Report of Foreign Issuer Pursuant to Rule 13a-16 or 15d-16 (6-k)
September 24 2021 - 6:05AM
Edgar (US Regulatory)
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1934 Act Registration No. 1-14700
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UNITED STATES
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SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
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FORM 6-K
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REPORT OF FOREIGN PRIVATE ISSUER
PURSUANT TO RULE 13a-16 OR 15d-16 UNDER
THE SECURITIES EXCHANGE ACT OF 1934
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For the month of September 2021
(Commission File Number: 001-14700)
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Taiwan Semiconductor Manufacturing Company Ltd.
(Translation of Registrant’s Name Into English)
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No. 8, Li-Hsin Rd. 6,
Hsinchu Science Park,
Taiwan, R.O.C.
(Address of Principal Executive Offices)
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Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.
Form 20-F ☒ Form 40-F ☐
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Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(1):□
Indicate by check mark if the registrant is submitting the Form 6-K in papers as permitted by Regulation S-T Rule 101(b)(7):□
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SIGNATURES
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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.
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Taiwan Semiconductor Manufacturing Company Ltd.
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Date:
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September 24, 2021
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By
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/s/ Wendell Huang
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Wendell Huang
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Vice President & Chief Financial Officer
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Taiwan Semiconductor Manufacturing Company Limited
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("TSMC"; NYSE: TSM)
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This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC; 3) the acquisition and disposition of assets by TSMC and its subsidiaries; 4) the capital appropriations approved by TSMC board of directors and 5) The unsecured bonds issued by TSMC and its subsidiaries for the month of August 2021.
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1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC:
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Title
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Name
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Number of shares held as of
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Changes
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07/31/2021
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08/31/2021
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Senior Vice President
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Cliff Hou
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439,605
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440,445
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840
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Vice President
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Connie Ma
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215,000
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236,000
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21,000
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Vice President
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Marvin Liao
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315,485
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325,485
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10,000
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Vice President and
Chief Financial Office
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Wendell Huang
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1,651,677
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1,651,692
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15
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Vice President
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Jun He
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7,000
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8,000
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1,000
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Vice President
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Geoffrey Yeap
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4.000
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8,000
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4.000
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Vice President
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Jonathan Lee
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330,850
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331,522
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672
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Vice President
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L.C. Lu
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110,227
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120,227
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10,000
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Note: Shareholdings include shares held by the related parties.
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2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC: Inapplicable
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3. The acquisition and disposition of assets by TSMC and its subsidiaries:
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(1) Fixed-income investment: NT$5.4 billion of acquisition and NT$5.9 billion of disposition.
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4. The capital appropriations approved by TSMC board of directors:
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(1) Machinery equipment for advanced technology capacity: NT$228.0 billion;
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(2) Machinery equipment for advanced packaging, mature and specialty technology capacity: NT$74.5 billion;
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(3) Machinery equipment for R&D capital investments and sustaining capital expenditures: NT$12.8 billion;
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(4) Real estate and capitalized leased assets: NT$168.0 billion.
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5. The unsecured bonds issued by TSMC and its subsidiaries
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Issuance
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Tranche
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Issuance Period
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Total Amount
(in billions)
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Coupon
Rate
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Repayment
and
Interest Payment
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110-4
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A
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Aug. 2021 ~ Aug. 2025
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NT$4.0
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0.485%
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Bullet repayment; interest payable annually
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B
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Aug. 2021 ~ Aug. 2026
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NT$8.0
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0.50%
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C
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Aug. 2021 ~ Aug. 2028
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NT$5.4
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0.55%
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D
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Aug. 2021 ~ Aug. 2031
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NT$4.2
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0.62%
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