Aehr Test Systems to Exhibit at the 2018 International Wafer-Level Packaging Conference in San Jose, CA Oct 23 - 25
October 23 2018 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and burn-in equipment, today
announced that it will be featuring its FOX-XPTM next generation
multi-wafer test and burn-in systems for high volume production and
early failure rate (EFR) test in booth 51 at the 15th Annual
International Wafer-Level Packaging Conference (IWLPC) taking place
October 23 – 25 in San Jose, California at the DoubleTree by Hilton
Hotel San Jose.
IWLPC brings together some of the semiconductor industry's most
respected authorities addressing all aspects of wafer-level, 3D,
TSV, and MEMS device packaging and manufacturing. Interconnecting
Wafer-Level Packaging, 3D Packaging, and Advanced Manufacturing and
Test, the International Wafer-Level Packaging Conference is at the
forefront of the packaging technology evolution. The Wafer-Level
Packaging (WLP) track features sessions on package reliability,
integration technology, wafer-level fan-out process and metrology,
and panel-level fan-out packaging. The Advanced Manufacturing track
features sessions on inspection & test, new methods &
materials, and process and technology.
Aehr Test President and CEO Gayn Erickson commented, “Aehr Test
supplies complete test and burn-in solutions for reliability
screening and production of WLP devices to ensure that the devices
meet their reliability targets, which is the core of this
conference. As more new product designs challenge traditional test
and reliability screening methodologies, Aehr’s wafer-level and
singulated die/module production test and burn-in capabilities
offer a cost-effective solution for high volume
production. Reliability-critical applications include
automotive vehicle control and sensor systems, sensors and security
devices in mobile smartphones and tablets, and an entire new need
for reliability and assurance of operation in wearable
biosensors.”
The solution Aehr Test will feature at its IWLPC exhibit booth
is the FOX-XP system, the company’s next-generation multi-wafer and
now singulated die/module test solution. The FOX-XP system is
capable of functional test and burn-in/cycling of WLP products
including flash memories, microcontrollers, sensors, and other
leading-edge ICs in wafer or multi-die panel form. The FOX
wafer-level systems utilize Aehr Test's FOX WaferPakTM Contactors,
which provide cost-effective solutions for making electrical
contact with a full wafer or substrate in a multi-wafer or
multi-panel environment. The latest configuration with DiePak®
Carriers also enables burn-in of singulated WLP die and multi-die
modules to screen for defects in both the die and the WLP assembly
process. The resulting known-good die, multi-die or stacked-die
packaged parts can then be used for high reliability and quality
applications such as enterprise solid state drives, automotive
devices, highly valuable mobile applications, and mission critical
integrated circuits and sensors.
The key feature of the FOX-XP test cell that contributes to its
cost-effectiveness is the ability to provide up to 2,048 “Universal
Channels” per wafer or DiePak carrier, enabling the system to test
all the devices on the wafer or DiePak Carrier in parallel. The
innovative “Universal Channel” architecture allows any channel to
perform any function (I/O, Device Power Supply (DPS) or Per-pin
Precision Measurement Unit (PPMU)). This enhanced architecture
allows customers to perform per pin parametric testing, more
extensive digital pattern test with deeper data stimulus / capture
memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT
testing.
A single FOX-XP test system may be configured with up to 18
slots of test resources enabling up to 18 WaferPak Contactors or
DiePak Carriers to be tested simultaneously. The FOX-XP system also
offers per slot high performance thermal chucks to manage the
temperature of the high power density devices under test. The
footprint of an 18-slot FOX-XP system is similar to the footprint
of typical semiconductor Automatic Test Equipment (ATE) that can
only test one wafer at a time.
With the highest wafer throughput available in the ATE industry,
the flexibility of Aehr Test’s new “Universal Channel”
architecture, and the ability to perform both functional pattern
verification and parametric testing at full-wafer parallel test,
the FOX-XP system provides a highly differentiated solution for
reliability qualifications and production burn-in of WLP devices to
ensure the production of highly reliable devices.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has over 2,500 systems installed worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTSTM and FOX-PTM
families of test and burn-in systems and FOX WaferPakTM Aligner,
FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak
Loader. The ABTS system is used in production and qualification
testing of packaged parts for both lower power and higher power
logic devices as well as all common types of memory devices. The
FOX-XP system is a full wafer contact and singulated die/module
test and burn-in system used for burn-in and functional test of
complex devices, such as leading-edge memories, digital signal
processors, microprocessors, microcontrollers, systems-on-a-chip,
and integrated optical devices. The WaferPak contactor contains a
unique full wafer probe card capable of testing wafers up to 300mm
that enables IC manufacturers to perform test and burn-in of full
wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable,
temporary package that enables IC manufacturers to perform
cost-effective final test and burn-in of both bare die and modules.
For more information, please visit Aehr Test Systems’ website at
www.aehr.com.
Contacts:Aehr Test
Systems
Carl Buck
V.P of Marketing
(510) 623-9400
x381
cbuck@aehr.com
MKR Group Inc.Todd Kehrli or
Jim ByersAnalyst/Investor Contact(323)
468-2300aehr@mkr-group.com
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