Tower Semiconductor Announces Program Creating an Integrated-Laser-on-Silicon Photonics Foundry Process
January 05 2021 - 6:00AM
Advanced process to be developed with
partial funding from the DARPA LUMOS program addressing high-speed
communications
MIGDAL HAEMEK, Israel, January 05,
2021 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leader
in high-value analog semiconductor foundry solutions, today
announced that it is participating in the LUMOS program, with
partial support from DARPA, to create a semiconductor foundry
integrated-laser-on-silicon photonics process. This process
will combine high-performance III-V laser diodes with Tower’s PH18
production silicon photonics platform. Multi-project wafer runs
(MPW) will be coordinated with the new process, when ready.
The initial versions of the PDK (process development kit) are
expected in 2021 and will include laser and amplifier blocks.
The benefits of laser integration on silicon
include an increase in the density of lasers, a reduction of
coupling losses between the laser and the photonics, a reduction in
components required, and a much-simplified packaging scheme. When
combined with Tower’s rich suite of passive and active silicon
photonics elements -- such as silicon and silicon-nitride
waveguides, Mach-Zehnder modulators (MZM), and Ge photodiodes --
the co-integration will enable new products unavailable today from
a volume semiconductor or photonics foundry.
The advanced process will be part of DARPA’s
Lasers for Universal Microscale Optical Systems (LUMOS) program,
which aims to bring high-performance lasers to advanced photonics
platforms, addressing commercial and defense applications.
For more info on the LUMOS program announcement, please
see:Agency announces performer teams selected for LUMOS program -
“DARPA Looks to Light up Integrated Photonics with Chip-Scale Laser
Development”
For more information about Tower Semiconductor’s
Aerospace and Defense technology solutions, please click here.
For more information about Tower Semiconductor’s
Silicon Photonics technology platform, please click here.
For more information about Tower Semiconductor’s process
technology offerings, please click here or inquire
at: info@towersemi.com.
This DARPA research was funded, in part, by the
U.S. Government. The views and conclusions contained in this
document are those of the authors and should not be interpreted as
representing the official policies, either expressed or implied, of
the U.S. Government.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE:
TSEM), the leader in high-value analog semiconductor foundry
solutions, provides technology and manufacturing platforms for
integrated circuits (ICs) in growing markets such as consumer,
industrial, automotive, mobile, infrastructure, medical and
aerospace and defense. Tower Semiconductor’s focuses on creating
positive and sustainable impact on the world through long term
partnerships and its advanced and innovative analog technology
offering, comprised of a broad range of customizable process
platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS
image sensor, non-imaging sensors, integrated power management (BCD
and 700V), and MEMS. Tower Semiconductor also provides world-class
design enablement for a quick and accurate design cycle as well as
Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies. To provide multi-fab sourcing and
extended capacity for its customers, Tower Semiconductor operates
two manufacturing facilities in Israel (150mm and 200mm), two in
the U.S. (200mm) and three facilities in Japan (two 200mm and one
300mm) through TPSCo. For more information, please visit
www.towersemi.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect Tower’s business is included under the heading “Risk
Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority. Tower does not intend
to update, and expressly disclaim any obligation to update, the
information contained in this release.
###
Tower Semiconductor Company
Contact: Orit Shahar | +972-74-7377440 |
oritsha@towersemi.com
Tower Semiconductor Investor Relations Contact:
Noit Levy | +972-4-604-7066 | noitle@towersemi.com
- LUMOS Tower FINAL 01052021
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