CHENGDU, China, Oct. 14 /PRNewswire-FirstCall/ -- Texas
Instruments Incorporated (NYSE: TXN) (TI) today announced its first
wafer fabrication facility, or "fab," in China. This
important milestone puts manufacturing close to the company's
growing customer base there. Located in the Chengdu High-tech Zone
(CDHT), which is considered by many to be China's next major technology hub, TI Chengdu
will further expand TI's analog production capacity.
The fab is a fully equipped 200mm manufacturing facility and was
purchased from Cension Semiconductor Manufacturing Company.
It includes an operating 120,000-square- foot fab that can support
more than $1 billion in annual
revenue and a 134,000-square-foot fab reserved for future
production needs.
"TI has been committed to serving the China market for 25 years," said Gregg Lowe, TI senior vice president for
Analog. "Increasingly, customers there are using TI's analog
chips for the real-world functions in their electronic
applications. This fab in Chengdu
will strengthen our ability to support customers' growing
requirements and deliver analog products when and where customers
need them."
This announcement follows TI manufacturing expansions in the
U.S., Japan and Germany over the past 24 months.
For more information about TI delivery capacity and analog
manufacturing investments, please see www.ti.com/chengdu-pr.
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and
develop new electronics that make the world smarter, healthier,
safer, greener and more fun. A global semiconductor company, TI
innovates through design, sales and manufacturing operations in
more than 30 countries. For more information, go to
www.ti.com.
Trademarks
All trademarks are the property of their respective owners.
TXN-C
Safe Harbor
Statements contained in this press release regarding the
capability of acquired capacity to expand TI's Analog revenue, and
other statements of management's beliefs, goals and expectations,
are forward-looking statements intended to qualify for the safe
harbor from liability established by the Private Securities
Litigation Reform Act of 1995. All such forward-looking statements
are subject to certain risks and uncertainties that could cause
actual results to differ materially from those in forward-looking
statements.
We urge you to carefully consider the following important
factors that could cause actual results to differ materially from
the expectations of TI or its management:
- Market demand for semiconductors, particularly in key markets
such as communications, entertainment electronics and
computing;
- TI's ability to maintain or improve profit margins, including
its ability to utilize its manufacturing facilities at sufficient
levels to cover its fixed operating costs, in an intensely
competitive and cyclical industry;
- TI's ability to develop, manufacture and market innovative
products in a rapidly changing technological environment;
- TI's ability to compete in products and prices in an intensely
competitive industry;
- TI's ability to maintain and enforce a strong intellectual
property portfolio and obtain needed licenses from third
parties;
- Expiration of license agreements between TI and its patent
licensees, and market conditions reducing royalty payments to
TI;
- Economic, social and political conditions in the countries in
which TI, its customers or its suppliers operate, including
security risks, health conditions, possible disruptions in
transportation networks and fluctuations in foreign currency
exchange rates;
- Natural events such as severe weather and earthquakes in the
locations in which TI, its customers or its suppliers operate;
- Availability and cost of raw materials, utilities,
manufacturing equipment, third-party manufacturing services and
manufacturing technology;
- Changes in the tax rate applicable to TI as the result of
changes in tax law, the jurisdictions in which profits are
determined to be earned and taxed, the outcome of tax audits and
the ability to realize deferred tax assets;
- Changes in laws and regulations to which TI or its suppliers
are or may become subject, such as those imposing fees or reporting
or substitution costs relating to the discharge of emissions into
the environment or the use of certain raw materials in our
manufacturing processes;
- Losses or curtailments of purchases from key customers and the
timing and amount of distributor and other customer inventory
adjustments;
- Customer demand that differs from TI's forecasts;
- The financial impact of inadequate or excess TI inventory that
results from demand that differs from projections;
- The ability of TI and its customers and suppliers to access
their bank accounts and lines of credit or otherwise access the
capital markets;
- Impairments of TI's non-financial assets;
- Product liability or warranty claims, claims based on epidemic
or delivery failure or recalls by TI customers for a product
containing a TI part;
- TI's ability to recruit and retain skilled personnel; and
- Timely implementation of new manufacturing technologies,
installation of manufacturing equipment and the ability to obtain
needed third-party foundry and assembly/test subcontract
services.
For a more detailed discussion of these factors, see the Risk
Factors discussion in Item 1A of TI's most recent Form 10-K filed
with the U.S. Securities and Exchange Commission. The
forward-looking statements included in this release are made only
as of the date of this release, and TI undertakes no obligation to
update the forward-looking statements to reflect subsequent events
or circumstances.
SOURCE Texas Instruments Incorporated
Copyright . 14 PR Newswire