MIGDAL HAEMEK, Israel,
March 10, 2014 /PRNewswire/ --
Camtek Ltd. (NASDAQ and TASE: CAMT), today announced that it is
starting the customer evaluation of its next generation
Semiconductor Inspection and Metrology platform. This a major
milestone event, rejuvenating Camtek's semiconductor product line
with the latest cutting-edge inspection technologies, designed for
the Advanced Packaging market.
The fast-growing Advanced Packaging market relies critically on
advanced inspection and metrology capabilities to achieve the
affordability and reliability required for the commercial success
of 3D Integrated Circuits (IC).
Ramy Langer, Vice President
and Head of Camtek's Semiconductor Division, commented, "Our
next generation platform is a result of many years of dedicated
research and development efforts, as well as intensive
collaboration with leading research institutes worldwide. Designed
to support the emerging Advanced Packaging market, this new
state-of-the-art platform will provide higher throughput,
unparalleled accuracy and other innovative capabilities. We expect
sales of the new system to customers specializing in the
manufacturing of 3D IC to begin in the second half of 2014."
Rafi Amit Chairman and CEO
commented, "I am excited to lead the introduction of our new
system that meets today's demand for very high throughput together
with outstanding metrology accuracy. I believe our new generation
system will reposition and cement us as a market leader in the
inspection and metrology field over the coming years."
Camtek's line of automated wafer inspection systems enables
semiconductor manufacturers, bumping houses and packaging foundries
to monitor processes and enhance yields by detecting defects.
Camtek's new systems deliver unparalleled 2D and 3D inspection and
metrology capabilities for wafers, both before and after testing,
along the bumping process or after dicing. Camtek's new systems
address the specialized needs of the most advanced applications in
today's markets.
ABOUT CAMTEK LTD.
Camtek Ltd. provides automated and technologically advanced
solutions dedicated to enhancing production processes and
increasing yields, enabling and supporting customer's latest
technologies in the Semiconductors, Printed Circuit Boards (PCB)
and IC Substrates industries.
Camtek addresses the specific needs of these interconnected
industries with dedicated solutions based on a wide and advanced
platform of technologies including intelligent imaging, image
processing and functional 3D inkjet printing.
This press release is available at http://www.camtek.co.il.
This press release may contain projections or other
forward-looking statements regarding future events or the future
performance of the Company. These statements are only predictions
and may change as time passes. We do not assume any obligation to
update that information. Actual events or results may differ
materially from those projected, including as a result of changing
industry and market trends, reduced demand for our products, the
timely development of our new products and their adoption by the
market, increased competition in the industry, intellectual
property litigation, price reductions as well as due to risks
identified in the documents filed by the Company with the
SEC.
CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972-4-604-8308
Mobile: +972-54-900-7100
moshee@camtek.co.il
INTERNATIONAL INVESTOR RELATIONS
GK Investor Relations
Ehud Helft / Kenny Green
Tel: (US) +1-646-201-9246
camtek@gkir.com
SOURCE Camtek Ltd