GBT's first
3D, Multiplanar Microchip
Continuation Patent Granted
GBT's first continuation patent
strengthening the new multi-dimensional integrated circuit's
architecture and manufacturing concepts
Patent Granted on August 9,
2022
San Diego, CA -- August 25, 2022 -- InvestorsHub
NewsWire -- GBT Technologies Inc. (OTC
PINK: GTCH )
("GBT" or the "Company"), first 3D, Multi-Planar IC design and
manufacturing technology, continuation patent, was granted by the
United Stated Patent and Trademark Office ("USPTO") on August 9,
2022. The first continuation patent is focused on strengthening the
new microchip's design and manufacturing concepts and
methodologies. A second continuation patent was filed on July 29,
2022, seeking to protect the memory integrated circuit's
architecture and connectivity structures. The original
nonprovisional patent protects a system and method to design and
manufacture microchips on multi-plane surfaces, enabling placing
more electronic circuits on chips, with the goal of enabling faster
performance and better electrical characteristics. GBT recently
filed an additional patent to enhance its 3D, multi-dimensional
concepts. This patent describes a system and method to analyze,
calculate and determine the optimal 3D, multi-planar shape to
manufacture a chip according to a desired process dimension.
The goal of such system, when fully developed, is to predict
the most optimal 3D, multidimensional shape to best fit a selected
design node.
GBT has
invested effort in the integrated circuit field and related EDA
design automation technologies, with the goal of developing
innovative systems and methods to design and manufacture the next
generation of the world's semiconductor projects. Its 3D,
multi-dimensional microchip architecture IP introduces methods to
design and manufacture integrated circuits to fit advanced analog,
digital, and mixed type ICs on a silicon wafer. The goal is to
apply this type of technology in various fields including AI,
medical, autonomous vehicles and industrial technologies.
"We
have invested significant effort in the integrated circuits arena
and we believe that we have developed advancements for the next era
of electronics. Our 3D, multi planar patents are aimed to create
new horizons for the semiconductor production capacity and its
ability to produce cutting-edge chips. Integrated Circuits are
vital to our economy and national security, dictating innovations
across a wide range of modern technologies. GBT filed three patents
in the multi-dimensional field so far and few more in the IC EDA
domain. We recently witnessed an increase in the U.S. efforts to
make domestic investment in the field as many sectors are directly
affected by the semiconductor arena, among them are automotive,
data storage, aerospace, medical and industrial technologies. Our
world of electronics endlessly demands more circuitries on chips,
faster performance, lower power and with cheaper price. We believe
that our design, if fully developed, will provide a solution to
pioneer the industry into new limits, with the goal of introducing
innovative design and manufacturing methods. We foresee that the
future for the US semiconductor industry will be focused on
building new technologies manufacturing plants, and further
investing in advanced R&D in this arena. We believe our
3D, multi-planar intellectual property can lead the industry to the
next generation of integrated circuits" stated Danny Rittman, GBT's
CTO.
About Us
GBT
Technologies, Inc. (OTC
PINK: GTCH) ("GBT") (http://gbtti.com)
is a development stage company which considers itself a native of
Internet of Things (IoT), Artificial Intelligence (AI) and Enabled
Mobile Technology Platforms used to increase IC performance. GBT
has assembled a team with extensive technology expertise and is
building an intellectual property portfolio consisting of many
patents. GBT's mission, to license the technology and IP to
synergetic partners in the areas of hardware and software. Once
commercialized, it is GBT's goal to have a suite of products
including smart microchips, AI, encryption, Blockchain, IC design,
mobile security applications, database management protocols, with
tracking and supporting cloud software (without the need for GPS).
GBT envisions this system as a creation of a global mesh network
using advanced nodes and super performing new generation IC
technology. The core of the system will be its advanced microchip
technology; technology that can be installed in any mobile or fixed
device worldwide. GBT's vision is to produce this system as a low
cost, secure, private-mesh-network between all enabled devices.
Thus, providing shared processing, advanced mobile database
management and sharing while using these enhanced mobile features
as an alternative to traditional carrier services.
Forward-Looking Statements
Certain
statements contained in this press release may constitute
"forward-looking statements". Forward-looking statements
provide current expectations of future events based on certain
assumptions and include any statement that does not directly relate
to any historical or current fact. Actual results may differ
materially from those indicated by such forward-looking statements
because of various important factors as disclosed in our filings
with the Securities and Exchange Commission located at their
website ( http://www.sec.gov).
In addition to these factors, actual future performance, outcomes,
and results may differ materially because of more general factors
including (without limitation) general industry and market
conditions and growth rates, economic conditions, governmental and
public policy changes, the Company's ability to raise capital on
acceptable terms, if at all, the Company's successful development
of its products and the integration into its existing products and
the commercial acceptance of the Company's products. The
forward-looking statements included in this press release represent
the Company's views as of the date of this press release and these
views could change. However, while the Company may elect to
update these forward-looking statements at some point in the
future, the Company specifically disclaims any obligation to do
so. These forward-looking statements should not be relied
upon as representing the Company's views as of any date subsequent
to the date of the press release.
Contact:
Dr. Danny Rittman,
CTO
press@gopherprotocol.com