UMC Announces 22nm Technology Readiness Following Silicon Validation on World’s Smallest USB 2.0 Test Vehicle
December 02 2019 - 1:00AM
Business Wire
UMC’s latest specialty process offering
provides competitive performance and a seamless migration path from
28nm to 22nm
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)
("UMC"), a leading global semiconductor foundry, today announced
the technology readiness of its 22nm process technology following
first-pass silicon success using a USB 2.0 test vehicle. The USB
test vehicle used for the validation exhibited the smallest area
compared to general USB 2.0 PHY IP, demonstrating the robust nature
of UMC’s 22nm process by pushing its design limits. Customers can
confidently design into this 22nm process either with new IC
designs or migrating from 28nm using the company’s 28nm to 22nm
porting methodology that maintains existing 28nm design
architectures.
Y.H. Chen, director of IP Development and Design Support
division at UMC, said, “With UMC’s commitment to focusing on
providing world leading foundry specialty technologies, UMC
continues to introduce new specialty process offerings to serve the
rapidly growing markets in 5G, IoT, and automotive ICs. We are
excited to now make available our 22nm process to our foundry
customers, as we have put forth extensive efforts to ensure the
competitive performance, area, and ease of design-in of this
technology.”
UMC's 22nm process features a 10% area reduction, better
power-to-performance ratio and enhanced RF capabilities compared to
the company’s 28nm High-K/Metal gate process, and is offered in a
22uLP (ultra Low Power) variation that has compatible design rules
and the same mask count at the foundry’s 28nm technology, and also
a 22uLL (ultra Low Leakage) version. UMC 22uLP and 22uLL form a
super set to support a voltage domain from 1.0V to 0.6V, allowing
customers to enjoy the benefits of both technologies on
system-on-chip (SoC) designs. The 22nm platform is supported by
foundation IP and is ideal for a wide variety of semiconductor
applications including consumers ICs for set top box, digital TV,
surveillance, power or leakage sensitive IoT chips (with Bluetooth
or WiFi) and wearable products that require longer battery
life.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry. The company provides mature and advanced IC production
with a focus on Specialty Technologies to manufacture ICs for
applications spanning every major sector of the electronics
industry. UMC’s comprehensive foundry solutions enable chip
designers to leverage the company’s sophisticated technology and
manufacturing, which include high volume 28nm High-K/Metal Gate
technology, volume production 14nm FinFET, specialty process
platforms specifically developed for 5G, IoT and the automotive
industry’s highest-rated AEC-Q100 Grade-0 manufacturing
capabilities for the production of ICs found in vehicles. UMC’s 11
wafer fabs are strategically located throughout Asia and are able
to produce more than 600,000 wafers per month. The company employs
approximately 18,500 people worldwide, with offices in Taiwan,
China, Europe, Japan, Korea, Singapore, and the United States. UMC
can be found on the web at http://www.umc.com.
Note from UMC Concerning
Forward-Looking Statements
This press release contains forward-looking statements that are
based on current expectations, estimates, forecasts and projections
of future performance based on management's judgment, beliefs,
current trends, and anticipated performance. These forward-looking
statements include, without limitation, statements relating to
synergies resulting from the acquisition of MIFS; expected benefits
of acquisition to customers and UMC stakeholders; business
strategies of UMC; the anticipated closing date of the acquisition;
and anticipated manufacturing capabilities of USJC. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; risks
relating to the integration process after acquisition;
technological and development risks; and other risks as described
in UMC’s filings with the U.S. Securities Exchange Commission,
including our Annual Report on Form 20-F and Current Reports on
Form 6-K. Other unknown or unpredictable factors or underlying
assumptions subsequently proving to be incorrect could cause actual
results to differ materially from those in the forward-looking
statements. Although we believe that the expectations reflected in
the forward-looking statements are reasonable, we cannot guarantee
future results, level of activity, performance, or achievements.
You should not place undue reliance on these forward-looking
statements. All information provided in this press release is as of
today's date, unless otherwise stated, and UMC undertakes no duty
to update such information, except as required under applicable
law.
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version on businesswire.com: https://www.businesswire.com/news/home/20191201005238/en/
UMC Richard Yu (886) 2-2658-9168 ext. 16951
richard_yu@umc.com
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