scale and
chiplet problem with a technology that not just fills the gap but
unleashes disruptive innovation, and a proven team that has had a
consistent out-sized success in entrepreneurial and high-growth
settings.”
The company makes its public debut at DAC 2024, Booth No. 2446,
at Moscone West in San Francisco June 23-27.
About Baya Systems
Baya Systems is accelerating the next wave of foundational
chiplet-based, high-performance and modular semiconductor systems
technologies to accelerate intelligent compute everywhere. Baya
Systems was named for the Baya bird, aka the weaver, renowned for
constructing cohesive nests from various materials. This approach
mirrors Baya Systems’ integrated and efficient solutions from
diverse components, and its mission to allow best-of-breed compute,
communication and I/O components to be used together with the
promise of improving performance, yield, reusability/composability
and cost of development. Baya Systems is backed by leading
investors Matrix Partners and Intel Capital. For more information
visit https://www.bayasystems.com.
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