Applied Materials Introduces New Sym3® Etch System for Advanced Memory and Logic Chips
August 07 2020 - 7:30AM
Applied Materials, Inc. today announced a new addition to its
highly successful Centris® Sym3® etch product family that now
enables chipmakers to precisely pattern and shape ever-smaller
features in leading-edge memory and logic chips.
The new Centris Sym3® Y is Applied’s most advanced conductor
etch system. It uses innovative RF pulsing technology to provide
the extremely high materials selectivity, depth control and profile
control needed by customers to create densely packed,
high-aspect-ratio structures in 3D NAND, DRAM and logic, including
FinFETs and emerging gate-all-around architectures.
A unique technical feature of the Sym3 family is a
high-conductance chamber architecture that provides exceptional
etch profile control by quickly and efficiently exhausting the etch
byproducts that can accumulate with each wafer pass. The Sym3 Y
system extends the benefits of this successful architecture with a
proprietary new coating material that protects critical chamber
components, thereby further reducing defects and enhancing
yields.
First introduced in 2015, the Sym3 etch system has become
Applied’s fastest ramping product in company history, and the
company has just shipped the 5,000th chamber.
The Sym3 family is key to Applied’s strategy of giving customers
new ways to shape and pattern materials, enabling novel 3D
structures and new ways to continue 2D shrinking. Applied is
co-optimizing the Sym3 system with unique CVD patterning films,
enabling customers to increase the layers in 3D NAND memory devices
and reduce the number of steps needed in the quadruple patterning
of DRAM layers. These are being deployed along with Applied’s
e-beam inspection and review technologies to accelerate R&D and
high-volume ramps of the industry’s most advanced nodes, helping
customers improve chip power, performance, area-cost and time to
market (PPACt).
“Applied took a clean-sheet approach to conductor etch with the
Sym3 system launch in 2015 and solved some of the most difficult
etch challenges in 3D NAND and DRAM,” said Dr. Mukund Srinivasan,
vice president and general manager, Semiconductor Products Group at
Applied Materials. “Today, we are seeing strong momentum and growth
in critical etch and EUV patterning applications in the most
advanced memory and foundry-logic nodes, and we will continue
raising the bar and enabling next-generation chip designs.”
Each Sym3 Y system consists of multiple etch and plasma clean
wafer processing chambers governed by system intelligence that
ensures every process chamber is precisely matched, enabling
repeatable results and high productivity. The new system is already
being used by multiple leading NAND, DRAM and foundry-logic
customers worldwide.
About Applied Materials Applied Materials,
Inc. (Nasdaq: AMAT) is the leader in materials engineering
solutions used to produce virtually every new chip and advanced
display in the world. Our expertise in modifying materials at
atomic levels and on an industrial scale enables customers to
transform possibilities into reality. At Applied Materials,
our innovations make possible the technology shaping the future.
Learn more at www.appliedmaterials.com.
Contact:Ricky Gradwohl (editorial/media)
408.235.4676Michael Sullivan (financial community) 408.986.7977
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/31fdd33e-dedd-4933-8850-526a6d8a8bb5
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