MOUNTAIN VIEW, Calif. and
SAN DIEGO, Feb. 20, 2019 /PRNewswire/ -- In advance of
MWC19™, CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal
processing platforms and artificial intelligence processors for
smarter, connected devices, and Nurlink, a fabless IC design
company specializing in cellular IoT wireless communications, today
announced the introduction of Nurlink's NK6010 3GPP Rel.14 eNB-IoT
System-on-Chip (SoC) powered by the CEVA-Dragonfly NB2 IP
solution.
NK6010 is a highly cost and power efficient NB-IoT SoC designed
specifically to enable narrowband connectivity in massive IoT
devices such as smart meters, wearables, asset trackers and
industrial sensors. The SoC, built around the CEVA-Dragonfly
NB2 solution, incorporates RF front-end, RF transceiver, cellular
baseband, power management unit and application processor, all
highly-integrated to minimize the size and cost of the solution. It
supports all NB-IoT frequency bands and major global carriers,
ensuring smooth and rapid certification of devices on any NB-IoT
commercial network around the world. The SoC also includes an
extremely low-power multi-GNSS subsystem, supporting
GPS/Beidou/Galileo/GLONASS global navigation systems, to ensure
highly-accurate device tracking and locating, worldwide.
"We developed NK6010 to meet the exceptional demand for NB-IoT
chipsets to power the multitude of new use cases and applications
that narrowband cellular connectivity serves," said Dr.
Xiaohua Kong, Nurlink CEO. "The
CEVA-Dragonfly NB2 enabled us to massively accelerate our
time-to-market by providing many of the key building blocks for our
SoC design, already silicon proven and pre-integrated. In addition,
through the programmable nature of the Dragonfly solution, our
engineering team were able to add our innovation during the
communication system development and SoC customization. This
framework eventually helped us to create a truly differentiated
product. Our path from licensing to silicon was achieved in under
one year, and we're now engaged with operators worldwide to certify
our SoC."
Michael Boukaya, vice president and general manager of the
wireless business unit at CEVA, stated: "NB-IoT has reached
critical mass, with more than 60 operators around the world already
supporting the standard and dozens more launching coverage
imminently. Now the drive towards ultra-low cost NB-IoT chipsets
and modules has begun and Nurlink, powered by our CEVA-Dragonfly
NB2 IP solution, is one of the early entrants into this fast
growing space. We applaud their efforts to reach the market so
quickly and look forward to monitoring their success."
The CEVA-Dragonfly NB2 IP solution is a modular technology,
composed of the CEVA-X1 IoT processor, an optimized RF Transceiver,
baseband, and a protocol stack to offer a complete Release 14
Cat-NB2 modem IP solution that significantly reduces time-to-market
and lowers entry barriers. It is a fully software-configurable
solution and can be extended with multi-constellation GNSS and
sensor fusion functionality. The IP includes a reference silicon of
the complete modem design, including an embedded CMOS RF
transceiver and PA, an advanced digital front-end, physical layer
firmware, and a protocol stack (MAC, RLC, PDCP, RRC, and NAS). For
more information, visit https://www.ceva-dsp.com/product/dragonfly.
About Nurlink
Nurlink Technology, founded in 2017, is
a fabless IC design company with subsidiaries and offices in
California, Nanjing, Shenzhen, Beijing, and Hong
Kong. Leveraging its world-class talents in RF analog,
modem, GNSS, and SoC systems and software, Nurlink Technology
commits to creating the best RF/SoC chips for powering the
next-generation cellular IoT wireless communications, i.e. mMTC,
while enabling significant cost and performance advantages for
customers. The current product portfolio from Nurlink Technology
includes NB-IoT and cat-M SoCs, serving numerous markets including
smart meter, smart city, wearables, asset tracking, and more. For
more information visit http://www.nurlink.com.
About CEVA, Inc.
CEVA is the leading licensor of
signal processing platforms and artificial intelligence processors
for a smarter, connected world. We partner with semiconductor
companies and OEMs worldwide to create power-efficient, intelligent
and connected devices for a range of end markets, including mobile,
consumer, automotive, industrial and IoT. Our ultra-low-power IPs
for vision, audio, communications and connectivity include
comprehensive DSP-based platforms for LTE/LTE-A/5G baseband
processing in handsets, infrastructure and cellular IoT (NB-IoT and
Cat-M) enabled devices, advanced imaging and computer vision for
any camera-enabled device, audio/voice/speech and ultra-low power
always-on/sensing applications for multiple IoT markets. For
artificial intelligence, we offer a family of AI processors capable
of handling the complete gamut of neural network workloads,
on-device. For connectivity, we offer the industry's most widely
adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi
(Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to
4x4). Visit us at www.ceva-dsp.com and follow us on Twitter,
YouTube, Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.