Companies' long-term collaboration for
wireless, audio and voice technologies sees world's leading OEMs
adopt Actions Technology's high-quality,
low-latency wireless audio SoCs for consumer devices, including
speakers, soundbars, earbuds and smartwatches
LAS
VEGAS, Jan. 10, 2024 /PRNewswire/ -- CES 2024 --
Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and
software IP that enables Smart Edge devices to connect, sense and
infer data more reliably and efficiently, and Actions Technology
Co, Ltd. ("Actions Space Technology"), the leading fabless
semiconductor company of AIoT (Artificial Intelligence of Things)
SoC, are celebrating a monumental achievement today, with Actions
surpassing sales of more than 100 million wireless audio and AIoT
chips powered by Ceva's audio, voice, AI sensing and wireless
communications IPs.
Actions Technology produces AIoT SoCs which power wireless
audio, portable audio-visual, and edge AI processor
applications. Inherited over 20 year of IC design experience
from Actions Semiconductor (a former NASDAQ listed company),
Actions Technology was founded in 2014 and is headquartered in
Zhuhai, China, and strives to
provide chips with industry-leading quality audio, with lowest
power consumption and ultra-low latency. Ceva and Actions
Technology have collaborated closely in the fields of DSP and
AI processing in the audio field and related wireless workloads.
Testament to the exceptional performance and immersive experience
enabled by Actions Technology's processors, its audio SoCs and AIoT
processors have been deployed by many of the world's leading
customers, including Sony, Harman, Vizio, Honor, Xiaomi, realme,
Hisense, TCL, Anker, boAt, Fire-Boltt, Noise, Nothing, Razer, RODE,
Iflytek, Moma and more.
Zhenyu Zhou, Chairman & CEO
of Actions Technology, stated: "For the past decade, Actions
Technology has been at the forefront of wireless audio innovation,
thanks to our deep understanding of these technologies and our
joint work with Ceva. Surpassing 100 million Ceva-powered wireless
audio chipsets shipped is an incredible achievement for our
companies. As we enter a new era of AI-driven audio chip
innovation, our close collaboration around Ceva's sensing AI and
wireless communications IPs ensure that we have best-in-class
technologies to augment our internal development and deliver AIoT
SoCs that continue to lead the industry."
Amir Panush, CEO of Ceva, added:
"We congratulate our partner Actions Technology on their remarkable
achievements and stellar market success. Our industry-leading
portfolio of technologies that enable devices to connect, sense and
infer data is harmonious with the evolving needs of the wireless
audio industry and we embrace the opportunity to continue to
support Actions Technology for their roadmap needs in wireless
communications, audio, voice, AI and beyond."
About Actions Technology Co., Ltd
Actions Technology
Co., Ltd is a leading fabless semiconductor company of
AIoT SoC in China,
excels in the research, design, and commercialization of advanced
smart audio SoC. Our primary focus is on delivering cutting-edge
integrated chips for wireless audio, smart wearables, and AI
interactions in the AIoT field.Our main products include the
Bluetooth audio SoC series, the portable audio-visual SoC series,
and the edge AI processor family. These products are widely
utilized across diverse include Bluetooth speakers & headset,
wireless home theaters, smartwatches, wireless microphones,
dongles, esports headsets, voice remotes, and low-power edge AI
processor applications.
Founded in 2014, Actions Technology Co., Ltd. was listed on the
SSE STAR in 2021. With headquarters in Zhuhai, we have
strategically located offices in Shenzhen, Hefei, Shanghai, Chengdu, Hong
Kong, and other locations. Facing the globe, our extensive
service network ensures seamless support to customers
worldwide.
For more information, visit www.actions-semi.com.
About Ceva, Inc.
At Ceva, we are passionate about
bringing new levels of innovation to the smart edge. Our wireless
communications, sensing and Edge AI technologies are at the heart
of some of today's most advanced smart edge products. From
Bluetooth connectivity, Wi-Fi, UWB and 5G platform IP for
ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded
application software that make devices smarter, we have the
broadest portfolio of IP to connect, sense and infer data more
reliably and efficiently. We deliver differentiated solutions that
combine outstanding performance at ultra-low power within a very
small silicon footprint. Our goal is simple – to deliver the
silicon and software IP to enable a smarter, safer, and more
interconnected world. This philosophy is in practice today, with
Ceva powering more than 17 billion of the world's most innovative
smart edge products from AI-infused smartwatches, IoT devices and
wearables to autonomous vehicles and 5G mobile networks.
Our headquarters are in Rockville,
Maryland with a global customer base supported by operations
worldwide. Our employees are among the leading experts in their
areas of specialty, consistently solving the most complex design
challenges, enabling our customers to bring innovative smart edge
products to market.
Ceva: Powering the Smart Edge™
Visit us at www.ceva-ip.com and follow us on LinkedIn, X,
YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.