Flex Delivers Seamless Path from Rapid Prototyping to High Volume Manufacturing of IoT Devices
January 06 2020 - 9:05AM
Business Wire
New development kit and system-in-package
enable shorter time to market and support design of high volume IoT
products integrating sound, pressure and motion sensing
CES – Flex (NASDAQ: FLEX), the global supply chain and
manufacturing company, in collaboration with QuickLogic Corporation
and Infineon Technologies AG, today announced the availability of
the FLEXino Sensor Fusion Development Kit to enable rapid
prototyping and a corresponding 12mm x 12mm System-in-Package (SiP)
for high volume production of Internet of Things (IoT) devices. To
help reduce time to market and scale production, the development
kit and SiP enable a wide range of new and existing sensor fusion
IoT products requiring audio, pressure and motion sensing,
Bluetooth and WiFi capabilities. At the Consumer Electronics Show
(CES) this week, attendees interested in seeing a demonstration of
the FLEXino Sensor Fusion Development Kit can make an appointment
to visit QuickLogic's suite, located in the Venetian Tower Suite
31:220, by contacting info@quicklogic.com, or visit Infineon's
booth in the Venetian Toscana Ballrooms 3706 and 3707.
“The FLEXino Sensor Fusion Development Kit and SiP are designed
to help bring a variety of next-generation and existing IoT devices
to market faster,” said Dave Gonsiorowski, vice president,
Innovation Services & Solutions at Flex. “A significant
challenge with IoT design today is the availability of flexible
integrated development kits that easily transition to high-volume
manufacturing. We are proud to have collaborated with QuickLogic
and Infineon and provide a solution that enables customers across
several industries to design products at unprecedented speeds.”
“Flex and QuickLogic worked closely together to integrate our
EOS S3 SoC ultra-low power voice and sensor processing platform
with their FLEXino Sensor Fusion Development Kit and SiP,” said
Brian Faith, chief executive officer of QuickLogic. “The
development kit includes a sensor fusion daughter board featuring
the EOS S3 SoC, and the SiP version miniaturizes the same
functionality into a single package that can be used for volume
production. By working with Flex and Infineon, we are able to
deliver sensor fusion customers a complete and seamless development
path.”
“The collaboration is another step by Infineon to make the
products we use every day smarter using our advanced sensor and
sensor fusion software technologies,” said Philipp Von
Schierstaedt, vice president and general manager, Radio Frequency
and Sensors at Infineon Technologies. “The development kit combined
with Infineon’s digital sensors and microphones delivers seamless,
effortless interactions between people and the next generation of
IoT devices across multiple industries.”
FLEXino Sensor Fusion Development Kit
The development kit contains an ESP32 controller board with
Bluetooth and WiFi connectivity and a sensor fusion daughter board,
created in collaboration with QuickLogic and Infineon. The daughter
board integrates QuickLogic’s EOS™ S3 SoC platform with Infineon’s
DPS310 digital barometric pressure sensor and IM69D130 digital MEMS
microphone in addition to a 6-axis IMU and a 64Mb SPI flash.
Flexible throughout the design process and compatible with the
Adafruit Feather ecosystem, the development kit is optimized for
quick prototyping. The development kit is applicable across many
industries due to its small, accessible form factor that integrates
best-in-class sensors commonly used in a variety of industrial and
consumer markets. The hardware configuration addresses several use
cases, as the sensor fusion algorithm is software configurable.
System-in-Package (SiP)
The SiP is a drop-in sensor fusion solution for IoT devices with
constrained form factors. The System-in-Package offers a single
integrated form factor (12 x 12mm) version of the sensor fusion
daughter board that has been miniaturized at scale through Flex
proprietary packaging processes. The self-contained subsystem frees
the selected host processor from always-on sensor fusion workloads.
The Flex proprietary SiP form factor can be customized for
different sensor fusion applications and easily integrates into new
or existing products.
Availability
The FLEXino Sensor Fusion Development Kit is available now, and
the System-in-Package is scheduled to be available the first
quarter of 2020. Questions and requests related to the development
kit and SiP can be directed to SensorFusion@flex.com.
About Flex
Flex is the Sketch-to-Scale® solutions provider that designs and
builds intelligent products globally. With approximately 200,000
employees across 30 countries, Flex provides innovative design,
engineering, manufacturing, real-time supply chain insight and
logistics services to companies of all sizes across industries and
markets. For more information, visit flex.com or follow us on
Twitter @flexintl.
About QuickLogic
QuickLogic Corporation (NASDAQ: QUIK) enables OEMs to maximize
battery life for highly differentiated, immersive user experiences
with Smartphone, Wearable, Hearable and IoT devices. QuickLogic
delivers these benefits through industry leading ultra-low power
customer programmable SoC semiconductor solutions, embedded
software, and algorithm solutions for always-on voice and sensor
processing. The company's embedded FPGA initiative also enables SoC
designers to easily implement post production changes, and increase
revenue by providing hardware programmability to their end
customers. For more information about QuickLogic, please visit
www.quicklogic.com and https://www.quicklogic.com/blog/.
About EOS S3 Sensor Processing Platform
The EOS S3 Voice and Sensor Processing Platform is an ultra-low
power SoC that combines always-on/always-listening voice processing
with fast, efficient and sophisticated sensor processing
capabilities. It includes a proprietary, patent-pending uDSP-like
Flexible Fusion Engine (FFE) that handles the bulk of the sensor
algorithm processing, which minimizes the processing load for the
floating point MCU. The multi-core design of EOS S3 enables it to
be used as a host processor as well as a companion co-processor.
Power consumption in the always-listening mode is minimized by its
hardware integrated Low Power Sound Detector (LPSD). System-level
power consumption is further optimized by the EOS S3's dynamic
power management technology.
About Infineon
Infineon Technologies AG is a world leader in semiconductor
solutions that make life easier, safer and greener.
Microelectronics from Infineon is the key to a better future. In
the 2019 fiscal year (ending 30 September), the Company reported
sales of €8.0 billion with around 41,400 employees worldwide.
Infineon is listed on the Frankfurt Stock Exchange (ticker symbol:
IFX) and in the USA on the over-the-counter market OTCQX
International Premier (ticker symbol: IFNNY).
Further information is available at www.infineon.com This press
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Media & Press:
Flex Jessica Anderson (408) 577-4789
Jessica.Anderson@flex.com
QuickLogic Andrea Vedanayagam (408) 656-4494
Andrea@quicklogic.com
Infineon Sian Cummings (310) 252-7184
media.relations@infineon.com
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