PITTSBURGH, Nov. 15, 2019
/PRNewswire/ -- TSMC presented ANSYS (NASDAQ: ANSS)
with two Partner of the Year awards at the TSMC 2019 Open
Innovation Platform® (OIP) Ecosystem Forum. ANSYS'
multiphysics simulation solutions for TSMC's industry-leading
FinFET process and advanced three-dimensional integrated
circuit (3D-IC) packaging technologies enable customers to
accelerate the development of artificial intelligence (AI), 5G,
mobile, high-performance computing (HPC) and automotive
applications.
ANSYS secured awards in the categories of Joint Development of
6nm Design Infrastructure and Joint Delivery of SoIC Design
Solution. ANSYS received the award for the Joint Development of 6nm
Design Infrastructure for ANSYS' delivery of foundry-certified
multiphysics simulation solutions for addressing power, thermal and
reliability for semiconductor intellectual properties and
systems-on-chips designed on TSMC N6 process technology. The
award for the Joint Delivery of SoIC Design Solution recognizes
ANSYS' chip-package co-simulation solutions for addressing
power integrity, signal integrity, electromigration (EM) and
thermal reliability for TSMC-SoIC®, TSMC's latest 3D-IC
packaging technology.
"We're pleased with the result of our collaboration with ANSYS
in its delivery of multiphysics simulation solutions on TSMC's
advanced process and packaging technologies, addressing our
customers' growing challenges across the chip, package, board and
system to meet the complex design requirement for higher
performance and longer battery life," said Suk Lee, TSMC senior director, design
infrastructure management division. "We look forward to continuing
our collaboration with ANSYS to help our customers unleash their
silicon innovations for the applications of AI, 5G, HPC and
automotive."
"Leading semiconductor and system companies use ANSYS
multiphysics simulation solutions to address power, thermal and
reliability challenges to achieve electronics system reliability,"
said John Lee, general manager,
semiconductor business unit at ANSYS. "We're very proud of our
winning partnership and earning two TSMC Partner of the Year
Awards. We look forward to continuing to help our mutual customers
build transformational products."
About ANSYS, Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation,
we help the world's most innovative companies deliver radically
better products to their customers. By offering the best and
broadest portfolio of engineering simulation software, we help them
solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS is
headquartered south of Pittsburgh,
Pennsylvania, U.S.A. Visit www.ansys.com for more
information.
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS-T
Contact
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Media
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Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
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Investors
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Annette Arribas,
IRC
724.820.3700
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.