TowerJazz Presents Novel Empirical Simulation Flow of ESD Protection Circuits at EOS/ESD Symposium 2016
September 14 2016 - 4:30AM
TowerJazz, the global specialty foundry leader, today announced its
participation at the EOS/ESD Symposium, the main ESD (electrostatic
discharge) technology forum worldwide, to demonstrate its novel
Empirical ESD Simulation Flow of ESD protection circuits for
reliable chip design. ESD protection is part of every IC developed
in the world and is part of all of TowerJazz customers’ products.
Empirical ESD Simulation Flow is a unique foundry offering which
supports TowerJazz customers by enabling an optimized solution both
in terms of cost and first time success.
This new simulation concept from TowerJazz is
designed to protect electronic devices in the case of an ESD event,
the sudden flow of electricity between two electronically charged
objects (caused by contact, an electrical short, or dielectric
breakdown), which can cause permanent damage or failure of solid
state electronics components such as integrated circuits
(ICs). Tailored ESD protection design is especially crucial
in applications where I/O customization is required such as in
power management and CMOS image sensors.
ESD is a major challenge in IC design as it
involves multiple electrical device phenomena which cannot be
simulated properly by conventional tools. Due to this complexity,
often times there are field-failures or over-design of ESD
structures, making them too large in size and thus increasing die
cost. TowerJazz addresses the challenges in ESD protection design,
which today lacks simple simulation capability. The absence of
reliable simulation tools may lead to ESD designs where the IC’s
core circuits are exposed to excessive voltages developed during
ESD current flow. The methods available so far to enable simulation
of ESD protection circuits are limited and involve complex
development of compact models.
TowerJazz’s new concept of Empirical ESD
Modeling enables dynamic simulation of ESD protection circuits. It
is demonstrated on snapback type protection devices which lack
simulation models for most manufacturing technologies offered by
foundries. The new concept is based on real device
measurements as opposed to theoretical calculations, therefore
providing more accurate and reliable simulation data for a given
technology. Implemented on a variety of circuits, it is
demonstrated directly on the IC layout using a fully automated
flow. All steps included in the preparation of the simulation are
done in the background without involvement of the designer.
“We are pleased to present this novel concept of
Empirical ESD Modeling at the EOS/ESD 2016 Symposium,” said Raz
Reshef, Director of IC Design, TowerJazz. “Based on close
relationships with our customers and evaluation of designers’
needs, TowerJazz has developed a wide range of devices and
protection schemes covering various IC pin types and
specifications.”
Dr. Efraim Aharoni, TowerJazz Leader of ESD
Development and Customer Support, will present “Empirical ESD
Simulation Flow for ESD Protection Circuits Based on Snapback
Devices” at EOS/ESD on September 14, 2016 in the session on EDA
tools for ESD validation. In addition to the presentation, a
10-page paper will be published in the conference proceedings.
Empirical ESD Modeling is an additional
important development in TowerJazz’s state-of-the-art ESD offering.
In particular, TowerJazz offers a full ESD solution including
scalable voltage ESD devices, scalable rating ESD devices, ESD
pcells, and programmable electronic rules check (PERC).
For more information, please contact Dr. Efraim
Aharoni, TowerJazz Leader of ESD Development and Customer Support
at efraim.aharoni@towerjazz.com.
About TowerJazzTower
Semiconductor Ltd. (NASDAQ:TSEM) (TASE:TSEM) and its fully owned
U.S. subsidiaries Jazz Semiconductor, Inc. and TowerJazz Texas
Inc., operate collectively under the brand name TowerJazz, the
global specialty foundry leader. TowerJazz manufactures integrated
circuits, offering a broad range of customizable process
technologies including: SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS,
CMOS image sensor, integrated power management (BCD and 700V), and
MEMS. TowerJazz also provides a world-class design enablement
platform for a quick and accurate design cycle as well as Transfer
Optimization and development Process Services (TOPS) to IDMs and
fabless companies that need to expand capacity.
To provide multi-fab sourcing and extended
capacity for its customers, TowerJazz operates two manufacturing
facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and
three additional facilities in Japan (two 200mm and one 300mm)
through TowerJazz Panasonic Semiconductor Co.
(TPSCo), established with Panasonic Corporation of which
TowerJazz has the majority holding. Through TPSCo, TowerJazz
provides leading edge 45nm CMOS, 65nm RF CMOS and 65nm 1.12um pixel
technologies, including the most advanced image sensor
technologies. For more information, please visit www.towerjazz.com
or www.tpsemico.com.
Safe Harbor Regarding Forward-Looking
StatementsThis press release includes forward-looking
statements, which are subject to risks and uncertainties. Actual
results may vary from those projected or implied by such
forward-looking statements. A complete discussion of risks and
uncertainties that may affect the accuracy of forward-looking
statements included in this press release or which may otherwise
affect TowerJazz’s business is included under the heading "Risk
Factors" in Tower’s most recent filings on Forms 20-F, F-3, F-4 and
6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority and Jazz’s most recent
filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly
disclaim any obligation to update, the information contained in
this release.
TowerJazz Company Contact:
Limor Silberberg | +972-4-604-7249|
limor.silberberg@towerjazz.com TowerJazz Investor
Relations Contact: Noit Levi | +972-4-604-7066 |
noit.levi@towerjazz.com
Press release (PDF):
http://hugin.info/167229/R/2042060/762119.pdf
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