FSP201 delivers superior orientation and
heading accuracy, providing high quality, low cost, sensor-agnostic
solution for robotics, 3D audio, metaverse hardware & general
6-axis motion applications
ROCKVILLE, Md., June 9, 2022
/PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading
licensor of wireless connectivity, smart sensing technologies, and
integrated IP solutions, today announced that it has expanded its
family of sensor fusion products with the introduction of the
FSP201, a high-performance and low-power sensor hub MCU that
delivers precise, accurate sensor fusion for motion tracking,
heading and orientation detection. The FSP201 is ideal for consumer
robotics and other emerging smart devices employing sensor fusion
technologies, including XR glasses, 3D audio headsets and the wide
range of 6-axis motion use cases across IoT and the metaverse.
The FSP201 combines CEVA's award-winning proprietary
MotionEngine™ sensor processing software - that has powered more
than 250 million devices to date - into a low-power 32-bit Arm
Cortex M23 MCU and offers a high performance, high quality and
low-cost solution optimized for consumer applications. The FSP201
provides manufacturers the flexibility to choose from a
pre-qualified list of external 6-axis IMU sensors (accelerometer
plus gyroscope) - from different sensor suppliers - to ensure
supply chain flexibility, and provide the performance and features
required for motion tracking, heading and orientation detection,
including:
- Correction Smoothing: Corrects orientation drift slowly
and transparently to the user for head and body tracking to
maintain an immersive XR or 3D audio experience;
- Auto-Centering: Dynamically recenters the
soundstage in 3D audio applications based on a user's gaze to
maintain immersion in dynamic conditions and eliminate drift;
- Tilt Independent Heading: Allows for proper heading
output even when a robot's driving surface is uneven, enabling
rapid adjustment to obstacles or changes in flooring types;
- Inclination Detection: Provides full 3DOF robot
orientation allowing detection of surface and device issues that
could cause the robot to become stuck or damaged;
- Dynamic Calibration: Proprietary algorithms monitor
changes in sensor performance and temperature during live operation
to deliver the highest performance; and
- Sensor Independence: Several low-cost MEMS sensors
from leading suppliers are pre-qualified and have drivers
pre-integrated to accelerate development and ensure supply chain
flexibility.
The FSP201 fits simply into any design and uses I2C and UART
industry interfaces for chip connectivity. It can be placed
directly on the target product's main circuit board or designed
into a separate module, providing manufacturers with ultimate
flexibility. The turn-key sensor hub MCU benefits developers
and integrators through faster time-to-market, reductions in
development time, reduced BOM cost, and the highest precision and
quality.
Crucially, the FSP201 is code-compatible with the BNO08X series
of 9-axis sensor System-in-Package (SIP) products, facilitating
developers to easily migrate to a 6-axis FSP201 based solution or
take advantage of CEVA's sensor fusion technologies in new product
lines that do not require 9-axis sensor fusion.
Due to supply chain constraints and component shortages, many
MCU and IMU sensor devices continue to experience long wait times.
CEVA has secured supply of the FSP201 MCU and IMU sensors to enable
fast time-to-market, which makes FSP201 an ideal solution for near-
and long-term production requirements.
"We are pleased to expand our portfolio of silicon products for
high performance, cost sensitive sensor fusion applications with
the addition of the FSP201 MCU," said Chad
Lucien, Vice President and General Manager of the Sensors
and Audio Business Unit at CEVA. "High precision motion tracking,
heading and orientation are key features of today's consumer robots
and entertainment devices, and are central to emerging metaverse
and IoT applications and services. FSP201 ensures developers can
rapidly develop products that leverage our industry-leading sensor
processing technologies with components that are readily available
in 2022."
The FSP201 is available for immediate sampling along with
documentation and evaluation tools via our designated distributors.
For more information, please visit
https://www.ceva-dsp.com/product/hillcrest-labs-chips-and-modules/.
About CEVA, Inc.
CEVA is the leading licensor of
wireless connectivity, smart sensing technologies, and integrated
IP solutions for a smarter, safer, connected world. We provide
Digital Signal Processors, AI engines, wireless platforms,
cryptography cores and complementary software for sensor fusion,
image enhancement, computer vision, voice input and artificial
intelligence. These technologies are offered in combination with
our Intrinsix IP integration services, helping our customers
address their most complex and time-critical integrated circuit
design projects. Leveraging our technologies and chip design
skills, many of the world's leading semiconductors, system
companies and OEMs create power-efficient, intelligent, secure and
connected devices for a range of end markets, including mobile,
consumer, automotive, robotics, industrial, aerospace & defense
and IoT.
Our DSP-based solutions include platforms for 5G baseband
processing in mobile, IoT and infrastructure, advanced imaging and
computer vision for any camera-enabled device, audio/voice/speech
and ultra-low-power always-on/sensing applications for multiple IoT
markets. For sensor fusion, our Hillcrest
Labs sensor processing technologies provide a broad range of
sensor fusion software and inertial measurement unit ("IMU")
solutions for markets including hearables, wearables, AR/VR, PC,
robotics, remote controls and IoT. For wireless IoT, our platforms
for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6/6E
(802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most
broadly licensed connectivity platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube,
Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.