Fairchild Semiconductor’s Dual Cool™ Package Answers the Need for Higher Power Density in DC-DC Designs
October 25 2010 - 11:01AM
Business Wire
As DC-DC applications, such as power modules, telecommunications
and servers, become more space-constrained, designers are looking
for smaller devices to meet their design challenges. The thermal
capability of these devices, however, is a concern.
Fairchild Semiconductor's Dual Cool™
packaging for MOSFETs (Photo: Business Wire)
In order to meet the needs for high current capability, high
efficiency and smaller form factors, Fairchild Semiconductor (NYSE:
FCS) developed the Dual Cool™ packaging for MOSFETs. The Dual Cool
package is a top-side cooling PQFN device that incorporates new
packaging technology which enables additional power dissipation
through the top of the package.
Dual Cool packaging features an exposed heat slug that delivers
a significant reduction in thermal resistance from junction to top
of case, resulting in more than 60 percent higher power dissipation
capability than standard PQFN packaging when a heat sink is
mounted. Additionally, MOSFETs in the Dual Cool package are
designed with Fairchild’s proprietary PowerTrench® process
technology, that enables lower RDS(ON) and higher load currents in
smaller package sizes.
Unlike competitive top-side cooling solutions, these devices are
currently available in both Power33 (3.3mm x 3.3mm) and Power56
(5mm x 6mm) Dual Cool packaging options. Maintaining the same
industry-standard PQFN footprint, the Dual Cool package allows
power engineers to rapidly qualify MOSFETs in Dual Cool packaging,
gaining increased thermal efficiency without having to adjust for
non-standard packages.
Devices currently available in the Dual Cool package include the
FDMS2504SDC, FDMS2506SDC, FDMS2508SDC, FDMS2510SDC (5mm x 6mm
footprint) and the FDMC7660DC (3.3mm x 3.3mm footprint). These
devices are ideal as synchronous rectifying MOSFETs for DC-DC
converters, telecom secondary side rectification and high end
server/workstation applications. Fairchild’s Dual Cool packaged
MOSFETs’ top-side cooling and an ultra-low junction temperature
(Rthja) enable increased thermal efficiency. MOSFETs in the Dual
Cool package can be used with or without a heat sink. For
additional information on devices available in the Dual Cool
package, please visit our website at:
www.fairchildsemi.com/dualcool.
Dual Cool packaged MOSFETS are part of Fairchild’s
industry-leading MOSFET portfolio. By understanding the demands for
higher current DC-DC power supplies in smaller footprints for space
constrained applications, as well as our customers and the markets
they serve, Fairchild can tailor its unique combination of
functional, process and packaging innovation into solutions that
make a difference in electronic designs.
For more information on Fairchild’s Dual Cool package, visit
www.fairchildsemi.com/dualcool.
Price: (each in 1,000 piece quantities)
FDMS2504SDC – $4.14
FDMS2506SDC – $3.46
FDMS2508SDC – $2.70
FDMS2510SDC – $2.08
FDMC7660DC – $1.38
Availability: samples available now
Delivery: 8-12 weeks ARO
Contact Information:
To contact Fairchild Semiconductor about this product, please go
to: http://www.fairchildsemi.com/cf/sales_contacts/.
For information on other products, design tools and sales
contacts, please visit: http://www.fairchildsemi.com.
Note to Editor: For a datasheet in PDF format, please go
to:
http://www.fairchildsemi.com/ds/FD/FDMS2504SDC.pdf
http://www.fairchildsemi.com/ds/FD/FDMS2506SDC.pdf
http://www.fairchildsemi.com/ds/FD/FDMS2508SDC.pdf
http://www.fairchildsemi.com/ds/FD/FDMS2510SDC.pdf
http://www.fairchildsemi.com/ds/FD/FDMC7660DC.pdf
About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) – global presence, local
support, smart ideas. Fairchild delivers energy-efficient,
easy-to-use and value-added semiconductor solutions for power and
mobile designs. We help our customers differentiate their products
and solve difficult technical challenges with our expertise in
power and signal path products. Please contact us on the web at
www.fairchildsemi.com.
Follow us on Twitter @ http://twitter.com/fairchildSemi.
View product and company videos, listen to podcasts and comment
on our blog @
http://www.fairchildsemi.com/engineeringconnections.
Visit us on Facebook @
http://www.facebook.com/FairchildSemiconductor.
Photos/Multimedia Gallery Available:
http://www.businesswire.com/cgi-bin/mmg.cgi?eid=6479751&lang=en
Fairchild Semiconductor (NASDAQ:FCS)
Historical Stock Chart
From May 2024 to Jun 2024
Fairchild Semiconductor (NASDAQ:FCS)
Historical Stock Chart
From Jun 2023 to Jun 2024
