Next-Generation AMD EPYC™ CPUs and Radeon™ Instinct GPUs Enable El Capitan Supercomputer at Lawrence Livermore National L...
March 04 2020 - 1:00PM
AMD (NASDAQ: AMD) today joined Lawrence Livermore National
Laboratory (LLNL) and HPE, in announcing that El Capitan, the
upcoming exascale class supercomputer at LLNL, will be powered by
next generation AMD EPYC™ CPUs, AMD Radeon™ Instinct GPUs and open
source AMD ROCm heterogeneous computing software.
With delivery expected in early 2023, the El Capitan system is
expected to be the world’s fastest supercomputer with more than 2
exaflops of double precision performance. This record setting
performance will support National Nuclear Security Administration
requirements for its primary mission of ensuring the safety,
security and reliability of the nation’s nuclear stockpile.
The AMD based nodes will be optimized to accelerate artificial
intelligence (AI) and machine learning (ML) workloads to
potentially enable the expanded use of AI and ML into the research,
computational techniques and analysis that benefits NNSA
missions.
“El Capitan will drive unprecedented advancements in HPC and AI,
powered by the next generation AMD EPYC CPUs and Radeon Instinct
GPUs,” said Forrest Norrod, senior vice president and general
manager, Datacenter and Embedded Systems Group, AMD. “Building on
our strong foundation in high-performance computing and adding
transformative coherency capabilities, AMD is enabling the NNSA
Tri-Lab community—LLNL and the Los Alamos and Sandia national
laboratories—to achieve their mission critical objectives and
contribute new AI advancements to the industry. We are extremely
proud to continue our exascale work with HPE and NNSA and look
forward to the delivery of the most powerful supercomputer in the
world expected in early 2023.”
AMD Technology Powering El CapitanAMD is
applying its experience from the high-performance computing
industry and advancing its existing CPU and GPU designs for El
Capitan, enabling the system to be architected for maximum
performance and ease of use.
AMD technology within El Capitan includes:
- Next generation AMD EPYC processors, codenamed “Genoa”
featuring the “Zen 4” processor core. These processors will support
next generation memory and I/O sub systems for AI and HPC
workloads,
- Next generation Radeon Instinct GPUs based on a new
compute-optimized architecture for workloads including HPC and AI.
These GPUs will use the next- generation high bandwidth memory and
are designed for optimum deep learning performance,
- The 3rd Gen AMD Infinity Architecture, which will provide a
high-bandwidth, low latency connection between the four Radeon
Instinct GPUs and one AMD EPYC CPU included in each node of El
Capitan. As well, the 3rd Gen AMD Infinity Architecture includes
unified memory across the CPU and GPU, easing programmer access to
accelerated computing,
- An enhanced version of the open source ROCm heterogenous
programming environment, being developed to tap into the combined
performance of AMD CPUs and GPUs, unlocking maximum
performance.
“This unprecedented computing capability, powered by advanced
CPU and GPU technology from AMD, will sustain America’s position on
the global stage in high performance computing and provide an
observable example of the commitment of the country to maintaining
an unparalleled nuclear deterrent,” said LLNL Lab Director Bill
Goldstein. “Today’s news provides a prime example of how government
and industry can work together for the benefit of the entire
nation.”
“We are pleased to partner with AMD to bring together HPE’s Cray
Shasta architecture with latest AMD EPYC CPUs and Radeon Instinct
GPUs and provide leadership technology in support of the mission
critical HPC and AI workloads for Lawrence Livermore National
Laboratory,” said Peter Ungaro, senior vice president and general
manager, HPC and Mission Critical Solutions (MCS) at HPE. “In our
three U.S. exascale wins this last year, which includes the U.S.
Department of Energy’s Frontier at Oak Ridge National Laboratory,
the HPE systems and technologies along with AMD processors and GPUs
have become a unique solution for high-performance and
exascale-class computing and we look forward to continuing our
collaboration to further bolster innovation.”
Additional Resources
- AMD Exascale Computing Technologies
- HPE Announcement
- Lawrence Livermore Labs Announcement
- Follow AMD datacenter developments on Twitter @AMDServer
About AMDFor 50 years AMD has driven innovation
in high-performance computing, graphics and visualization
technologies ― the building blocks for gaming, immersive platforms
and the datacenter. Hundreds of millions of consumers, leading
Fortune 500 businesses and cutting-edge scientific research
facilities around the world rely on AMD technology daily to improve
how they live, work and play. AMD employees around the world are
focused on building great products that push the boundaries of what
is possible. For more information about how AMD is enabling today
and inspiring tomorrow, visit the AMD (NASDAQ:AMD)
website, blog, Facebook and Twitter pages.
Cautionary Statement
This press release contains forward-looking statements
concerning Advanced Micro Devices, Inc. (AMD) including the
features, functionality, availability, timing, deployment and
expectations of an EPYC™ CPU and Radeon™ Instinct GPU powered
exascale class supercomputer with open source AMD ROCm
heterogeneous computing software, which are made pursuant to the
Safe Harbor provisions of the Private Securities Litigation Reform
Act of 1995. Forward-looking statements are commonly identified by
words such as "would," "may," "expects," "believes," "plans,"
"intends," "projects" and other terms with similar meaning.
Investors are cautioned that the forward-looking statements in this
presentation are based on current beliefs, assumptions and
expectations, speak only as of the date of this presentation and
involve risks and uncertainties that could cause actual results to
differ materially from current expectations. Such statements are
subject to certain known and unknown risks and uncertainties, many
of which are difficult to predict and generally beyond AMD's
control, that could cause actual results and other future events to
differ materially from those expressed in, or implied or projected
by, the forward-looking information and statements. Material
factors that could cause actual results to differ materially from
current expectations include, without limitation, the following:
Intel Corporation’s dominance of the microprocessor market and its
aggressive business practices; the ability of third party
manufacturers to manufacture AMD's products on a timely basis in
sufficient quantities and using competitive technologies; expected
manufacturing yields for AMD’s products; AMD's ability to introduce
products on a timely basis with features and performance levels
that provide value to its customers while supporting and coinciding
with significant industry transitions; AMD's ability to generate
sufficient revenue and operating cash flow or obtain external
financing for research and development or other strategic
investments; the loss of a significant customer; AMD's ability to
generate revenue from its semi-custom SoC products; global economic
uncertainty; political, legal and economic risks and natural
disasters; government actions and regulations such as export
administration regulations, tariffs and trade protection measures
may limit our ability export our products to certain customers;
potential security vulnerabilities; potential IT outages, data
loss, data breaches and cyber-attacks; the ability of
GLOBALFOUNDRIES Inc. to satisfy AMD’s manufacturing requirements;
uncertainties involving the ordering and shipment of AMD’s
products; quarterly and seasonal sales patterns; the restrictions
imposed by agreements governing AMD’s notes and the secured credit
facility; the competitive markets in which AMD’s products are sold;
the potential dilutive effect if the 2.125% Convertible Senior
Notes due 2026 are converted; the market conditions of the
industries in which AMD products are sold; AMD’s reliance on
third-party intellectual property to design and introduce new
products in a timely manner; AMD's reliance on third-party
companies for the design, manufacture and supply of motherboards,
software and other computer platform components; AMD's reliance on
Microsoft Corporation and other software vendors' support to design
and develop software to run on AMD’s products; and AMD’s reliance
on third-party distributors and add-in-board partners. Investors
are urged to review in detail the risks and uncertainties in AMD's
Securities and Exchange Commission filings, including but not
limited to AMD's Annual Report on Form 10-K for the year ended
December 28, 2019.
AMD, the AMD Arrow logo, EPYC, Radeon Instinct, and
combinations thereof, are trademarks of Advanced Micro Devices,
Inc. Other names are for informational purposes only and may be
trademarks of their respective owners.
Contact:
Gary Silcott
AMD Communications
+1 (512) 602-0889
Gary.Silcott@amd.com
Laura Graves
AMD Investor Relations
+1 (408) 749-5467
laura.graves@amd.com
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