Rambus Partners With Samsung to Develop 56G SerDes PHY on 10nm LPP Process
April 20 2017 - 4:30PM
Business Wire
Solution brings scalable ADC-based architecture
quickly to networking market, supporting transition to 400GbE
Ethernet
Rambus Inc. (NASDAQ:RMBS) today announced that it is
partnering with Samsung Electronics for its recently launched 56G
SerDes PHY to be developed on Samsung’s 10nm LPP (Low-Power Plus)
process technology.
The industry-leading 56G SerDes PHY delivers enterprise-class
performance across the challenging signaling environments typical
of high-speed communication systems and provides PAM-4 and NRZ
signaling with a scalable ADC-based (analog-to-digital converter)
architecture. This new, flexible architecture addresses the
long-reach backplane requirements for the industry transition to
400 GB Ethernet applications.
“There is a demand for increased bandwidth and higher
performance systems with the rise of data across enterprise
applications,” said Luc Seraphin, senior vice president and general
manager of the Rambus Memory and Interfaces Division. “Our
partnership with Samsung enables us to bring more solutions quickly
to market that address the process, power and performance
challenges of today’s complex data centers. We are pleased Samsung
has selected to work with us, following our successful partnership
of the 28G SerDes PHY on their 14nm LPP process technology.”
“Network application is one of our key segments of focus and the
composition of our 10LPP network solution and the Rambus 56G
solution will be the most competitive choice for high-performance
and low-power consumption,” said Ryan Lee, vice president of the
Foundry Marketing Team at Samsung Electronics. “Rambus has been a
long-term strategic partner with Samsung for high-speed SerDes IP,
and this 56G SerDes collaboration will pave the way for the
explosive data processing requirements to come.”
The Rambus industry-standard interface offerings are
high-quality, complete PHY solutions designed with a
system-oriented approach to maximize flexibility in today’s most
challenging system environments. For additional information, please
visit http://www.rambus.com/serdes.
For additional information on Rambus products and solutions,
please visit rambus.com.
Follow Rambus:
Company website: rambus.com
Rambus blog: rambus.com/blog
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc
About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and
services that solve the power, performance, and capacity challenges
of the communications and data center computing
markets. Rambus enhanced standards-compatible and custom
memory and serial link solutions include chips, architectures,
memory and SerDes interfaces, IP validation tools, and system and
IC design services. Developed through our system-aware design
methodology, Rambus products deliver improved
time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates innovative hardware and software technologies,
driving advancements from the data center to the mobile edge. Our
chips, customizable IP cores, architecture licenses, tools,
software, services, training and innovations improve the
competitive advantage of our customers. We collaborate with the
industry, partnering with leading ASIC and SoC designers,
foundries, IP developers, EDA companies and validation labs. Our
products are integrated into tens of billions of devices and
systems, powering and securing diverse applications, including Big
Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more
information, visit rambus.com.
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Rambus Inc.Agnes Toan, 408-462-8905Corporate
Communicationsatoan@rambus.com
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