HSINCHU, Taiwan, Sept. 11, 2017 /PRNewswire/ -- Xilinx
(NASDAQ: XLNX), Arm, Cadence Design Systems, Inc. (NASDAQ: CDNS)
and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboration to
build the first Cache Coherent Interconnect for Accelerators (CCIX)
test chip in TSMC 7nm FinFET process technology for delivery in
2018. The test chip aims to provide a silicon proof point to
demonstrate the capabilities of CCIX in enabling multi-core
high-performance Arm® CPUs working via a coherent fabric to
off-chip FPGA accelerators.
About CCIX
Accelerating applications in the data center is a growing
requirement due to power and space constraints. Applications such
as big data analytics, search, machine learning, wireless 4G/5G,
in-memory database processing, video analytics, and network
processing benefit from acceleration engines that move data
seamlessly among the various system components. CCIX will allow
components to access and process data irrespective of where it
resides, without the need for complex programming environments.
CCIX will leverage existing server interconnect infrastructure
and deliver higher bandwidth, lower latency and cache coherent
access to shared memory. This will result in a significant
improvement in the usability of accelerators and overall
performance and efficiency of data center platforms, lowering the
barrier to entry into existing server systems and improving the
total cost of ownership (TCO) of acceleration systems.
About the Test Chip
The test chip, implemented on TSMC's 7nm process, will be based
on the latest Arm DynamIQ™ technology, CMN-600 coherent on-chip bus
and foundation IP. To validate the complete subsystem, Cadence
provided key I/O and memory subsystems, which include the CCIX IP
solution (controller and PHY), PCI Express® 4.0/3.0 (PCIe®-4/3) IP
solution (controller and PHY), the DDR4 PHY, peripheral IPs such as
I2C, SPI and QSPI, as well as associated IP drivers. Cadence
verification and implementation tools are being used to build the
test chip. The test chip provides connectivity to Xilinx's 16nm
Virtex UltraScale+ FPGAs over CCIX chip-to-chip coherent
interconnect protocol.
Availability
The test chip will tape-out in early Q1 2018 with silicon
availability expected in 2nd half 2018.
Company Quotes
Xilinx Quote
"As we work to innovate on advanced technology for compute
acceleration, we are excited about the results of this
collaboration," said Victor Peng,
COO at Xilinx. "Our Virtex UltraScale+ HBM family is built using
TSMC's 3rd generation CoWoS® technology, which is now the industry
standard assembly for HBM integration and cache-coherent
acceleration with CCIX."
Arm Quote
"With the surge in artificial intelligence and big data, we're
seeing increasing demand for more heterogeneous compute across
more applications," said Noel
Hurley, vice president and general manager, Infrastructure
Group, Arm. "The test chip will not only demonstrate how the latest
Arm technology with coherent multichip accelerators can scale
across the data center, but reinforces our commitment to solving
the challenge of accessing data quickly and easily. This innovative
and collaborative approach to coherent memory is a significant step
forward in delivering high-performance, efficient data center
platforms."
Cadence Quote
"By building an ecosystem for high-performance computing with
our collaboration partners, we will enable our customers to quickly
deploy innovative new architectures at 7nm and other advanced nodes
for these growing data center applications," said Babu Mandava,
senior vice president and general manager of the IP Group at
Cadence. "The CCIX industry standard will help drive the next
generation of interconnect that provides the high-performance cache
coherency that the market is demanding."
TSMC Quote
"Artificial intelligence and deep learning will significantly
impact industries including media, consumer electronics and
healthcare," said Dr. Cliff Hou,
TSMC vice president, Research & Development/Design and
Technology Platform. "TSMC's most advanced 7nm FinFET process
technology provides high performance and low power benefits that
satisfy distinct product requirements for High-Performance
Computing (HPC) applications targeting these markets."
About Xilinx
Xilinx is the leading provider of All Programmable semiconductor
products, including FPGAs, SoCs, MPSoCs, RFSoCs, and 3D ICs. Xilinx
uniquely enables applications that are both software defined and
hardware optimized – powering industry advancements in Cloud
Computing, 5G Wireless, Embedded Vision, and Industrial IoT. For
more information, visit www.xilinx.com.
About Arm
Arm technology is at the heart of a computing and connectivity
revolution that is transforming the way people live and businesses
operate. Our advanced, energy-efficient processor designs are
enabling the intelligence in 100 billion silicon chips and securely
powering products from the sensor to the smartphone to the
supercomputer. With more than 1,000 technology partners including
the world's largest business and consumer brands, we are driving
Arm innovation into all areas compute is happening inside the chip,
the network and the cloud.
About Cadence
Cadence enables electronic systems and semiconductor companies
to create the innovative end products that are transforming the way
people live, work and play. Cadence software, hardware and
semiconductor IP are used by customers to deliver products to
market faster. The company's System Design Enablement strategy
helps customers develop differentiated products—from chips to
boards to systems—in mobile, consumer, cloud datacenter,
automotive, aerospace, IoT, industrial and other market segments.
Cadence is listed as one of Fortune Magazine's 100 Best Companies
to Work For. Learn more at cadence.com.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry,
providing the industry's leading process technology and the foundry
segment's largest portfolio of process-proven libraries, IPs,
design tools and reference flows. The Company's owned capacity in
2017 is expected to reach above 11 million (12-inch equivalent)
wafers, including capacity from three advanced 12-inch GIGAFAB®
facilities, four eight-inch fabs, one six-inch fab, as well as
TSMC's wholly owned subsidiaries, WaferTech and TSMC China. TSMC is
the first foundry to provide both 20nm and 16nm production
capabilities. Its corporate headquarters are in Hsinchu,
Taiwan. For more information about
TSMC please visit http://www.tsmc.com.
CONTACTS
Silvia E. Gianelli, Xilinx, (408)
626-4328, silvia.gianelli@xilinx.com
Kristen Lisa, Arm, (512) 776-0842,
kristen.lisa@arm.com
Elena Annuzzi, Cadence Design
Systems, Inc., (408) 321-8170, elenaa@cadence.com
Elizabeth Sun, TSMC, 886-3-5682085,
elizabeth_sun@tsmc.com
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SOURCE Xilinx, Inc.