SUNNYVALE, Calif., June 17, 2020 /PRNewswire/ -- Rambus
Inc. (NASDAQ: RMBS), a premier silicon IP and chip
provider making data faster and safer, today announced it has
expanded its portfolio of high-speed interface IP on TSMC's
industry-leading 7nm process with the addition of its
silicon-demonstrated 112G XSR/USR PHY. Offering unmatched power and
area efficiency for next-generation applications, the 112G XSR/USR
PHY is a critical enabler of chiplet and CPO architectures for data
center, networking, 5G, HPC and AI/ML applications.
"Chiplets are already entering mainstream markets to enable
cost-effective, high-performance products and to maintain signal
integrity across variable physical distances," said Shane Rau, research vice president, computing
semiconductors at IDC. "SerDes PHYs at advanced process nodes, like
the 7nm 112G XSR, enable that speed and signal integrity."
The accelerated trend of disaggregation of large SoCs into
multiple smaller chiplets demands faster time to market, yield
improvement and design flexibility. The Rambus 112G XSR/USR PHY is
a critical enabler of the D2D and D2OE interconnects for chiplet
architectures. Implemented on TSMC's advanced process technology,
this chiplet connectivity solution has been demonstrated in silicon
to exceed the challenging reach/BER performance of the CEI-112G XSR
specification, and supports NRZ and PAM-4 signaling at various data
rates for maximum design flexibility.
"We're pleased with the availability of Rambus' PHY on our N7
process technology to address the growing market need for
low-power, high-performance chiplet architectures," said
Suk Lee, senior director of the
Design Infrastructure Management Division at TSMC. "Our ongoing
partnership with Rambus ensures that designers can meet
next-generation requirements for performance and power efficiency
in computing, AI/ML and networking using TSMC's advanced process
technologies."
Leading-edge applications moving to chiplet architectures
include next-generation 51.2 Terabit per second (Tbps) ASICs for
network switches, where 112G XSR links will connect the digital
switch ASIC die to CPO engines. In AI/ML and HPC SoCs, the 112G XSR
PHY can be used to bridge purpose-built accelerator chiplets for
natural language processing, video transcoding and image
recognition. Another popular use case is the die disaggregation of
large SoCs, hitting reticle size limits for manufacturable yields,
into multiple smaller die connected using XSR links over organic
substrate. Increasingly, these advanced applications are
implemented on TSMC's N7 process.
"This important milestone highlights Rambus' leadership in
high-speed SerDes enabling the industry's highest value and most
demanding applications," said Hemant Dhulla, vice president and
general manager of IP cores at Rambus. "At an industry-leading
power efficiency of sub-picojoule per bit, and unidirectional
bandwidth approaching two terabit per second per millimeter, we are
very proud to offer our 112G XSR/USR solution in partnership with
TSMC."
Availability
The Rambus 112G XSR/USR PHY is available
today for licensing and integrating into chiplet and SoC
designs.
Additional Information
For additional details about
the Rambus 112G XSR/USR PHY, please go to
https://www.rambus.com/interface-ip/serdes/112g-xsr-phy/
Follow Rambus:
Company website: rambus.com
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Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
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About Rambus Inc.
Rambus is a premier silicon IP and
chip provider that makes data faster and safer. With 30 years of
innovation, we continue to develop the foundational technology for
all modern computing systems. Leveraging our semiconductor
expertise, Rambus solutions speed performance, expand capacity and
improve security for today's most demanding applications. From data
center and edge to artificial intelligence and automotive, our
interface and security IP, and memory interface chips enable SoC
and system designers to deliver their vision of the future. For
more information, visit rambus.com.
Press Contact:
Cori
Pasinetti
Rambus Corporate Communications
t: (408) 462-8306
cpasinetti@rambus.com
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SOURCE Rambus Inc.