Intel Announces New Packaging and Test Technologies for Foundry Customers
August 27 2014 - 12:00PM
Business Wire
New Technologies to Improve Time to Market
and Reduce Costs
Intel Corporation today announced two new technologies for Intel
Custom Foundry customers that need cost-effective advanced
packaging and test technologies.
Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm
foundry customers, is a breakthrough that enables a lower cost and
simpler 2.5D packaging approach for very high density interconnects
between heterogeneous dies on a single package. Instead of an
expensive silicon interposer with TSV (through silicon via), a
small silicon bridge chip is embedded in the package, enabling very
high density die-to-die connections only where needed. Standard
flip-chip assembly is used for robust power delivery and to connect
high-speed signals directly from chip to the package substrate.
EMIB eliminates the need for TSVs and specialized interposer
silicon that add complexity and cost.
“The EMIB technology enables new on-package functionality that
may have been too costly to pursue with previous solutions,” said
Babak Sabi, Intel vice president and director, Assembly and Test
Technology Development.
Intel also announced the availability of its revolutionary High
Density Modular Test (HDMT) platform. HDMT, a combination of
hardware and software modules, is Intel’s test technology platform
that targets a range of products in diverse markets including
server, client, system on chip, and Internet of Things. Until now,
this capability was only available internally for Intel products.
Today’s announcement makes HDMT available to customers of Intel
Custom Foundry.
“We developed the HDMT platform to enable rapid test development
and unit-level process control. This proven capability
significantly reduces costs compared to traditional test platforms.
HDMT reduces time to market and improves productivity as it uses a
common platform from low-volume product debug up to high-volume
production,” said Sabi.
EMIB is available to foundry customers for product sampling in
2015 and HDMT is available immediately.
About Intel
Intel (NASDAQ:INTC) is a world leader in computing innovation.
The company designs and builds the essential technologies that
serve as the foundation for the world’s computing devices. As
a leader in corporate responsibility and sustainability, Intel also
manufactures the world’s first commercially available
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Intel CorporationChuck Mulloy, 408-765-3484cmulloy@intel.com
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