Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips
October 18 2021 - 7:30AM
Applied Materials, Inc. today unveiled a unique eBeam metrology
system that enables a new playbook for patterning control based on
massive on-device, across-wafer and through-layer measurements.
Advanced chips are built one layer at a time, and each of
billions of individual features must be perfectly patterned and
aligned to create working transistors and interconnects with
optimal electrical characteristics. As the industry increasingly
moves from simple 2D designs to more aggressive multipatterning and
3D designs, a commensurate breakthrough in metrology is needed to
perfect each critical layer and enable the best performance, power,
area-cost and time to market (PPACt™).
Traditional Patterning Control Playbook
Traditionally, patterning control has been achieved using
optical overlay tools that help align die patterns with “proxy
targets” which are guide marks printed into the spaces between die
that are removed from the wafer during die singulation. Proxy
target approximation has been complemented with statistical
sampling of a small number of die patterns from across the
wafer.
However, after successive generations of feature shrinking,
broader adoption of multipatterning, and the introduction of 3D
designs that cause interlayer distortions, the traditional approach
is leading to measurement deficiencies – or “blind spots” – that
are making it more difficult for engineers to correlate intended
patterns with on-die results.
New Patterning Control Playbook
With the arrival of new eBeam system technology that can
directly measure semiconductor device structures across the wafer
and through layers at high speed, customers are moving to a new
patterning control playbook based on big data. Applied’s latest
eBeam metrology innovation – the PROVision® 3E system – is
especially designed for this new playbook.
“As the leader in eBeam technology, Applied Materials is giving
our customers a new playbook for patterning control that is
optimized for the most advanced logic and memory chips,” said Keith
Wells, Group Vice President and General Manager, Imaging and
Process Control at Applied Materials. “The resolution and speed of
the PROVision 3E system allows it to see beyond the blind spots of
optical metrology, performing accurate measurements across the
wafer and between the many layers of a chip. This provides
chipmakers with the multidimensional data sets they need to improve
PPAC and accelerate the time to market of new process technologies
and chips.”
PROVision 3E System
The PROVision 3E system includes technical features that enable
patterning control of today’s most advanced designs, including 3nm
foundry-logic chips, gate-all-around transistors and
next-generation DRAM and 3D NAND.
- Resolution: Applied’s industry-leading eBeam
column technology provides the highest electron density available,
enabling detailed imaging at 1nm resolution.
- Accuracy: Decades of CD SEM system and
algorithm expertise deliver accurate and precise measurements of
critical features.
- Speed: 10 million accurate, actionable
measurements per hour.
- Multi-Layer: Applied’s unique Elluminator®
technology captures 95 percent of back-scattered electrons to
quickly measure critical dimensions and edge placement at multiple
levels simultaneously.
- Range: A broad range of eBeam energies.
High-energy modes enable rapid measurement, hundreds of nanometers
deep. Low-energy modes enable damage-free measurement of fragile
materials and structures including EUV photoresist.
Together, these features enable customers to move from the old
patterning control playbook – composed of optical proxy target
approximation, limited statistical sampling and single-layer
control – to a new playbook based on massive on-device,
across-wafer and through-layer metrology and control.
Process Recipe Optimization
The PROVision 3E system is also a key component of Applied’s
AIx™ (Actionable Insight Accelerator) platform which combines
process technology, sensors, metrology and data analytics to
accelerate every stage of process technology development – from
R&D to ramp and high-volume manufacturing. AIx platform
analytics correlate process variables with the on-wafer
measurements captured by the PROVision 3E system, helping engineers
speed process development by 2X and widen process windows by 30
percent.
Availability
The PROVision 3E system is now being used by leading
foundry-logic, DRAM and NAND customers worldwide. Additional
information about patterning control, the PROVision 3E system and
process recipe optimization will be discussed at Applied’s 2021
Process Control and AppliedPRO™ Master Class being held today.
About Applied MaterialsApplied Materials, Inc.
(Nasdaq: AMAT) is the leader in materials engineering solutions
used to produce virtually every new chip and advanced display in
the world. Our expertise in modifying materials at atomic levels
and on an industrial scale enables customers to transform
possibilities into reality. At Applied Materials, our innovations
make possible a better future. Learn more at
www.appliedmaterials.com.
Contact:Ricky Gradwohl (editorial/media)
408.235.4676Michael Sullivan (financial community) 408.986.7977
A photo accompanying this announcement is available at
https://www.globenewswire.com/NewsRoom/AttachmentNg/543b33ab-e1d1-4be8-9179-5fd95aa93a01
These photos are also available at Newscom, www.newscom.com, and
via AP PhotoExpress.
Applied Materials (NASDAQ:AMAT)
Historical Stock Chart
From Mar 2024 to Apr 2024
Applied Materials (NASDAQ:AMAT)
Historical Stock Chart
From Apr 2023 to Apr 2024