Applied Materials Introduces CVD and CMP Systems for 3D Architectures
July 07 2014 - 7:30AM
SANTA CLARA, Calif., July 7, 2014 - Demonstrating its expertise in
precision materials engineering, Applied Materials, Inc. today
announced two new systems that help customers solve critical
challenges in manufacturing high-performance, power-efficient 3D
devices. The Applied Reflexion® LK Prime(TM)
CMP system provides superior wafer polishing performance with
nanometer-level precision for FinFET and 3D NAND applications. The
Applied Producer® XP
Precision(TM) CVD system
solves the demanding, fundamental deposition challenges presented
by vertical 3D NAND architectures. These new CMP* and CVD* tools
directly address precision, materials and defect issues, enabling
3D designs to reach high-volume manufacturing.
"Trends in mobility are driving the need for
complex 3D architectures that demand significant engineering
innovations," said Dr. Randhir Thakur, executive vice president and
general manager of the Silicon Systems Group at Applied Materials.
"An entire spectrum of new technologies and materials are needed
for these designs to achieve optimum device performance and high
yields. Multiple customers are adopting the tools we are launching
today, demonstrating the value of our latest technologies in
transitioning their advanced 3D logic and memory designs into
volume manufacturing."
CMP is a critical enabler for the FinFET gate and
the staircase structure in 3D NAND. The Reflexion LK Prime CMP
system is designed to address the exacting requirements of these
new device architectures which can require as many as 10 additional
polishing steps. Featuring an unprecedented six polishing stations
and eight integrated cleaning stations with advanced process
control technologies, the LK Prime tool supports the added CMP
steps with precision processing, enabling customers to improve
on-wafer performance and throughput. The increase in processing
modules doubles wafer throughput for many applications, providing
up to a 100 percent boost in productivity.
The capability to independently utilize each
polish and cleaning station gives chipmakers new levels of
flexibility to customize polishing passes to precisely control
feature dimensions and reduce defects. Real-time profile and
endpoint control technologies included on the LK Prime system
provide within-wafer uniformity and wafer-to-wafer repeatability
that can meet future device node requirements. Using all these
attributes, the LK Prime system controls FinFET gate height with
nanometer-level uniformity for every die. This is vital as the
smallest variation in gate height impacts device performance and
yield. For the thicker film layers and broad topography of 3D NAND
that need long, steady polishes, the multiple process stations
enable stable, predictable planarization.
The 3D NAND industry inflection also requires
enabling deposition technology for vertical gate formation and
complex patterning applications. The Producer XP Precision CVD
system supports the 3D NAND transition by delivering essential
nanometer-level layer-to-layer film thickness control for excellent
CD* uniformity across the wafer. Key to this performance is the
system's proprietary design and unique capability to tune crucial
parameters that include temperature, plasma, and gas flow.
Providing this engineering flexibility to customers supports the
alternate deposition of different high-quality, low-defect films
with exceptional stress control and uniformity within-wafer,
wafer-to-wafer and layer-to-layer to improve gate performance and
reduce device variability.
Designed for high-volume manufacturing, the XP
Precision system combines production-proven Producer CVD technology
with more efficient, faster processing chamber technology. A new
modular mainframe architecture and high speed protocol further
increase high-throughput density and low cost of ownership.
Offering dramatic improvements in precision deposition that make
possible thinner, superior quality materials for patterning and
multi-layer film stacks on a highly productive platform, the XP
Precision system supports continued 3D NAND scaling.
Applied Materials, Inc. (Nasdaq:AMAT) is the
global leader in precision materials engineering solutions for the
semiconductor, flat panel display and solar photovoltaic
industries. Our technologies help make innovations like
smartphones, flat screen TVs and solar panels more affordable and
accessible to consumers and businesses around the world. Learn more
at www.appliedmaterials.com.
*CMP = chemical mechanical planarization; CVD =
chemical vapor deposition; CD = critical dimension
# # #
Contact:
Connie Duncan (editorial/media) 408.563.6209
Michael Sullivan (financial community) 408.986.7977
PHOTO: Applied Reflexion® LK Prime™
CMP system
PHOTO: Applied Producer® XP Precision™ CVD system
This
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The issuer of this announcement warrants that they are solely
responsible for the content, accuracy and originality of the
information contained therein.
Source: Applied Materials via Globenewswire
HUG#1814914
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