Flex Logix® EFLX embedded FPGA
brings reconfigurable computing to CEVA-X2 DSP instruction
extension to support demanding and changing workloads
MOUNTAIN
VIEW, Calif., June 27,
2022 /PRNewswire/ -- Flex Logix®
Technologies, Inc., the leading supplier of reconfigurable
computing solutions, architecture and software, and CEVA, Inc.
(NASDAQ: CEVA), the leading licensor of wireless connectivity and
smart sensing technologies and integrated IP solutions, have
announced today the world's first successful silicon implementation
using Flex Logix's EFLX® embedded FPGA (eFPGA) connected
to a CEVA-X2 DSP instruction extension interface. Enabling flexible
and changeable instruction sets to meet demanding and changing
processing workloads, the ASIC, known as SOC2, was designed and
taped out in a TSMC 16 nm technology by Bar-Ilan University SoC Lab, as part of the HiPer
Consortium, backed by the Israeli Innovation Authority (IIA).
"The ability to add custom instructions to minimize power and
maximize performance efficiency of embedded processors has been
around for decades," said Andy
Jaros, VP of Sales and Marketing for Flex Logix's eFPGA IP.
"The ISA extension capability works great for targeted
applications, but it can be a costly solution when the application
changes or new use cases need different instructions requiring a
new chip to be developed. By working with CEVA and the HiPer
Consortium, the SOC2 proves that reconfigurable computing is here
with a DSP Instruction Set Architecture (ISA) that can be adapted
to different workloads with custom hard-wired instructions that can
be changed at any time in the future."
"Being part of the HiPer Consortium, we were excited to work
with Bar-Ilan University SoC Lab team
and Flex Logix to test out new capabilities for the CEVA-X2 DSP
that had never been tried before," said Erez Bar-Niv, CEVA's Chief Technology Officer.
"The SOC2 contains two processing clusters, each containing two
CEVA-X2 DSP cores and EFLX eFPGA for programming and executing DSP
instructions extensions, connected using the CEVA-Xtend mechanism.
Flex Logix and CEVA's mutual customers can now confidently utilize
custom instructions to extract more value from their ASIC by being
able to target different DSP applications on top of communication
and sound with a customizable ISA post manufacturing."
EFLX eFPGA can be used anywhere in an ASIC architecture. In
addition to the ISA extension interface, EFLX has been used for
packet processing, security, encryption, IO muxes, and general
purpose algorithm acceleration. Using EFLX, chip developers can
implement eFPGA from a few thousand LUTs to over a million LUTs
with performance and density per square millimeter similar to
leading FPGA companies in the same process generation. EFLX eFPGA
is modular so arrays can be spread throughout the chip, can have
all-logic or be heavy-DSP, and can integrate RAM. EFLX eFPGA is
available today in popular 12, 16, 22, 28 and 40 nm process nodes
and in development at 7 nm with more advanced nodes planned for
future release.
Product briefs for EFLX eFPGA are available now at
https://www.flex-logix.com/resources/
The CEVA-X2 is a multipurpose hybrid DSP and Controller based on
a 5-way VLIW/SIMD architecture with a 10-stage pipeline, operating
at over 1GHz at a 16nm process. As an advanced DSP optimized for
intensive workloads, it has been specifically designed to tackle
use-cases such as 5G PHY control, multi-microphone beamforming, AI
processing and neural network implementations. CEVA-X2 supports
various software needs using the extensive CEVA DSP Library, CEVA
Neural Network Library, and a vast ecosystem partner offerings of
software solutions for any application. For more information on
CEVA's DSP product offerings for communication and sound, based on
CEVA-X2 and its successor CEVA-BX2,
visit https://www.ceva-dsp.com/app/wireless-communication/ and
https://www.ceva-dsp.com/app/audio-voice-and-speech/
About Flex Logix
Flex Logix is a reconfigurable computing company providing AI
inference and eFPGA solutions based on software, systems and
silicon. Its InferX X1 is the industry's most-efficient AI
edge inference accelerator that will bring AI to the masses in
high-volume applications by providing much higher inference
throughput per dollar and per watt. Flex Logix's eFPGA platform
enables chips to flexibly handle changing protocols, standards,
algorithms, and customer needs and to implement reconfigurable
accelerators that speed key workloads 30-100x compared to general
purpose processors. Flex Logix is headquartered in Mountain View, California and has offices in
Austin, Texas and Vancouver, Canada. For more information,
visit https://flex-logix.com.
About CEVA, Inc.
CEVA is the leading licensor of wireless connectivity and smart
sensing technologies and integrated IP solutions for a smarter,
safer, connected world. We provide Digital Signal Processors, AI
engines, wireless platforms, cryptography cores and complementary
software for sensor fusion, image enhancement, computer vision,
voice input and artificial intelligence. These technologies are
offered in combination with our Intrinsix IP integration services,
helping our customers address their most complex and time-critical
integrated circuit design projects. Leveraging our technologies and
chip design skills, many of the world's leading semiconductors,
system companies and OEMs create power-efficient, intelligent,
secure and connected devices for a range of end markets, including
mobile, consumer, automotive, robotics, industrial, aerospace &
defense and IoT.
Our DSP-based solutions include platforms for 5G baseband
processing in mobile, IoT and infrastructure, advanced imaging and
computer vision for any camera-enabled device, audio/voice/speech
and ultra-low-power always-on/sensing applications for multiple IoT
markets. For sensor fusion, our Hillcrest
Labs sensor processing technologies provide a broad range of
sensor fusion software and inertial measurement unit ("IMU")
solutions for markets including hearables, wearables, AR/VR, PC,
robotics, remote controls and IoT. For wireless IoT, our platforms
for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6/6E
(802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most
broadly licensed connectivity platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube,
Facebook, LinkedIn and Instagram.
MEDIA CONTACTS
Kelly Karr
Tanis Communications for Flex Logix
kelly.karr@taniscomm.com
+408-718-9350
CEVA
Richard Kingston
CEVA, Inc.
+1 650-417-7976
richard.kingston@ceva-dsp.com
Joyce Yip
Publitek for CEVA
+44 7967 765798
joyce.yip@publitek.com
Copyright 2022. All rights reserved. Flex Logix and EFLX are
registered trademarks of Flex Logix, Inc.
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SOURCE Flex Logix Technologies, Inc.