InvenSense Announces World’s First TDM Microphone With an Array of 16 Devices on a Single Bus
May 10 2016 - 9:07AM
Business Wire
InvenSense, Inc. (NYSE: INVN), a leading provider of MEMS sensor
platforms, today announced the world’s first TDM (Time Division
Multiplexed) MEMS microphone that can support up to 16 microphones
on one bus. With proliferation of connected devices where the main
means of communication is far field voice communication, having an
array of microphones that can pick up the user’s voice from any
direction is key to their success. These microphone arrays allow
the device to form a narrow audio band to pick up user’s command in
its direction while effectively ignoring noise from every other
direction making reliable communication possible. Up to now, device
makers had to pick from microphones with interfaces that supported
no more than two on a bus leading to complex and expensive
solutions for an array of microphones. InvenSense’ ICS-52000 is a
low noise microphone that allows a microphone array to connect
directly to digital processors without the need for audio
converters in the system. All microphones in the array are able to
synchronize their acoustic capture enabling precise audio
processing.
There are growing number of applications that require multiple
microphones to support reliable voice recognition in IoT market,
home automation, audio and video conferencing and drones. The
ICS-52000 addresses the challenges of interfacing microphone arrays
by simplifying system design and significantly reducing overall
system cost.
“Far field voice recognition has become a critical feature in
IoT market and AR/VR applications that need to have wrap around
audio processing. The ICS-52000 compliments our market leading high
performance microphone portfolio by addressing the specific needs
of these markets,” said Eitan Medina, vice president marketing and
product management at InvenSense. “Our patented microphone array
architecture based on standard TDM interface enables efficient and
elegant industrial designs.”
InvenSense’ ICS-52000 is sampling now and will be in mass
production in 3Q this year. The product is packaged in a standard
bottom port configuration. InvenSense will be exhibiting in Hall
N1, stand 1742 at the 2016 CES Asia event taking place in Shanghai,
China from May 11-13, 2016. To schedule press and partner meetings
at the show, contact pr@invensense.com. For additional
information about the ICS-52000 and other InvenSense microphone
solutions, please visit http://www.invensense.com/technology/sound/
or contact InvenSense Sales at sales@invensense.com.
About InvenSense
InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of
MEMS sensor platforms. InvenSense’s vision of Sensing Everything™
targets the consumer electronics and industrial markets with
integrated Motion and Sound solutions. Our solutions combine MEMS
(micro electrical mechanical systems) sensors, such as
accelerometers, gyroscopes, compasses, and microphones with
proprietary algorithms and firmware that intelligently process,
synthesize, and calibrate the output of sensors, maximizing
performance and accuracy. InvenSense’s motion tracking, audio and
location platforms, and services can be found in Mobile, Wearables,
Smart Home, Industrial, Automotive, and IoT products. InvenSense is
headquartered in San Jose, California and has offices worldwide.
For more information, go to www.invensense.com and
http://www.coursaretail.com.
©2016 InvenSense, Inc. All rights reserved. InvenSense, Sensing
Everything, FireFly, SensorStudio, TrustedSensor, Coursa, Coursa
Sports, Coursa Retail, UltraPrint, MotionTracking,
MotionProcessing, MotionProcessor, MotionFusion, MotionApps,
InvenSenseTV, DMP, AAR, and the InvenSense logo are trademarks of
InvenSense, Inc. Other company and product names may be trademarks
of the respective companies with which they are associated.
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version on businesswire.com: http://www.businesswire.com/news/home/20160510006003/en/
InvenSense, Inc.David A. Almoslino, 408-501-2278Senior
DirectorMarketing and Communicationspr@invensense.com
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