CAMD California Micro Devices Corp. (MM)

California Micro Devices Samples First CSP ASIP(TM) Device with 0.40mm Pad Pitch for Handset Market New Chip Scale Package Devices Significantly Reduce Solution Form Factor and Cost in Next Generation Wireless Handset Designs MILPITAS, Calif., June 15 /PRNewswire-FirstCall/ -- California Micro Devices (NASDAQ:CAMD) today announced the sampling of Chip Scale Package (CSP) Application Specific Integrated Passive(TM) (ASIP(TM)) devices with 0.40mm pitch and 0.25mm CSP solder balls to key strategic customers. A market and technology leader in CSP and advanced ASIP(TM) designs for the handset market, California Micro Devices is the first supplier of integrated passive solutions to offer 0.40mm pad pitch CSP ASIP(TM) devices in volume production. These fine pitch CSP products represent a solution form factor reduction of greater than 20% compared to industry standard 0.50mm pitch CSP products. In addition, the smaller die size provides a path for future solution cost reduction. (Photo: http://www.newscom.com/cgi-bin/prnh/20040615/SFTU089 ) "Our customers' familiarity with both CSP and fine pitch BGA packages has progressed to the point where they are ready to make the transition to 0.40mm pitch CSP ASIP(TM) devices while maintaining high production yields," said Kyle Baker, vice president of marketing for California Micro Devices. "The migration to fine pitch CSP ASIP(TM) devices provides value to our customers through a significant reduction solution form factor, and cost and is the next stage in the evolution of CSP devices. Just as the initial CSP products with 0.65mm pad pitch were displaced by devices with 0.50mm pad pitch, those in turn will be succeeded by devices with 0.40mm pitch." Innovative Technology Designed Into Leading Mobile Platforms California Micro Devices' growing portfolio of CSP ASIP(TM) devices delivers the highest levels of electromagnetic interference (EMI) filtering combined with robust electrostatic discharge (ESD) protection. Utilizing an application specific design methodology, the company produces highly integrated CSP solutions that address the passive function requirements for leading handset data interfaces, including the color LCD, CMOS imager, audio and chip card interfaces. These high-volume, general customer solutions are designed into the latest wireless handsets from such leading vendors as LG, Kyocera, Motorola and Samsung, among others. Availability California Micro Devices' 0.40mm pitch CSP products are available in both eutectic and lead free formats to meet the project's requirements. Evaluation boards will be available for these new CSP products on June 24, 2004. About California Micro Devices Corporation California Micro Devices Corporation is a leading supplier of application specific analog semiconductor products for the mobile, computing and digital consumer markets. Key products include Application Specific Integrated Passive(TM) (ASIP(TM)) devices plus power management and interface ICs. Detailed corporate and product information may be accessed at http://www.calmicro.com/. ASIP(TM) and Application Specific Integrated Passive(TM) are trademarks of California Micro Devices. All other trademarks are property of their respective owners. http://www.newscom.com/cgi-bin/prnh/20040615/SFTU089 http://photoarchive.ap.org/ DATASOURCE: California Micro Devices Corporation CONTACT: Richard Haas of California Micro Devices, +1-408-934-3108 or Web site: http://www.calmicro.com/

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