SEOUL, South Korea and
SAN JOSE, Calif., Nov. 12, 2018 /PRNewswire/ -- MagnaChip
Semiconductor Corporation ("MagnaChip Semiconductor") (NYSE: MX), a
designer and manufacturer of analog and mixed-signal semiconductor
products, announced today that it now offers Foundry customers a
0.18 micron BCD (Bipolar-CMOS-DMOS) 200V high-voltage process. This
new BCD process uses SOI (Silicon On Insulator) substrates with
solid high-voltage isolation and extends MagnaChip's existing BCD
processes from 100V to 200V. Having 200V devices in a BCD process
is valuable because it enables a Power IC to be designed for high
voltage applications, including automobiles, electrical vehicles,
industrial motor drivers, ultrasonic medical imaging systems and
solar panels.
Utilizing SOI substrates and MagnaChip's proprietary deep-trench
isolation technology provides advantages over the bulk silicon
based BCD that include higher isolation breakdown voltage, smaller
isolation size, better substrate noise immunity, latch-up immunity
and high-side isolation of power blocks with insulating silicon
dioxide layer between active silicon layers and substrates. In this
technology, two types of power LDMOS technology (Laterally Diffused
Metal Oxide Semiconductor) are supported up to 200V. The first type
has low specific on-resistance (Rsp), which increases packing
density of power blocks. The second type supports full ranges of
SOA (safe operation area) to guarantee long-term reliability with
all ranges of VDS (Drain-to-Source voltage) and VGS (Gate-to-Source
voltage). Foundry customers can select either type, depending upon
their circuit requirements.
Many valuable option devices are also supported in the new 0.18
micron 200V BCD process to enhance design integration and
flexibility. The option devices include high performance bipolar
transistors, Zener diode, Schottky diode, high resistance poly
resistor, metal-insulator-metal capacitor, metal-oxide-metal
capacitor, electrical fuse and multi-time programmable memory.
Certain end markets, including automotive, require that power
ICs are capable of achieving high-temperature reliability and high
operation voltages. This is especially the case for Electric
vehicles and hybrid cars as more 48V battery systems are adopted.
To meet these increased demands, MagnaChip's new 200V BCD
technology was qualified based on the
automotive-grade-qualification specification of AEC-Q100 with
Grade0 temperature condition between -40 to 150 °C.
YJ Kim, Chief Executive Officer of MagnaChip, commented, "We are
very pleased to offer our 0.18 micron 200V BCD process solution for
attractive applications including electric vehicles and solar
panels." Mr. Kim added, "Our goal is to continue to increase our
power technology portfolio to meet the demanding requirements of
our Foundry customers in various markets."
About MagnaChip Semiconductor
MagnaChip is a designer
and manufacturer of analog and mixed-signal semiconductor platform
solutions for communications, IoT, consumer, industrial and
automotive applications. The Company's Standard Products Group and
Foundry Services Group provide a broad range of standard products
and manufacturing services to customers worldwide. MagnaChip, with
over 30 years of operating history, owns a portfolio of more than
3,000 registered patents and pending applications, and has
extensive engineering, design and manufacturing process expertise.
For more information, please visit www.magnachip.com.
CONTACTS:
|
|
United States
(Investor Relations):
Bruce
Entin
Entin
Consulting
Tel.
+1-408-625-1262
Investor.relations@magnachip.com
|
USA media /
industry analysts:
Mike
Newsom
LouVan
Communications, Inc.
Tel.
+1-617-803-5385
mike@louvanpr.com
|
Korea / Asia
media:
Chankeun
Park
Director of Public
Relations
Tel.
+82-2-6903-5223
chankeun.park@magnachip.com
|
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SOURCE MagnaChip Semiconductor Corporation