FREMONT, Calif., Nov. 28 /PRNewswire-FirstCall/ -- Mattson Technology, Inc. (NASDAQ:MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced multiple RTP system orders from and shipments to several major wafer manufacturers in Japan, Korea, Europe, Singapore and Taiwan. The tools for leading 300 mm and 200 mm manufacturing include the Helios(TM), 3000 and 2900 RTP systems, will be used for bulk silicon and silicon-on-insulator (SOI) wafer production. These latest customer wins reinforce Mattson's continued leadership in the wafer manufacturing market, where the company currently supplies RTP equipment to the majority of leading wafer manufacturers. "The world's leading wafer manufacturers continue to select Mattson based on our RTP systems' ability to meet their stringent production requirements for the volume manufacturing of silicon and SOI wafers," said Andreas B. Toennis, senior vice president and general manager of Mattson Technology's Thermal Products Group. "These latest orders validate our RTP tools as the most reliable and cost-effective systems for the cost-conscious wafer manufacturing industry and reinforce our leadership position in the wafer manufacturing segment. We look forward to continuing to support our customers with advanced RTP technologies as they move to the next-generation of wafer manufacturing and beyond." In 2007 and 2008, the semiconductor wafer market is expected to maintain robust growth, especially driven by 300 mm wafer demand, according to Gartner Dataquest, a market research firm. The firm forecasts demand for silicon wafers to grow 9.7 percent in 2007, with total consumption expected to be 9,055 millions of square inches (MSI), and growing 8.2% with 11,890 MSI in 2011.* * Gartner, Inc., "Forecast: Silicon Wafer Market Outlook (4Q07 Update)" by Takashi Ogawa, October 12, 2007 About Mattson RTP Systems Mattson's RTP systems feature dual-sided, lamp-based heating technology that provides enhanced control, process uniformity and repeatability for both 200 and 300 mm production, providing chipmakers excellent processing performance, high productivity and superior cost-of-ownership. Mattson's RTP product line includes the 2900, a robust workhorse for 200 mm applications, the 3000 series for 200 and 300 mm fabrication and the Helios RTP system for advanced 300 mm applications, including nickel silicide formation and ultra-shallow junction spike anneals. About Mattson Technology, Inc. Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: http://www.mattson.com/. Mattson Technology Contact Lauren Vu tel +1-510-492-6518 fax +1-510-492-2800 DATASOURCE: Mattson Technology, Inc. CONTACT: Lauren Vu of Mattson Technology, Inc., +1-510-492-6518, fax, +1-510-492-2800, Web site: http://www.mattson.com/

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