MOUNTAIN VIEW, Calif.,
Oct. 20, 2020 /PRNewswire/ --
Highlights:
- Synopsys selected as TSMC OIP Partner of the Year for interface
IP and tool enablement for the 10th consecutive year
- Collaborations on interface IP, joint development of 3nm design
infrastructure, 3DIC design productivity solution and a highly
scalable timing sign-off in the cloud are recognized
Synopsys, Inc. (Nasdaq: SNPS) today announced it has
received four 2020 OIP Partner of the Year awards for IP and EDA
solutions from TSMC demonstrating excellence in next-generation
system-on-chip (SoC) and 3DIC design enablement. These awards
recognize Synopsys for high-quality interface IP, the joint
development of 3-nanometer (nm) design infrastructure, 3DIC design
productivity and a highly scalable timing sign-off solution in the
cloud.
For more than 20 years, Synopsys and TSMC have collaborated to
accelerate development and innovation, including the adoption of
FinFET technology for optimum power, performance, and area (PPA)
for TSMC's N3 process. 2020 is the tenth consecutive year Synopsys
has received IP and electronic design automation (EDA) accolades
from TSMC.
"We're pleased to congratulate Synopsys as the winner of
multiple 2020 OIP Partner of the Year awards for IP and EDA
solutions in recognition of our collaboration to enable important
innovations in the field of semiconductor design," said
Suk Lee, senior director of Design
Infrastructure Management Division at TSMC. "TSMC looks forward to
our continued partnership to address our customers' needs with
certified design solutions using TSMC's latest technologies and
extend the development of PPA-optimized design platforms for
automotive, mobile, HPC, AI and 5G applications."
The companies' long-standing collaboration has over the past
year yielded impressive achievements for the benefit of mutual
customers, including:
- TSMC certification of new, innovative features in Synopsys'
digital and custom implementation platforms extended to 3nm
enablement for early customer engagements
- Synopsys' 3DIC Compiler with its tightly integrated, full-chip
array of chip package, co-design and analysis capabilities
accelerates advanced 2.5D/3DIC packaging design productivity and
faster time to an optimal solution
- Highly scalable Synopsys' PrimeTime® static timing
analysis and StarRC™ signoff extraction technology for
use in the cloud providing significant throughput gains and
considerable cost savings for design closure
- Synopsys has delivered a broad portfolio of silicon-proven
DesignWare® IP on TSMC's N7 and N5 processes for
advanced SoCs targeting data-intensive applications including HPC
and AI
"For over two decades, Synopsys and TSMC have been collaborating
to accelerate silicon innovation and help customers achieve their
time-to-market goals," said Charles
Matar, senior vice president of System Solutions and
Ecosystem Enablement for the Design Group at Synopsys. "Our close
and deep engineering engagement with TSMC has led to innovative
solutions like 3DIC design enablement, 3nm design implementations,
and DesignWare interface IP, as well as ongoing efforts to optimize
the TSMC Open Innovation Platform® Virtual Design
Environment (OIP VDE) cloud solution. These innovative
solutions have enabled mutual customers to take advantage of
Synopsys' proven, design platforms and IP portfolio using TSMC's
latest process technologies."
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to
Software™ partner for innovative companies developing
the electronic products and software applications we rely on every
day. As the world's 15th largest software company,
Synopsys has a long history of being a global leader in electronic
design automation (EDA) and semiconductor IP and is also growing
its leadership in software security and quality solutions. Whether
you're a system-on-chip (SoC) designer creating advanced
semiconductors, or a software developer writing applications that
require the highest security and quality, Synopsys has the
solutions needed to deliver innovative, high-quality, secure
products. Learn more at www.synopsys.com.
Editorial Contact:
Simone
Souza
Synopsys, Inc.
650-584-6454
simone@synopsys.com
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SOURCE Synopsys, Inc.