Adesto’s EcoXiP™ Solution Improves XiP Performance, Reduces Power and Cost for NXP’s New Crossover Embedded Processors
November 29 2017 - 4:05PM
Adesto Technologies (NASDAQ:IOTS), a leading provider of
application-specific, ultra-low power non-volatile memory products,
today announced its EcoXiP™ family of products, paired with NXP®
Semiconductor’s new i.MX RT1050 microcontroller, provide embedded
system designers the lowest power, lowest latency XiP system
operation available today. EcoXiP, eXecute-in-Place (XiP) memory,
more than doubles processor performance, lowers system power
consumption and reduces system cost compared to standard serial
peripheral interface (SPI) devices.
NXP engineers designed the i.MX RT1050 with no on-board Flash to
increase performance and reduce total solution cost. “Shedding the
burden of on-board flash reduces costs and helps enable higher
frequency operation for increased processor performance and enables
product designers to boost capabilities, increase efficiency and
add more features,” said Joe Yu, VP, GM Low-Power MPU and LPC MCU
Product Line at NXP Semiconductors. “NXP’s Crossover i.MX RT1050
with an Arm Cortex-M7 core is designed to run up to 600MHz (3036.50
CoreMark score) and coupled with the low-power, external memory
such as Adesto’s EcoXIP can help address customers performance and
cost requirements.”
The new crossover embedded processors are aimed at consumer,
industrial, IoT and other applications that demand the performance
and capabilities of an applications processor-based design, but
with the ease-of-use, low-power, and real-time operation of a
microcontroller system. The addition of XiP memory also provides
these systems the ability to perform over-the-air (OTA) updates, a
requisite function for many end devices.
Until now, for XiP systems to hit these performance targets,
designers have been required to invest in memory solutions that are
expensive, power-hungry and performance limiting. Built on an
innovative memory and protocol architecture, EcoXiP overcomes these
challenges.
“The introduction of low power XiP systems will pave the way for
applications that need better energy efficiency and lower cost,”
said Gideon Intrater, Adesto’s Chief Technology Officer. “The NXP
RT1050 is the first MCU to take full advantage of the efficiencies
and performance benefits that our EcoXiP memory can offer. We’re
excited to demonstrate the advantages that our collaboration offers
to system designers.”
The EcoXip Advantage
Benefits of EcoXiP include:
– High system performance: EcoXiP delivers 2.4X CPU
performance compared to existing quad devices and 1.4X CPU
performance compared to best-in-class octal devices
– Optimized latency and throughput: a high-speed, octal DDR
interface with a proprietary pre-fetching scheme reduces the
effective latency dramatically and delivers superior CPU
performance
– Concurrent Read/Write capability: designers can reduce
system cost since in most cases there is no need for an additional
Flash device to handle over-the-air updates or data logging
– Memory size flexibility: optimized densities from 32Mb to
128Mb enable IoT SoC designers to optimize for their specific
application, with the ability to change memory capacity as their
needs change without the expense of redesigning their SoCs
– Best standby power: configurable strength IO pins and a
range of power management features lead to improved device and
system power consumption
– Enhanced security with on-chip unique-ID One-Time
Programmable (OTP) security registers
Adesto will demonstrate the collaborative advantages of the
RT1050 with EcoXiP memory at the Embedded Systems Conference in San
Jose, CA on December 6-7, 2017. Samples of Adesto’s EcoXiP
are available now.
About Adesto Technologies
Adesto Technologies (NASDAQ:IOTS) is a leading provider of
application-specific, ultra-low power, smart non-volatile memory
products. The company has designed and built a portfolio of
innovative products with intelligent features to conserve energy
and enhance performance, including Fusion Serial Flash, DataFlash®,
EcoXiP™ and products based on its trademark resistive RAM
technology called Conductive Bridging RAM (CBRAM®).
Adesto Technologies and the Adesto logo are trademarks of Adesto
Technologies in the United States and other regions. All other
trademarks are property of their respective owners. For more
information visit: www.adestotech.com.
Company Contact:David VieraDirector, Corporate
Communications408-419-4844david.viera@adestotech.com
Adesto Technologies Investor Relations:Shelton
GroupLeanne K. Sievers, Executive Vice PresidentP:
949-224-3874E: sheltonir@sheltongroup.com
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