SAN JOSE, Calif., Sept. 27, 2016 /PRNewswire/ -- Cadence Design
Systems, Inc. (NASDAQ: CDNS) today announced that it has received
four TSMC Partner of the Year awards at this year's TSMC Open
Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented
with awards for the joint delivery of the 7nm mobile design
platform, the 7nm High Performance Computing (HPC) design platform,
the Integrated Fan-Out (InFO) design solution and its
analog/mixed-signal IP.
The awards for the joint delivery of the 7nm mobile design
platform and the 7nm HPC design platform were given based on the
early, in-depth collaboration between TSMC and Cadence on FinFET
enablement and the development of this latest advanced-node
technology for next-generation system-on-chip (SoC) designs.
Cadence secured the award for the delivery of a comprehensive
solution for InFO based technologies by integrating IC back-end
design with advanced packaging solutions for wafer-level fan-out
design, analysis and verification. Finally, the analog/mixed-signal
IP award was given based on customer feedback, portfolio breadth,
strong technical support capabilities and customer
adoption/production volume.
"Cadence continues to partner with TSMC to deliver the
innovation and deep technical expertise that is required to address
evolving challenges with the latest process nodes such as 7nm and
advances in packaging technology such as InFO," said Dr.
Anirudh Devgan, senior vice
president and general manager of the the Digital Design &
Signoff Group and the System & Verification Group and at
Cadence. "These awards from TSMC highlight Cadence's ability to
offer top-of-the-line tools and IP that our customers need for
advanced SoC designs."
"Throughout the history of our long collaborative relationship
with Cadence, they have consistently delivered quality results and
continue to invest in the latest technologies and most advanced
nodes as demonstrated by its latest 7nm mobile design platform, 7nm
HPC design platform, InFO design solution and analog/mixed-signal
IP," said Suk Lee, senior
director of the Design Infrastructure Marketing Division at
TSMC. "We are pleased to present these awards to Cadence and
look forward to continuing to partner together on more innovative
solutions that our mutual customers demand in the years to
come."
About Cadence
Cadence enables global electronic design innovation and plays an
essential role in the creation of today's integrated circuits and
electronics. Customers use Cadence software, hardware, IP and
services to design and verify advanced semiconductors, consumer
electronics, networking and telecommunications equipment, and
computer systems. The company is headquartered in San Jose, Calif., with sales offices, design
centers and research facilities around the world to serve the
global electronics industry. More information about the company,
its products and its services is available at www.cadence.com.
© 2016 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks
or registered trademarks of Cadence Design Systems, Inc. All other
trademarks are the property of their respective holders.
For more information, please contact:
Cadence Newsroom
408-944-7039
newsroom@cadence.com
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SOURCE Cadence Design Systems, Inc.