Today at Consumer Technology Association’s Consumer Electronics
Show, AMD (NASDAQ: AMD) showcased technology innovations that are
improving how consumers live, work and play. During her keynote,
AMD President and CEO Dr. Lisa Su reiterated the importance of
high-performance computing in people’s daily lives and the ways in
which the acceleration of digital transformation – at home and at
work – point to a bright future this year and beyond. To power that
future, Dr. Su announced a new family of high-performance mobile
processors for laptops and offered a preview of an upcoming
next-generation server processor for data centers.
“AMD is incredibly proud to be at the heart of products,
services and experiences keeping us productive, learning, connected
and entertained in an increasingly ‘digital first’ world,” said Dr.
Su. “We are committed to consistently pushing the envelope on
what’s possible in PCs, gaming, data centers and the cloud together
with our industry partners.”
Dr. Su was joined in the keynote by a diverse set of partners:
HP CEO Enrique Lores, Lenovo CEO Yang Yuanqing, Vice President of
Technology for Lucasfilm François Chardavoine, Mercedes-AMG
Petronas Formula One Team Driver Lewis Hamilton and Team Principal
and CEO Toto Wolff, and Microsoft Chief Product Officer Panos
Panay. Each shared how they partner with AMD to offer some of the
most exciting products, services and experiences to people around
the world. For example, Lewis Hamilton, Formula 1 World Champion,
discussed the role of high-performance computing in racing, from
the design and testing of the car to the analysis of race data for
competitive advantage. (38:50 – 45:55)
In addition, scientific researchers explained how an additional
12 petaflops of donated AMD EPYC™ and AMD Radeon Instinct compute
power is accelerating their work to research infectious disease
including COVID-19. (6:00 – 9:00)
New Product InnovationAMD showcased its track
record of executing consistently against its ambitious product
roadmap again at CES 2021. Dr. Su announced the new AMD Ryzen™ 5000
series mobile processors that bring the industry-leading
performance1 and high efficiency of the “Zen 3” core to laptops,
and shared the first public demonstration of the upcoming 3rd Gen
AMD EPYC™ server processor for data centers, cloud services and
high-performance computing.
AMD Ryzen 5000 Series Mobile Processors – powerful and
energy-efficient PC processors for ultrathin and gaming
laptops.To support the dramatic shift to working and
learning from home, AMD launched new AMD Ryzen 5000 series
processors based on the “Zen 3” core, combining industry-leading
performance1 with the power efficiency needed for next-generation
mobile PC computing. (18:29 – 23:42)
- The world’s top notebook OEMs, including Asus, HP and Lenovo,
will all bring AMD Ryzen 5000 systems to market starting in
February, with more than 150 systems expected to launch this
year.
- The newly announced family of AMD processors includes AMD Ryzen
5000 U-Series Processors optimized for thin and light notebooks, as
well as AMD Ryzen 5000 H-Series Processors for mobile gamers and
creators.
- HP CEO Enrique Lores and Lenovo CEO Yang Yuanqing discussed how
their companies in partnership with AMD are shaping the compute
experience of the future with new form factors. (23:43 – 27:15;
35:30 – 38:49)
- Microsoft Chief Product Officer
Panos Panay discussed the essential nature of the PC for
connecting, working, learning and gaming and the AMD and Microsoft
co-engineering that is revolutionizing these computing experiences.
(11:00 – 17:15)
3rd Gen AMD EPYC
Processor, codenamed “Milan” – designed to extend AMD leadership in
performance, total cost of ownership and security
features.AMD EPYC processors are at the heart of the
supercomputers, data centers and cloud services underpinning
scientific research, global business, ecommerce and increasingly
important cloud services like online learning, collaboration
applications and video conferencing. In her keynote, Dr. Su
provided the first public demonstration of the 3rd Gen AMD EPYC
processor, codenamed “Milan.” The demonstration featured the
Weather Research and Forecast (WRF) Model – used in more than 160
countries – crunching through a compute-intensive weather forecast
for the continental United States, with two 32-core “Milan”
processors outperforming two of the competition’s highest end dual
socket processors by ~68%2. (46:03 – 48:48) 3rd Gen AMD EPYC
processors will raise the bar for performance, advanced security
features and the business value for which AMD is known. AMD plans
to announce product and ecosystem details in Q1 2021.
Supporting Resources
- Watch the opening video here
- See clips from our partners here:-- HP CEO Enrique Lores (23:43
– 27:15)-- Lenovo CEO Yang Yuanqing (35:30 – 38:49)-- Vice
President of Technology for Lucasfilm François Chardavoine (30:32 –
35:29)-- Mercedes-AMG Petronas Formula 1 Team Driver Lewis Hamilton
and Team CEO Toto Wolff (38:50 – 45:55)-- Microsoft Chief Product
Officer Panos Panay (11:00 – 17:15)
- Listen to scientific researchers discuss the impact of the AMD
HPC Fund here: (6:00 – 9:00)
- Learn more about AMD Ryzen Mobile Processors here
- Learn more about AMD EPYC Processors here
- Learn more about supercharging creativity with the Radeon RX
6900 XT and see a ProRender-developed demo of the Mercedes-AMG F1
W11 EG performance car here
- Follow AMD on Twitter to stay up to date
CAUTIONARY STATEMENT
This press release contains forward-looking statements
concerning Advanced Micro Devices, Inc. (AMD) such as the features,
functionality, performance, availability, timing and expected
benefits of AMD products including the AMD Ryzen™ 5000 Series
Mobile Processors and the 3rd Gen AMD EPYC™ Server Processor, which
are made pursuant to the Safe Harbor provisions of the Private
Securities Litigation Reform Act of 1995. Forward-looking
statements are commonly identified by words such as "would," "may,"
"expects," "believes," "plans," "intends," "projects" and other
terms with similar meaning. Investors are cautioned that the
forward-looking statements in this press release are based on
current beliefs, assumptions and expectations, speak only as of the
date of this press release and involve risks and uncertainties that
could cause actual results to differ materially from current
expectations. Such statements are subject to certain known and
unknown risks and uncertainties, many of which are difficult to
predict and generally beyond AMD's control, that could cause actual
results and other future events to differ materially from those
expressed in, or implied or projected by, the forward-looking
information and statements. Material factors that could cause
actual results to differ materially from current expectations
include, without limitation, the following: Intel Corporation’s
dominance of the microprocessor market and its aggressive business
practices; the ability of third party manufacturers to manufacture
AMD's products on a timely basis in sufficient quantities and using
competitive technologies; expected manufacturing yields for AMD’s
products; the availability of essential equipment, materials or
manufacturing processes; AMD's ability to introduce products on a
timely basis with features and performance levels that provide
value to its customers; global economic uncertainty; the loss of a
significant customer; AMD's ability to generate revenue from its
semi-custom SoC products; the impact of the COVID-19 pandemic on
AMD’s business, financial condition and results of operations;
political, legal, economic risks and natural disasters; the impact
of government actions and regulations such as export administration
regulations, tariffs and trade protection measures; the impact of
acquisitions, joint ventures and/or investments on AMD's business,
including the announced acquisition of Xilinx, and the failure to
integrate acquired businesses; AMD’s ability to complete the Xilinx
merger; the impact of the announcement and pendency of the Xilinx
merger on AMD’s business; potential security vulnerabilities;
potential IT outages, data loss, data breaches and cyber-attacks;
uncertainties involving the ordering and shipment of AMD’s
products; quarterly and seasonal sales patterns; the restrictions
imposed by agreements governing AMD’s notes and the revolving
credit facility; the competitive markets in which AMD’s products
are sold; market conditions of the industries in which AMD products
are sold; AMD’s reliance on third-party intellectual property to
design and introduce new products in a timely manner; AMD's
reliance on third-party companies for the design, manufacture and
supply of motherboards, software and other computer platform
components; AMD's reliance on Microsoft Corporation and other
software vendors' support to design and develop software to run on
AMD’s products; AMD’s reliance on third-party distributors and
add-in-board partners; the potential dilutive effect if the 2.125%
Convertible Senior Notes due 2026 are converted; future impairments
of goodwill and technology license purchases; AMD’s ability to
attract and retain qualified personnel; AMD's ability to generate
sufficient revenue and operating cash flow or obtain external
financing for research and development or other strategic
investments; AMD's indebtedness; AMD's ability to generate
sufficient cash to service its debt obligations or meet its working
capital requirements; AMD's ability to repurchase its outstanding
debt in the event of a change of control; the cyclical nature of
the semiconductor industry; the impact of modification or
interruption of AMD’s internal business processes and information
systems; compatibility of AMD’s products with some or all
industry-standard software and hardware; costs related to defective
products; the efficiency of AMD's supply chain; AMD's ability to
rely on third party supply-chain logistics functions; AMD’s stock
price volatility; worldwide political conditions; unfavorable
currency exchange rate fluctuations; AMD’s ability to effectively
control the sales of its products on the gray market; AMD's ability
to adequately protect its technology or other intellectual
property; current and future claims and litigation; potential tax
liabilities; and the impact of environmental laws, conflict
minerals-related provisions and other laws or regulations.
Investors are urged to review in detail the risks and uncertainties
in AMD’s Securities and Exchange Commission filings, including but
not limited to AMD’s Quarterly Report on Form 10-Q for the quarter
ended September 26, 2020.
About AMDFor more than 50 years, AMD has driven
innovation in high-performance computing, graphics and
visualization technologies ― the building blocks for gaming,
immersive platforms and the data center. Hundreds of millions of
consumers, leading Fortune 500 businesses and cutting-edge
scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD
employees around the world are focused on building great products
that push the boundaries of what is possible. For more information
about how AMD is enabling today and inspiring tomorrow, visit the
AMD (NASDAQ:AMD) website, blog, Facebook and Twitter pages.
AMD, the AMD logo, EPYC, Ryzen, and combinations thereof are
trademarks of Advanced Micro Devices, Inc.
1 As of December 2020, the Ryzen 5000 series mobile processors
are the fastest mobile processors with the highest-performing
single-thread and multi-thread performance available on x86 mobile
processors, measured by AMD Labs with Cinebench R.20 1T and
Cinebench R20 nT respectively. Performance may vary. CZM-352 AMD
internal testing completed on 7Dec2020 on a reference platform with
2x pre-production EPYC™ 7003 series 32-core processors, compared to
an Intel server on a production system with 2x Intel® Xeon® Gold
6258R (28C) processors. Results may vary. MIL-002
Contact:Sarah
Feller AMD Communications(512)
602-4333sarah.feller@amd.com
Laura GravesAMD Investor
Relations(408) 749-5467laura.graves@amd.com
Photos accompanying this announcement are available at:
https://www.globenewswire.com/NewsRoom/AttachmentNg/40559877-3a75-4ec3-9b77-999c9259e9c3
https://www.globenewswire.com/NewsRoom/AttachmentNg/eef5cdd6-720b-4f0e-a406-de07bad46406
https://www.globenewswire.com/NewsRoom/AttachmentNg/31ef0506-7167-4070-b648-1ebfbaa98ef4
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