ISSI (MM)

Copper Leadframe Enhances Reliability over Standard Leadframes MUNICH, Germany, Nov. 11 /PRNewswire-FirstCall/ -- Integrated Silicon Solution, Inc. (NASDAQ:ISSI), a leader in advanced memory solutions, today announced a complete line of copper leadframe memories including SRAM, DRAM and EEPROM devices. The use of copper leadframes enhances the long-term reliability of these devices in harsh environments such as automotive engine controls and industrial applications. The improved reliability comes from better performance in two different areas when compared to the industry common Alloy42 leadframes. First, the thermal conductivity of copper is twelve times better than that of Alloy42. This translates to better heat dissipation from the die into the leadframe and out of the package. This results in less heat stress inside the component. Since heat stress at the die is one of the leading causes of a non-mechanical component failure in a long-life application, the copper leadframe improves the reliability of the device. Second, unlike Alloy42, the coefficient of thermal expansion in a copper leadframe closely matches that of the pads on the printed circuit board. As a result, less stress is applied to the solder joints due to the similar expansion and contraction rates of the adjoining materials during temperature swings experienced in harsh environments. Also, copper is not as stiff as Alloy42. This allows the bends in the leadframe to minimize the stress being applied to the solder joints. This greatly reduces the risk of a crack forming in a solder joint. ISSI now offers a full line of SRAMs and EEPROMs that support operating temperatures of -40C to +85C, +105C, and +125C and a full line of DRAMs that support operating temperatures of -40C to +85C and +105C that are available with copper leadframes. This allows the customer to match both the temperature range and the leadframe to the application's environment for enhanced system reliability. About ISSI ISSI is a fabless semiconductor company that designs and markets high performance integrated circuits for the following key markets: (i) digital consumer electronics, (ii) networking, (iii) mobile communications (iv) automotive electronics and (v) industrial. The Company's primary products are high speed and low power SRAM and low and medium density DRAM. The Company also designs and markets EEPROM, SmartCards and is developing selected non-memory products focused on its key markets. ISSI is headquartered in Silicon Valley with worldwide offices in Taiwan, Japan, Singapore, China, Europe, Hong Kong, India, and Korea. Visit our web site at http://www.issi.com/. DATASOURCE: Integrated Silicon Solution, Inc. CONTACT: Ron Kalakuntla, +1-408-969-4675, , or Tom Doczy, +1-408-969-4620, , both of Integrated Silicon Solution, Inc.; or Larry Hayes of Hayes Marketing, +1-408-921-5806, , for Integrated Silicon Solution, Inc. Web site: http://www.issi.com/

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