Faraday Technology Corporation (TWSE: 3035), a leading ASIC
design service and IP provider, and United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global
semiconductor foundry, today announced the availability of
Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and
ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL
fundamental IP, including multi-Vt standard cell libraries, ECO
libraries, IO libraries, PowerSlash™ kit, and memory compilers,
offers significant power reduction for the next level of SoC
design.
Faraday’s 22ULP/ULL fundamental IP is designed with enhanced
routing, as well as optimal power, performance and area (PPA) to
address low-power SoC requirements. Compared to 28nm capabilities,
the 22nm cell library can reduce chip die area by 10% or decrease
power consumption by more than 30% under the same performance
rate.
In addition, the standard cell libraries can work under a wide
voltage range from 0.6V to 1.0V and support always-on components in
SoC with ultra-low leakage; the versatile IO libraries include
generic IO, multi-Vt IO, RTC IO, OSC IO, and analog ESD IO; the
memory compilers feature dual power rail function, multiple
power-saving modes, and read/write assist function.
C.H. Chien, associate vice president of R&D at Faraday,
said, “With our long-term collaboration with UMC and extensive ASIC
experience, we are able to provide professional services for IP
adoption on UMC’s process technologies. By leveraging UMC’s 22nm
technology, our newly-launched logic library and memory compiler IP
can facilitate customers to develop lower-power SoC targeted to
IoT, AI, data communication, multimedia, and other emerging
applications with cost advantages and faster time-to-market.”
T.H. Lin, director of IP Development and Design Support division
at UMC, said, “SoC designers require energy-efficient solutions for
diversified applications. With the availability of Faraday’s
fundamental IP on our production-ready 22nm specialty process,
customers now have access to comprehensive design support resources
on our competitive 22nm platform that includes 22ULP and 22ULL
options to target a wide variety of applications.”
For more information on Faraday’s 22nm IP list, please visit
Faraday’s website at https://www.faraday-tech.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry. The company provides mature and advanced IC production
with a focus on Specialty Technologies to manufacture ICs for
applications spanning every major sector of the electronics
industry. UMC’s comprehensive foundry solutions enable chip
designers to leverage the company’s sophisticated technology and
manufacturing, which include high volume 28nm High-K/Metal Gate
technology, volume production 14nm FinFET, specialty process
platforms specifically developed for 5G, IoT, and the automotive
industry’s highest-rated AEC-Q100 Grade-0 manufacturing
capabilities for the production of ICs found in vehicles. UMC’s 12
wafer fabs are strategically located throughout Asia and are able
to produce more than 700,000 wafers per month. The company employs
over 19,000 people worldwide, with offices in Taiwan, China,
Europe, Japan, Korea, Singapore, and the United States. UMC can be
found on the web at http://www.umc.com.
About Faraday Technology
Corporation
Faraday Technology Corporation (TWSE: 3035) is a leading ASIC
design service and IP provider, certificated to ISO 9001 and ISO
26262. The broad silicon IP portfolio includes I/O, Cell Library,
Memory Compiler, ARM-compliant CPUs, LPDDR4/4X, DDR4/3, MIPI D-PHY,
V-by-One, USB 3.1/2.0, 10/100 Ethernet, Giga Ethernet, SATA3/2,
PCIe Gen4/3, and 28G programmable SerDes, etc. Headquartered in
Taiwan, Faraday has service and support offices around the world,
including the U.S., Japan, Europe, and China. For more information,
visit www.faraday-tech.com or follow Faraday on LinkedIn.
Note from UMC Concerning
Forward-Looking Statements
This press release contains forward-looking statements that are
based on current expectations, estimates, forecasts and projections
of future performance based on management's judgment, beliefs,
current trends, and anticipated performance. These forward-looking
statements include, without limitation, statements relating to
synergies resulting from the acquisition of MIFS; expected benefits
of acquisition to customers and UMC stakeholders; business
strategies of UMC; the anticipated closing date of the acquisition;
and anticipated manufacturing capabilities of USJC. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; risks
relating to the integration process after acquisition;
technological and development risks; and other risks as described
in UMC’s filings with the U.S. Securities Exchange Commission,
including our Annual Report on Form 20-F and Current Reports on
Form 6-K. Other unknown or unpredictable factors or underlying
assumptions subsequently proving to be incorrect could cause actual
results to differ materially from those in the forward-looking
statements. Although we believe that the expectations reflected in
the forward-looking statements are reasonable, we cannot guarantee
future results, level of activity, performance, or achievements.
You should not place undue reliance on these forward-looking
statements. All information provided in this press release is as of
today's date, unless otherwise stated, and UMC undertakes no duty
to update such information, except as required under applicable
law.
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version on businesswire.com: https://www.businesswire.com/news/home/20191117005084/en/
Faraday Tech Evan Ke +886 3 578 7888 ext. 88689
evan@faraday-tech.com UMC Richard Yu (886) 2-2658-9168 ext. 16951
richard_yu@umc.com
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