Aehr Test Systems to Announce Second Quarter Fiscal 2019 Financial Results on January 10, 2019
January 02 2019 - 4:05PM
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of
semiconductor test and burn-in equipment, today announced that it
will report financial results for its second quarter of fiscal 2019
ended November 30, 2018 on Thursday, January 10, 2019 following the
close of the market. The Company will host a conference call and
webcast at 5:00 p.m. Eastern time to discuss the results.
What: |
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Aehr Test Systems
second quarter fiscal 2019 financial results conference call. |
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When: |
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Thursday, January 10th
at 5:00 p.m. Eastern Time (2:00 p.m. PT). |
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Dial in
Number: |
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To access the live
call, dial 800-458-4121 (US and Canada) or
+1 323-794-2093 (International) and give the
participant passcode 1583827. |
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Webcast: |
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To access the live
webcast, please visit the investor relations section at
www.aehr.com. |
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Call
Replay: |
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A phone replay of the
call will be available approximately two hours following the end of
the call through 8:00 p.m. ET on Thursday, January 17, 2019. To
access the replay dial-in information, please click here. |
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About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and FOX-P™
families of test and burn-in systems and FOX WaferPak™ Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts:Aehr Test Systems
Investor
Relations Contact:Ken Spink
Todd Kehrli or Jim ByersChief Financial
Officer
MKR Group,
Inc.(510) 623-9400 x309
(323) 468-2300
aehr@mkr-group.com
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