Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-Out Wafer-Level Packaging Portfolio
February 12 2019 - 9:00AM
Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem
Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s
WaferStorm® single wafer solvent wet process tool and its AP300™
lithography system to support the growth of its outsourced assembly
and test (OSAT) business. One of the first independent wafer
bumping service providers in Malaysia, UAT will leverage these
tools for services including gold, electroplated solder and
electroplated copper pillar bumping as it expands fab capacity from
8-inch to 12-inch platforms necessary for progressive fan-out
wafer-level packaging (FOWLP) applications.
“FOWLP techniques have proven critically important for improving
electrical and thermal performance in the bumping process,” said
Chan Wah Chai, general manager at UAT. “We’re excited to forge this
new partnership with Veeco and are confident our adoption of the
WaferStorm and AP300 tools will support our efforts to enable
next-generation packaging techniques leveraging fan-out
technology.”
While advanced techniques such as FOWLP and 3D integration
comprise less than 10 percent of the market today, they are
predicted to grow at over 15 percent CAGR over the next few
years. According to TechSearch, the demand for wafers
incorporating FOWLP will grow from 1 million wafers per year in
2018 to more than 6 million wafers per year in 2021.
“It’s increasingly evident that advanced packaging is an enabler
to better performance in high-potential, high-growth applications
such as artificial intelligence and autonomous vehicles,” said
Scott Kroeger, vice president and general manager of Veeco’s
Precision Surface Processing business unit. “As packaging designs
like FOWLP gain momentum, customers require better process control,
advanced resist removal technologies for smaller dimensions and low
chemical consumption to competitively scale these devices.
We are proud to be working with companies like UAT who
expect higher standards to deliver on their customer promises, and
are confident that WaferStorm will help the industry achieve
high-performance standards at low cost of ownership.”
WaferStorm is a solvent-based single wafer wet process platform
that deploys Veeco’s unique ImmJET™ technology at its core. ImmJET
delivers repeatable performance for the industry’s toughest
applications at lower cost of ownership than conventional batch or
spray-only approaches. WaferStorm offers proven, reliable solutions
for metal lift-off, photoresist strip, dry film resist strip, via
cleans, flux removal and other advanced processes.
The AP300 lithography system is built on Veeco’s customizable
Unity Platform™, delivering a winning combination of overlay,
resolution and side wall profile performance and enabling highly
automated and cost-effective manufacturing. The AP300 system is
particularly well suited for copper pillar, fan-out,
through-silicon via and silicon interposer applications.
“While FOWLP offers advantages like smaller form factors and
heterogeneous integration of diverse die types, there are still
challenges from a lithography standpoint when it comes to
performance and yield,” added Peter Porshnev, senior vice president
and general manager of Veeco’s Ultratech business unit. “The AP300
tool provides a robust lithography solution for the challenging
FOWLP processes required to manufacture high-performance
next-generation devices.”
About VeecoVeeco (NASDAQ: VECO)
is a leading manufacturer of innovative semiconductor process
equipment. Our proven MOCVD, lithography, laser annealing,
ion beam and single wafer etch and clean technologies play an
integral role in producing LEDs for solid-state lighting and
displays, and in the fabrication of advanced semiconductor
devices. With equipment designed to maximize performance,
yield and cost of ownership, Veeco holds technology leadership
positions in all these served markets. To learn more about
Veeco's innovative equipment and services, visit www.veeco.com.
Media Contact:David Pinto408-325-6157dpinto@veeco.com
Investor Relations Contact:Anthony Bencivenga516-677-0200
x1308investorrelations@veeco.com
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