SEOUL, South Korea and
SAN JOSE, Calif., March 13, 2017 /PRNewswire/ -- MagnaChip
Semiconductor Corporation ("MagnaChip") (NYSE: MX), a Korea-based
designer and manufacturer of analog and mixed-signal semiconductor
products, announced today that it now offers a new 0.18 micron
RFSOI process with enhanced switching performance. Compared to the
previous 1.5/2.5V process, this new switch-centric process created
specifically for 2.5V reduces manufacturing cost and time-to-market
while providing competitive and superior performance for antenna
switches used in mobile and Internet-of-Things devices for wireless
connectivity.
There are several benefits to using the new 0.18 micron 2.5V
RFSOI process. The primary benefit is that it is a cost effective
process. It offers a 150fs of Ron*Coff using aluminum for metal1
and reduces the number of photo steps by approximately 15% as
compared to the industry standard by one poly silicon layer and
four metal layers (1P4M). By reducing the number of mask layers,
customers will reduce costs and improve their time-to-market with a
shorter turnaround time in the fab. Ron*Coff is a figure of merit
used to rate the performance of an RF switch.
Another important benefit is that it has robust breakdown at
above 4V while also maintaining Ron*Coff at 150fs. Through high BV
(Breakdown Voltage), the stack number of switch is reduced,
resulting in chip size reduction.
Furthermore, the new 0.18 micron RFSOI process reduces insertion
loss by 20% at 2GHz and low harmonics of better than -60dBm at
35dBm power level. This process, which has successfully been
demonstrated with an SP8T (Single Pole Eight Throw) switch, builds
on a trap-rich, high-resistivity substrate to suppress harmonic
distortion. It also provides additional transistors with useful
options such as floating body, low leakage, and enables a reduction
in area of approximately 18%, from our previous process, for the
integration of multiple RF and analog functions onto a smaller die.
Available process options also include a 27-volt
metal-inductor-metal capacitor, geometry scalable inductor, high
resistivity poly resistor, MOS varactor, and up to 4 layers of
metal with 4-micron thick top metal for rich power handling.
"The addition of the switch-centric 2.5V process to our RFSOI
technology portfolio is another example of MagnaChip's strong
commitment to our foundry customers, who continually desire
cost-competitive and high-performing RFSOI processes," said YJ Kim,
Chief Executive Officer of MagnaChip. Mr. Kim also added that "We
will continue to offer differentiated processes and expand our
RFSOI process offerings to meet the growing and highly specific
technology requirements of our global customer-base."
About MagnaChip Semiconductor
MagnaChip is a
Korea-based designer and manufacturer of analog and mixed-signal
semiconductor products for high-volume consumer, communication,
industrial and computing applications. The Company's Standard
Products Group and Foundry Services Group provide a broad range of
standard products and manufacturing services to customers
worldwide. MagnaChip, with a 30-year operating history, owns a
portfolio of more than 3,400 registered and pending patents, and
has extensive engineering, design and manufacturing process
expertise. For more information, please visit www.magnachip.com.
Information on or accessible through, MagnaChip's website is not a
part of, and is not incorporated into, this release.
CONTACTS:
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In the United
States:
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In
Korea:
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Bruce
Entin
|
Chankeun
Park
|
Entin
Consulting
|
Director of Public
Relations
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Tel.
+1-408-625-1262
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Tel.
+82-2-6903-3195
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Investor.relations@magnachip.com
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chankeun.park@magnachip.com
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SOURCE MagnaChip Semiconductor Corporation