SEMATECH Selects Mattson Technology's 300 mm Advanced Strip System to Develop 45 nm Porous Low-k Interconnect Solutions
April 12 2005 - 9:30AM
PR Newswire (US)
SEMATECH Selects Mattson Technology's 300 mm Advanced Strip System
to Develop 45 nm Porous Low-k Interconnect Solutions FREMONT,
Calif., April 12 /PRNewswire-FirstCall/ -- Mattson Technology, Inc.
(NASDAQ:MTSN), a leading supplier of advanced process equipment
used to manufacture semiconductors, today announced the shipment of
an enhanced version of its Aspen III Highlands system to SEMATECH
in Austin, TX. The 300 mm system is being installed at ATDF,
SEMATECH's R&D wafer fab, which also supports external
customers. Mattson's strip system will be used by SEMATECH's
Interconnect Division to develop advanced interconnect structures
for 45 nanometer (nm) and below chip generations targeted for Keff
of 2.5 and lower. Mattson and SEMATECH will work together to
develop and optimize low sidewall damage ash processes for the
integration of copper with porous ultra-low dielectric constant
(ULK) materials. To create advanced integrated circuits (ICs), the
semiconductor industry is migrating from aluminum to copper wires
insulated with low-k materials, to reduce the power dissipation,
signal cross talk and delay of on chip 'wiring.' These effects can
dominate the performance of complex IC's, and the negative impacts
grow as feature sizes shrink. Copper interconnects, as well as
low-k, enable chipmakers to shrink die sizes and pack circuitry
closer together while maintaining speed, computing power and device
performance throughout the chip. "The Interconnect Division's
overall mission is to develop integration schemes with Keff 2.5 for
the 45 nm node and beyond," said Eric Busch, Interconnect Unit
process development program manager. "A key enabler for low Keff
integration schemes is to significantly reduce the sidewall damage
(also known as carbon depletion) on dual-damascene trench sidewalls
caused by etch and ash processing. As feature sizes decrease, the
sidewall damage contribution to increasing Keff becomes larger."
Busch continued, "We will work with Mattson Technology to develop
new low sidewall damage ash processes. This cooperative development
activity will enable SEMATECH to begin achieving lower
Keff-integrated device structures and, in turn, position our
members and the industry to further address sidewall issues."
"Porous low-k dielectric integration brings a unique set of
challenges in the containment and elimination of process-induced
damage," said Sitaram Arkalgud, director of SEMATECH's Interconnect
Division. "Our project will seek solutions aimed at enhancing
product performance and yield." "As we move toward smaller device
geometries, chipmakers face multiple challenges as they integrate
low-k dielectrics into their advanced manufacturing processes,"
said Robert B. MacKnight, chief operating officer of Mattson
Technology. "Our enhanced Aspen III Highlands system demonstrated
excellent results in competitive evaluations for low-k strip,
residue clean and other advanced back-end-of-line (BEOL)
applications. Over the past decade, we have partnered with SEMATECH
on several joint development programs for advanced transistor
formation, and we are very pleased to work with the Interconnect
Division using our copper/low-k strip technologies to provide the
industry with new interconnect solutions for the 45 nm and below
era." About the Aspen III Highlands Built on Mattson's
production-proven, high-throughput Aspen III platform, the Aspen
III Highlands features a proprietary ICP technology with a bias
capability that enables independent control of density and energy
at low temperatures. The Highlands' ability to reduce operational
steps simplifies integration and provides customers unparalleled
cost of ownership (COO). With a low-pressure, low-temperature
regime, the enhanced version of the Highlands provides improved
profile control, low-k material preservation and a wider process
window. The system meets the stringent requirements of advanced
BEOL applications for 65 nm and below manufacturing, including ULK
ash and residue and barrier layer removal. About SEMATECH SEMATECH
is a global semiconductor technology development consortium that
has effectively represented the semiconductor manufacturing
industry on innovation issues since 1988. SEMATECH conducts
state-of-the-art research, and is a highly regarded technology
partner whose goal is to promote the interests common to all
chipmakers. It has extensive experience collaborating with
equipment and materials suppliers, as well as government and
academic research centers, to refine the tools and technology
necessary to produce future generations of chips. Additional
information may be found at http://www.sematech.org/. About ATDF
ATDF, a wholly owned subsidiary of SEMATECH, is a leading
technology R&D center where research meets manufacturing for
semiconductor manufacturers, equipment and materials suppliers, and
others. ATDF customers can confidentially test new designs,
integration methodologies, and prototype systems while protecting
their own intellectual property, and development partners can work
closely with one another in a custom manufacturing environment.
ATDF also develops baseline processes, accepted industry-wide, that
bring new tools and materials to manufacturing faster, at lower
cost. More information can be found at http://www.atdf.com/. About
Mattson Technology, Inc. Mattson Technology, Inc. is a leading
supplier of semiconductor wafer processing equipment used in the
fabrication of integrated circuits. The company's dry strip and RTP
equipment utilize innovative technology to deliver advanced
processing capabilities on high-productivity platforms for the
fabrication of current- and next-generation devices. Since
beginning operations in 1989, the company's core vision has been to
help bring technology leadership and productivity gains to
semiconductor manufacturers worldwide. For more information, please
contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont,
Calif. 94538. Telephone: 800-MATTSON / 510-657-5900. Fax:
510-492-5911. Internet: http://www.mattson.com/. Mattson Technology
Contact Lauren Vu Mattson Technology, Inc. tel 510-492-6518 fax
510-492-2800 DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren
Vu of Mattson Technology, Inc., +1-510-492-6518, or fax,
+1-510-492-2800, or Web site: http://www.atdf.com/ Web site:
http://www.sematech.org/ Web site: http://www.mattson.com/
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