California Micro Devices to Present WLCSP Paper and Host Panel at IMAPS in Scottsdale
March 18 2008 - 11:40AM
PR Newswire (US)
CMD Paper on New Re-Passivation Technology to be Presented as Part
of WLCSP Forum Program Track SCOTTSDALE, Ariz., March 18
/PRNewswire-FirstCall/ -- California Micro Devices announced it
would deliver a technical paper on a new CSP repassivation
technology designed to minimize parasitic elements in ASIP(TM)
(Application Specific Integrated Passive(TM)) products at the IMAPS
4th Annual International Conference and Exhibition on Device
Packaging, March 17th through March 20th, 2008, at the Radisson
Fort McDowell Resort and Casino in Scottsdale, Arizona. The
presentation will be part of a technical track of papers sponsored
by the Wafer Level Chip Scale (WLCSP) Forum on wafer level chip
scale package board reliability. New CSP Manufacturing Technology
Improves ASIP Performance and Reliability The paper, entitled "A
Novel Re-Passivation/RDL CSP Technology for Minimizing Parasitic
Elements in ASIP Products," addresses the role of parasitic
capacitances in WLCSP technologies and presents an optimized
re-passivation and RDL technology for WLCSP that can lead to
improved electrical performance in CSP based electrostatic
discharge (ESD) protection products and electromagnetic
interference (EMI) filters and enhanced thermo-mechanical
reliability. The paper will be presented by Dr. Umesh Sharma,
director of Foundry Engineering and Operations at California Micro
Devices. The paper will be available for downloading from the
corporate website after the conference by going to:
http://www.cmd.com/applications/papers.php, or from the Wafer Level
Chipscale Forum website at: http://www.wlcspforum.org/. Panel
Discussion on WLCSP Reliability During the IMAPS device packaging
conference, the WLCSP Forum will host two panel discussions on
WLCSP board reliability. The first session, taking place on March
18th, will feature a presentation on California Micro Devices' new
re-passivation and RDL CSP technology and four other technical
papers written and presented by WLCSP Forum members. The panel
discussion will be co-hosted by Kyle Baker, California Micro
Devices' vice president of marketing and the Chairman of the WLCSP
Forum. About California Micro Devices Corporation California Micro
Devices Corporation is a leading supplier of application specific
analog and mixed signal semiconductor products for the mobile
handset, digital consumer electronics and personal computer
markets. Key products include protection devices for mobile
handsets, digital consumer electronics products such as digital
TVs, and personal computers as well as analog and mixed signal ICs
for mobile handset displays. Detailed corporate and product
information may be accessed at http://www.cmd.com/. ASIP and
Application Specific Integrated Passive are trademarks of
California Micro Devices Corporation. All trademarks are property
of their respective owners. DATASOURCE: California Micro Devices
CONTACT: Richard Haas of California Micro Devices, +1-408-934-3108,
Web site: http://www.cmd.com/
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