Kulicke & Soffa Introduces New Offerings at SEMICON China 2018
March 09 2018 - 9:05AM
Business Wire
Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke
& Soffa”, “K&S” or the “Company”) will be showcasing newly
launched equipment and marketing leading packaging solutions during
SEMICON China 2018 trade show at Shanghai New International Expo
Center (SNIEC) in Shanghai from March 14 to 16.
The latest range of solutions, RAPID™ Pro GEN-S (Smart)
Series ball bonder and OptoLux™ ball bonder for LED will be
featured at the SEMICON China trade show. The RAPID™ Pro introduces
advanced process capabilities with real-time monitoring and
diagnostics to ensure highest yield, while the high speed OptoLux™
is set to revolutionize the wire bonding in LED market focusing on
ease-of-use with recommended start-up parameters to facilitate
process optimization. In addition to these, the Company will be
demonstrating capabilities of its high performance APAMA™ DA
die attach, latest multifunctional iFlex T2 equipment,
together with its broad range of aftermarket products and services
comprise of spares, consumables, software, repair and refurbishment
services.
Hoang Huy Hoang, Kulicke & Soffa’s Senior Vice President of
Global Sales & Aftermarket Products and Services Business Unit,
said, “The semiconductor market continues to evolve rapidly with
increasing demand of highly complex and more integrated packaging
technologies. Apart from providing our customers with innovative
and high-performance equipment to address these challenges, we want
to extend our support through a full range of aftermarket solutions
to improve uptime, enhance asset utilization and augment fleet and
process management.”
Customers can see the full assembly of solutions at the SEMICON
China trade show in Shanghai, China, Hall N3, Booth #3409.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of
semiconductor packaging and electronic assembly solutions
supporting the global automotive, consumer, communications,
computing and industrial segments. As a pioneer in the
semiconductor space, K&S has provided customers with market
leading packaging solutions for decades. In recent years, K&S
has expanded its product offerings through strategic acquisitions
and organic development, adding advanced packaging, electronics
assembly, wedge bonding and a broader range of expendable tools to
its core offerings. Combined with its extensive expertise in
process technology and focus on development, K&S is well
positioned to help customers meet the challenges of packaging and
assembling the next-generation of electronic devices.
(www.kns.com)
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version on businesswire.com: http://www.businesswire.com/news/home/20180309005116/en/
Kulicke & Soffa Industries, Inc.Marilyn SimPublic
RelationsP: +65-6880-9309F: +65-6880-9580msim@kns.comorJoseph
ElgindyInvestor Relations & Strategic InitiativesP:
+1-215-784-7500F: +1-215-784-6180investor@kns.com
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